16 Other Function Telecom Interface ICs 595

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LUCL7581BAE	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	110 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		2.67 mm	7.5 mm	Not Qualified	e0	30	240	10.3 mm
HCPL-810J-500E	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-G16	1	3.632 mm	7.493 mm	Not Qualified	e3		260	10.312 mm
LUCL7582BAE	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	110 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e0	30	225	10.3 mm
LG1602AXB	Broadcom	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LQFP	SQUARE	METAL	YES	1		-5.2 V				FLATPACK, LOW PROFILE			.762 mm	75 Cel	0 Cel	TIN LEAD	QUAD	S-MQFP-G16		1.6256 mm	5.842 mm	Not Qualified	e0	30	240	5.842 mm
KA8501AN	Samsung		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		8 mA		3.9/12.2,2.5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-45 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16				Not Qualified	e0
KA8500AN	Samsung		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-45 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16				Not Qualified	e0
KS3361BD	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G16		1.95 mm	3.95 mm	Not Qualified				9.9 mm
KA3361	Samsung	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				4 V		IN-LINE			2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDIP-T16		5.08 mm	7.62 mm	Not Qualified	e0			19.4 mm
KA8502BN	Samsung		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-45 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16				Not Qualified	e0
KA8501BN	Samsung		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		8 mA		3.9/12.2,2.5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-45 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16				Not Qualified	e0
KA8502AN	Samsung		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-45 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16				Not Qualified	e0
KA3361B	Samsung	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				4 V		IN-LINE			2.54 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDIP-T16		5.08 mm	7.62 mm	Not Qualified	e0			19.4 mm
KT8583J	Samsung	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	CMOS	-5 V		5 V		IN-LINE			2.54 mm	75 Cel	-25 Cel		DUAL	R-GDIP-T16		5.08 mm	7.62 mm	Not Qualified				19.495 mm
KA8500BN	Samsung		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-45 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16				Not Qualified	e0
KT8583	Samsung	TELECOM CIRCUIT		THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1						IN-LINE			2.54 mm				DUAL	R-GDIP-T16		5.08 mm	7.62 mm	Not Qualified				19.495 mm
KA3361BD	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.8 mm	3.95 mm	Not Qualified	e0			9.9 mm
S1T8531X01-S0B0	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		.007 mA	3.6 V	3.6	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	70 Cel	-10 Cel		DUAL	R-PDSO-G16		1.95 mm	3.95 mm	Not Qualified				9.9 mm
KA3361D	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G16		1.95 mm	3.95 mm	Not Qualified				9.8 mm
KA8504N	Samsung		INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO						2/7.6	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16				Not Qualified	e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.