16 Other Function Telecom Interface ICs 595

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX2181ETE+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				10 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	1	.8 mm		3 mm		e3	30	260	3 mm
MAX1479ATE	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.018 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N16	1	.8 mm		3 mm	Not Qualified	e0			3 mm
MAX7057ASE+T	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.7 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.75 mm		3.9 mm		e3	30	260	9.9 mm
MAX2430CSE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G16		1.75 mm		3.9 mm	Not Qualified	e0			9.9 mm
MAX1479ATE-T	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0181 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N16	1	.8 mm		3 mm	Not Qualified	e0			3 mm
MAX9152EUE-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.1 mm		4.4 mm	Not Qualified	e0			5 mm
MAX7057ASE+	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0237 mA	2.7 V	2.7	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.75 mm		3.9 mm	Not Qualified	e3	30	260	9.9 mm
TA31133FN-TP1	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.6 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G16		1.6 mm		4.4 mm	Not Qualified				5 mm
TA31133FN-TP2	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.6 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G16		1.6 mm		4.4 mm	Not Qualified				5 mm
TA31081F(ER)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			6.2 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel	TIN LEAD	DUAL		R-PDSO-G16		1.9 mm		4.6 mm	Not Qualified	e0			8.2 mm
TA1372FNG	Toshiba		COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		51 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-20 Cel		DUAL		R-PDSO-G16					Not Qualified
TA31133FN(EL)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.6 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G16		1.6 mm		4.4 mm	Not Qualified				5 mm
TA31081F-TP1	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			6.2 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm		4.6 mm	Not Qualified				8.2 mm
TA8104F	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1 mA	1.4 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm		4.6 mm	Not Qualified				8.2 mm
TA31133FN(ER)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.6 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G16		1.6 mm		4.4 mm	Not Qualified				5 mm
TA8104F-TP1	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1 mA	1.4 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm		4.6 mm	Not Qualified				8.2 mm
TA31133FN	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.6 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL		R-PDSO-G16		1.6 mm		4.4 mm	Not Qualified	e0			5 mm
TA31081F-TP2	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			6.2 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm		4.6 mm	Not Qualified				8.2 mm
TA31052P	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				3 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T16		4.45 mm		7.62 mm	Not Qualified				19.25 mm
TA31081F	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			6.2 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel	TIN LEAD	DUAL		R-PDSO-G16		1.9 mm		4.6 mm	Not Qualified	e0			8.2 mm
TA31081F(EL)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			6.2 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm		4.6 mm	Not Qualified				8.2 mm
TA31081P	Toshiba	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			6.2 mA	5 V		IN-LINE			2.54 mm	85 Cel	-35 Cel		DUAL		R-PDIP-T16		4.45 mm		7.62 mm	Not Qualified				19.25 mm
TA8104F-TP2	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1 mA	1.4 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm		4.6 mm	Not Qualified				8.2 mm
TA32032F	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL		R-PDSO-G16		1.9 mm		4.6 mm	Not Qualified	e0			8.2 mm
CD22414D	Renesas Electronics		MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC	NO		CMOS					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T16			T-1(DS1)		Not Qualified	e0
ISL32175EIBZ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		SMALL OUTLINE	sop16,.24		1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	80 Mbps	R-PDSO-G16		1.75 mm		3.9 mm		e3			9.9 mm
UPC8220T5A-E1	Renesas Electronics	TELECOM CIRCUIT	OTHER	GULL WING	16	HVSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V		SMALL OUTLINE			.4 mm	70 Cel	-30 Cel	TIN LEAD	DUAL		R-PDSO-G16		.6 mm		2.3 mm	Not Qualified	e0			3.3 mm
ISL5571AIB-T	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIMOS			5 V	5,-48	SMALL OUTLINE	SOP16,.4	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16	4	2.65 mm		7.5 mm	Not Qualified	e0			10.3 mm
ISL36111DRZ-T7	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V	1.2	CHIP CARRIER	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm		3 mm	Not Qualified	e3	30	260	3 mm
QLX111RIQT7	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V	1.2	CHIP CARRIER	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm		3 mm	Not Qualified	e3	30	260	3 mm
QHX220IQSR	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQCC-N16	1	1 mm		3 mm	Not Qualified	e3	30	260	3 mm
CD22413F	Renesas Electronics		MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC	NO		CMOS					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T16			T-1(DS1)		Not Qualified	e0
ICL3221EMVZ-T	Renesas Electronics	TELECOM CIRCUIT	MILITARY	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.2 mm		4.4 mm	Not Qualified	e3	30	260	5 mm
ISL32175EIVZ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SOP16,.25		.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	80 Mbps	R-PDSO-G16		1.2 mm		4.4 mm		e3			5 mm
ISL32175EFVZ	Renesas Electronics	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SOP16,.25		.65 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	80 Mbps	R-PDSO-G16		1.2 mm		4.4 mm		e3			5 mm
UPG2253T6S-E2-A	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	GAAS		.12 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-45 Cel		QUAD		S-PQCC-N16		.85 mm		3 mm	Not Qualified				3 mm
ISL32175EIVZ-T	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	2	1.2 mm		4.4 mm	Not Qualified	e3	30	260	5 mm
ISL36111DRZ-TS	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V	1.2	CHIP CARRIER	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm		3 mm	Not Qualified	e3	30	260	3 mm
ISL32273EIBZ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	3	1.75 mm		3.9 mm		e3	30	260	9.9 mm
ISL35111DRZ-TS	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm		3 mm	Not Qualified	e3	30	260	3 mm
ISL5571AIBZ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIMOS			5 V	5,-48	SMALL OUTLINE	SOP16,.4	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G16	3	2.65 mm		7.5 mm	Not Qualified	e3	30	260	10.3 mm
ISL32175EFBZ	Renesas Electronics	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		SMALL OUTLINE	sop16,.24		1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	80 Mbps	R-PDSO-G16		1.75 mm		3.9 mm		e3			9.9 mm
ISL32273EIBZ-T	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	3	1.75 mm		3.9 mm		e3	30	260	9.9 mm
CD22414F	Renesas Electronics		MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC	NO		CMOS					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T16			T-1(DS1)		Not Qualified	e0
UPG182GR-E1	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HTSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		-2 V		5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N16		1.1 mm		5.2 mm					5.5 mm
ISL35111DRZ-T7	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm		3 mm	Not Qualified	e3	30	260	3 mm
CD22413E	Renesas Electronics		INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T16			T-1(DS1)		Not Qualified	e0
UPD5715GR-E1-A	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL		R-PDSO-G16		1.1 mm		5.2 mm	Not Qualified	e6			5.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.