16 Other Function Telecom Interface ICs 595

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
935263011118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10.3 mm
NE571F	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1				4.8 mA	6 V		IN-LINE				70 Cel	0 Cel		DUAL	R-GDIP-T16				Not Qualified
TEA1083AT	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		0 V	.004 mA	3.6 V	3.6	SMALL OUTLINE	SOP16,.4	Telecom Signaling Circuits	1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				10.3 mm
935297767115	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1X.14,20		.5 mm	85 Cel	-40 Cel		QUAD	R-PQCC-N16		1 mm	2.5 mm					3.5 mm
935297767135	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1X.14,20		.5 mm	85 Cel	-40 Cel		QUAD	R-PQCC-N16		1 mm	2.5 mm					3.5 mm
MC13055P	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	YES	1							IN-LINE	DIP16,.3		2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T16		4.4 mm	7.62 mm					19.175 mm
MC13055D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm					9.9 mm
MC13155D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE	sop16,.24		1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	4.9 mm					9.9 mm
MC33111D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm					9.9 mm
S0280	Infineon Technologies		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			35 mA	14 V	14	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	85 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16				Not Qualified	e0
PMB2200T-16	Infineon Technologies		OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES					48 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Other Telecom ICs	1.27 mm	70 Cel	-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G16				Not Qualified	e0
BGT24LTR11N16	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	16	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBCC-B16	1	.77 mm	2.4 mm					2.4 mm
S980C5	Infineon Technologies	TELECOM CIRCUIT		GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR				5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.635 mm			Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G16				Not Qualified	e0
BGA735N16	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	16	VQCCN	SQUARE	UNSPECIFIED	YES	1					2.8 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-XQCC-N16	1	.4 mm	2.3 mm	Not Qualified				2.3 mm
BGA735N16E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-XQCC-N16	1	.4 mm	2.3 mm		e3			2.3 mm
BGT24LTR11N16E6327	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	16	VBCC	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBCC-B16		.77 mm	2.4 mm					2.4 mm
FOA1151A1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR			57 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G16				Not Qualified	e0
BGA771N16	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N16		.625 mm	2.3 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
SP000524278	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm					5 mm
TDK5111XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.0195 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
TDK5101XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
TDK5100XT	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm					5 mm
TDK5110XT	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm					5 mm
TDK5111	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.0195 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified			260	5 mm
TDK5110	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.019 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified	e3		260	5 mm
TDK5101	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.0095 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified			260	5 mm
TDK5111XT	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm					5 mm
SP000013532	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm					5 mm
TDK5100	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.0095 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified	e3		260	5 mm
TDA5101XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
TDA7110	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm				260	5 mm
TDA5102XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
TDA5111	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR				3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified				5 mm
BGS14AN16	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	16	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1					3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		BOTTOM	S-PBCC-B16	1	.77 mm	2.3 mm					2.3 mm
BGS14AN16E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	16	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1					3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	BOTTOM	S-PBCC-B16	1	.77 mm	2.3 mm		e3			2.3 mm
TDA5102XT	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm					5 mm
TDA5100XT	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
TDA7110XT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm					5 mm
TDA5100	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.008 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-25 Cel	TIN	DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified	e3		260	5 mm
TDA5101	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR				3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified			260	5 mm
TDA5110	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR				3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified				5 mm
TDA5100XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
TDA5102	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.0095 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified			260	5 mm
ZABG4002JA16TC	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N16	1	.65 mm	3 mm	Not Qualified	e4	30	260	3 mm
PT8A978BP	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO						4 V	4	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL	R-PDIP-T16				Not Qualified
PT8A9792W	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS				3 V	3	SMALL OUTLINE	SOP16(UNSPEC)	Other Telecom ICs		55 Cel	-10 Cel		DUAL	R-PDSO-G16				Not Qualified
PI3USBH22ZLEX	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16		.8 mm	2.5 mm					2.5 mm
PI5USB8000QZHEX	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16		.8 mm	3 mm					3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.