16 Other Function Telecom Interface ICs 595

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PI3USBH22ZLE	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16		.8 mm	2.5 mm					2.5 mm
PT8A9792P	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			3 V	3	IN-LINE	DIP16(UNSPEC)	Other Telecom ICs		55 Cel	-10 Cel		DUAL	R-PDIP-T16				Not Qualified
PI5USB8000QZHE	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16		.8 mm	3 mm					3 mm
MAX3774CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3772CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX3770CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	70 Cel	0 Cel		DUAL	R-PDSO-G16		1.73 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4.89 mm
MAX3265CUE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
MAX3264CUE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
MAX3750CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.084 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3774CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.164 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3268C/D	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	DIE	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP				70 Cel	0 Cel	TIN LEAD	UPPER	R-XUUC-N16	1			Not Qualified	e0
MAX3264CUE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
MAX3773CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX3804ETE#TG16	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified				3 mm
MAX3269C/D	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	DIE	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP				70 Cel	0 Cel	TIN LEAD	UPPER	R-XUUC-N16	1			Not Qualified	e0
MAX3773CEE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
DS8102+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
MAX3775CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3265EUE	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0	20	240	5 mm
MAX3770CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.112 mA	3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.73 mm	3.9 mm	Not Qualified	e0			4.89 mm
DS6112	Maxim Integrated			THROUGH-HOLE	16	DIP	RECTANGULAR		NO							IN-LINE	DIP16/20(UNSPEC)	Other Telecom ICs				Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T16				Not Qualified	e0
MAX3774CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3			4.89 mm
MAX3265CUE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
MAX3274UGE-T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N16	1	1 mm	4 mm	Not Qualified	e0			4 mm
MAX3751CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.078 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3774CEE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3			4.89 mm
MAX3265EUE+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
MAX3750CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.084 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3772CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3751CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e3			4.89 mm
MAX3265CUE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
MAX3772CEE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX3264CUE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
MAX3773CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3274UGE	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		.099 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	ATM/SONET/SDH ICs	.65 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N16	1	1 mm	4 mm	Not Qualified	e0			4 mm
MAX3804ETE-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			3.3 V	1.8/3.3,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified	e0		245	3 mm
MAX3265EUE+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
MAX3751CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.078 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3775CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.164 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX3265EUE-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
MAX3775CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.164 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3773CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3265CUE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
MAX3804ETE#G16	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified		30	260	3 mm
MAX3775CEE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel		DUAL	R-PDSO-G16		1.65 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4.89 mm
MAX3772CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3804ETE	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			3.3 V	1.8/3.3,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N16		.8 mm	3 mm	Not Qualified	e0	20	240	3 mm
MAX3264CUE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.