16 Other Function Telecom Interface ICs 595

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LA72914V-MPB-H	Onsemi		COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		.04 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-20 Cel	TIN BISMUTH	DUAL	R-PDSO-G16	3					Not Qualified	e6	30	260
NCV7425DW0G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G16		2.65 mm			7.5 mm		e3			10.3 mm
NCV7425DW0R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G16	2	2.65 mm			7.5 mm		e3		260	10.3 mm
NCV7425DW5G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G16		2.65 mm			7.5 mm		e3			10.3 mm
LA72910V-MPB-H	Onsemi		OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES					5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL	R-PDSO-G16	3					Not Qualified	e6	30	260
STHVDAC-253MTGF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	S-PBGA-B16		.64 mm			1.7 mm			NOT SPECIFIED	NOT SPECIFIED	1.7 mm
STMPE610QTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N16	1	1 mm			3 mm	Not Qualified	e3	30	260	3 mm
CRX14-MQ	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-20 Cel		DUAL	R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified				9.9 mm
EFB7332P	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS		30 mA	5 V	5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL	R-PDIP-T16			T-1(DS1)	CEPT PCM-30/E-1		Not Qualified
STHVDAC-253MF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	16	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B16		.655 mm			1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.7 mm
CRX14-MQP/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		20 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	3					Not Qualified	e4	30	260
SPBT2632C2A.AT2	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16		RECTANGULAR	UNSPECIFIED	YES	1				2.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	NICKEL GOLD	UNSPECIFIED	R-XXMA-N16	3				11.6 mm		e4		245	13.5 mm
CR14-MQP/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-20 Cel		DUAL	R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified				9.9 mm
EFB7332C	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC	NO		MOS		30 mA	5 V	5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL	R-XDIP-T16			T-1(DS1)	CEPT PCM-30/E-1		Not Qualified
LB1004AC	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		1.9 mA		TIP-RING VOLTAGE	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-20 Cel		DUAL	R-PDIP-T16						Not Qualified
CRX14-MQP/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-20 Cel		DUAL	R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified				9.9 mm
CR14-MQP/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.02 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-20 Cel		DUAL	R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified				9.9 mm
CR14-MQ/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.02 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-20 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified	e0			9.9 mm
PBL3726/8	STMicroelectronics		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		100 mA		3.5/9	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16						Not Qualified	e0
LS356B1	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16						Not Qualified	e0
LS356B	STMicroelectronics		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	50 Cel	-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16						Not Qualified	e0
CRX14-MQP	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	3	1.75 mm			3.9 mm	Not Qualified	e4			9.9 mm
LS288B	STMicroelectronics		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO							IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-45 Cel		DUAL	R-PDIP-T16						Not Qualified
LS156B	STMicroelectronics		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-45 Cel		DUAL	R-PDIP-T16						Not Qualified
LS588N1	STMicroelectronics		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		150 mA			IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-45 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16						Not Qualified	e0
CRX14-MQ/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-20 Cel		DUAL	R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified				9.9 mm
EF73321P	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS		40 mA	5 V	5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16			T-1(DS1)	CEPT PCM-30/E-1		Not Qualified	e0
LS656B	STMicroelectronics		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		2 mA	2.5 V	2.5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-45 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16						Not Qualified	e0
CR14-MQ/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-20 Cel		DUAL	R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified				9.9 mm
EF73321C	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC	NO		MOS		40 mA	5 V	5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T16			T-1(DS1)	CEPT PCM-30/E-1		Not Qualified	e0
TZA3044T/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified				9.9 mm
TEA1083A	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	0 V	.004 mA	3.6 V	3.6	IN-LINE	DIP16,.3	Telecom Signaling Circuits	2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T16		4.7 mm			7.62 mm	Not Qualified				21.6 mm
BTS6201UJ	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N16	1	1 mm			3 mm				260	3 mm
TZA3044BTT/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.1 mm			4.4 mm	Not Qualified				5 mm
NE5900N	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		4 mA	5 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL	R-PDIP-T16		4.2 mm			7.62 mm	Not Qualified				19.025 mm
NE5224D	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified				9.9 mm
TFF1024HN/N1,135	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1X.14,20		.5 mm	85 Cel	-40 Cel		QUAD	R-PQCC-N16	1	1 mm			2.5 mm				260	3.5 mm
TZA3044TT-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE				85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16						Not Qualified	e4
935263530118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.1 mm			4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
SA5224D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified				9.9 mm
PCD3316T/2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		2.65 mm			7.5 mm	Not Qualified	e0			10.3 mm
NE5900D-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			4 mA	5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G16		2.65 mm			7.5 mm	Not Qualified				10.3 mm
NE5224D-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified				9.9 mm
UJA1023T/2R04	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified				9.9 mm
SA571F	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1			4.8 mA	6 V		IN-LINE				85 Cel	-40 Cel		DUAL	R-GDIP-T16						Not Qualified
NE5225D	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE				70 Cel	0 Cel		DUAL	R-PDSO-G16						Not Qualified
TZA3044BT	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	ECL		.049 mA	3.3 V	3.3	SMALL OUTLINE	SOP16,.25	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16						Not Qualified	e4
PCF5077T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.5 mm			4.4 mm	Not Qualified				5.2 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.