2 Other Function Telecom Interface ICs 34

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

HTSH5601ETK,118

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

LCC2(UNSPEC)

Other Telecom ICs

85 Cel

-25 Cel

DUAL

R-PDSO-N2

1

Not Qualified

30

260

LXMS31ACNA-010

Murata Manufacturing

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

QCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

CHIP CARRIER

85 Cel

-40 Cel

BOTTOM

R-PBCC-N2

.7 mm

1.6 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3.2 mm

ATA5577M3330C-DDB

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

2

DIE

RECTANGULAR

UNSPECIFIED

1

UNCASED CHIP

DIE OR CHIP

.524 mm

85 Cel

-40 Cel

UPPER

R-XUUC-N2

.162 mm

1 mm

1.35 mm

HTSH4801ETK,118

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

LCC2(UNSPEC)

Other Telecom ICs

85 Cel

-25 Cel

DUAL

R-PDSO-N2

1

Not Qualified

30

260

LXMS31ACNA-012

Murata Manufacturing

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

QCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

CHIP CARRIER

85 Cel

-40 Cel

BOTTOM

R-PBCC-N2

.7 mm

1.6 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3.2 mm

SL3S1203AC0

NXP Semiconductors

TELECOM CIRCUIT

OTHER

UNSPECIFIED

2

UNSPECIFIED

PLASTIC/EPOXY

NO

1

CMOS

1.8 V

SPECIAL SHAPE

70 Cel

-40 Cel

UNSPECIFIED

X-PXSS-X2

SL3S1202AC2

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-PUUC-N2

Not Qualified

SL3S1202AC0

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-PUUC-N2

Not Qualified

SL3S1203AC2

NXP Semiconductors

TELECOM CIRCUIT

OTHER

UNSPECIFIED

2

UNSPECIFIED

PLASTIC/EPOXY

NO

1

CMOS

1.8 V

SPECIAL SHAPE

70 Cel

-40 Cel

UNSPECIFIED

X-PXSS-X2

SL3S1002AC0

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-PUUC-N2

Not Qualified

SL3S1002AC2

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-PUUC-N2

Not Qualified

HTMS1001FTK/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N2

1 mm

2 mm

Not Qualified

3 mm

HTSH4801ETK

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

85 Cel

-25 Cel

DUAL

R-PDSO-N2

1

HTSH5601ETK

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

85 Cel

-25 Cel

DUAL

R-PDSO-N2

1

HTMS1101FTK/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N2

1 mm

2 mm

Not Qualified

3 mm

HTMS8301FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

BUTT

2

RECTANGULAR

PLASTIC/EPOXY

YES

CHIP CARRIER

BOTTOM

R-PBCC-B2

Not Qualified

HTMS1201FTK/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N2

1 mm

2 mm

Not Qualified

3 mm

HTSMOH4801EV

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-PUUC-N2

NOT APPLICABLE

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

HTMS1101FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N2

Not Qualified

HTSMOH5601EV

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-PUUC-N2

NOT APPLICABLE

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

HT2MOA2S20/E/3

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-PUUC-N2

HTMS8301FTK/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC2(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N2

1 mm

2 mm

Not Qualified

3 mm

HTMS8101FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N2

Not Qualified

HTMS1301FTK/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC2(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N2

1 mm

2 mm

Not Qualified

3 mm

HTMS8001FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N2

Not Qualified

HTSFCH4801EV/DH

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

METAL

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-MUUC-N2

Not Qualified

HTMS1201FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N2

Not Qualified

HTMS1301FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

BUTT

2

RECTANGULAR

PLASTIC/EPOXY

YES

CHIP CARRIER

BOTTOM

R-PBCC-B2

Not Qualified

HT2DC20S20/F

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.5 V

UNCASED CHIP

MODULE(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

UPPER

R-PUUC-N2

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

HTMS1001FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N2

Not Qualified

HTMS8201FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N2

Not Qualified

HT1MOA2S30/E/3

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.5 V

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-PUUC-N

HTSFCH5601EV/DH

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

METAL

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-MUUC-N2

Not Qualified

SL2S2002FA8

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

2

RECTANGULAR

PLASTIC/EPOXY

NO

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-PXMA-X2

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.