25 Other Function Telecom Interface ICs 31

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

LMV1099TLX/NOPB

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-XBGA-B25

1

.675 mm

2.64 mm

e1

30

260

2.764 mm

TPS657201YFFR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B25

1

.625 mm

2.086 mm

e1

30

260

2.086 mm

TPS65720YFFR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B25

1

.625 mm

2.3 mm

Not Qualified

e1

NOT SPECIFIED

260

2.3 mm

TPS657202YFFR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B25

1

.625 mm

2.086 mm

e1

30

260

2.086 mm

TPS657201YFFT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B25

1

.625 mm

2.086 mm

e1

30

260

2.086 mm

TPS65720YFFT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B25

1

.625 mm

2.3 mm

Not Qualified

e1

NOT SPECIFIED

260

2.3 mm

TPS657202YFFT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B25

1

.625 mm

2.086 mm

e1

30

260

2.086 mm

TCA8418YFPR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

Not Qualified

LMV1099TLX

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B25

.675 mm

2.644 mm

Not Qualified

2.771 mm

LMV1099TL

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B25

.675 mm

2.644 mm

Not Qualified

2.771 mm

LMV1099TL/NOPB

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-XBGA-B25

1

.675 mm

2.64 mm

e1

30

260

2.764 mm

ADP5589ACBZ-01-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.56 mm

1.99 mm

e1

30

260

1.99 mm

ADP5589ACBZ-02-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.56 mm

1.99 mm

e1

30

260

1.99 mm

ADP5589ACBZ-00-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.56 mm

1.99 mm

e1

30

260

1.99 mm

MAX7365EWA76+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.69 mm

2.065 mm

NOT SPECIFIED

NOT SPECIFIED

2.065 mm

MAX7365EWA74+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.69 mm

2.065 mm

NOT SPECIFIED

NOT SPECIFIED

2.065 mm

MAX7365EWA70+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

S-PBGA-B25

1

.69 mm

2.065 mm

e2

30

260

2.065 mm

MAX7365EWA70+T

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

S-PBGA-B25

1

.69 mm

2.065 mm

e2

30

260

2.065 mm

MAX7365EWA72+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.69 mm

2.065 mm

NOT SPECIFIED

NOT SPECIFIED

2.065 mm

FSA9480UCX

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.625 mm

2.1 mm

2.1 mm

SPZB32W1A14

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

25

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N25

3.7 mm

16.4 mm

26.5 mm

SPZB32W1C14

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

25

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N25

3.7 mm

16.4 mm

26.5 mm

SPWF01SC.21

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

25

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.524 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N25

2.45 mm

15.24 mm

NOT SPECIFIED

NOT SPECIFIED

26.924 mm

SPWF01SC.11

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

25

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.524 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N25

2.45 mm

15.24 mm

NOT SPECIFIED

NOT SPECIFIED

26.924 mm

SPWF01SA.21

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

25

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.524 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N25

2.45 mm

15.24 mm

NOT SPECIFIED

NOT SPECIFIED

26.924 mm

SPWF01SA.11

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

25

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.524 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N25

2.45 mm

15.24 mm

NOT SPECIFIED

NOT SPECIFIED

26.924 mm

ST60A2G0C1C7GYO

STMicroelectronics

TELECOM CIRCUIT

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.45 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

.4 mm

105 Cel

-40 Cel

BOTTOM

100 Mbps

S-PBGA-B25

.9 mm

2.2 mm

also operates with 1.8v supply

NOT SPECIFIED

NOT SPECIFIED

2.2 mm

DS1852B-000

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

100 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e0

5 mm

DS1852B-000+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

100 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e3

5 mm

DS1852B-000/T&R

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

100 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e0

5 mm

DS1852B-000+T&R

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

100 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e3

5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.