256 Other Function Telecom Interface ICs 23

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BCM5389KFBG	Broadcom	TELECOM CIRCUIT		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V		GRID ARRAY							BOTTOM	S-PBGA-B256						NOT SPECIFIED	NOT SPECIFIED
AD6652BBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3		17 mm	Not Qualified	e1		260	17 mm
AD6652BBC	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	S-PBGA-B256	3		17 mm	Not Qualified	e0		240	17 mm
AD6652XBC	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM	S-PBGA-B256	3		17 mm	Not Qualified	e0			17 mm
CYV15G0204TRB-BGXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
CYV15G0104TRB-BGXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
CYV15G0203TB-BGXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
DS31256+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	MATTE TIN	BOTTOM	S-PBGA-B256	3	2.54 mm	27 mm	Not Qualified	e3			27 mm
DS31256	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	2.54 mm	27 mm	Not Qualified	e0			27 mm
DS31404GN+	Maxim Integrated		INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES			1.8 V	1.8	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B256	3			Not Qualified		30	260
DS31256B	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.54 mm	27 mm	Not Qualified	e0			27 mm
DS3131	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.34 mm	27 mm	Not Qualified	e0			27 mm
BCM1101	Broadcom	TELECOM CIRCUIT		BALL	256	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY							BOTTOM	X-PBGA-B256				Not Qualified
BCM5820	Broadcom	TELECOM CIRCUIT		BALL	256	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		GRID ARRAY							BOTTOM	X-PBGA-B256				Not Qualified
BCM1113R	Broadcom	TELECOM CIRCUIT		BALL	256	BGA		PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY							BOTTOM	X-PBGA-B256				Not Qualified
BCM7041	Broadcom	TELECOM CIRCUIT		BALL	256	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY							BOTTOM	X-PBGA-B256				Not Qualified
BCM5389IFB	Broadcom	TELECOM CIRCUIT		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			GRID ARRAY							BOTTOM	S-PBGA-B256
BCM5389	Broadcom	TELECOM CIRCUIT		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY							BOTTOM	S-PBGA-B256				Not Qualified
BCM1112	Broadcom	TELECOM CIRCUIT		BALL	256	BGA		PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY							BOTTOM	X-PBGA-B256	1			Not Qualified
BCM1115R	Broadcom	TELECOM CIRCUIT		BALL	256	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY							BOTTOM	X-PBGA-B256				Not Qualified
BCM1115	Broadcom	TELECOM CIRCUIT		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY							BOTTOM	S-PBGA-B256	1			Not Qualified
BCM1113	Broadcom	TELECOM CIRCUIT		BALL	256	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY							BOTTOM	X-PBGA-B256				Not Qualified
BCM2122	Broadcom	TELECOM CIRCUIT		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		GRID ARRAY							BOTTOM	S-PBGA-B256				Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.