30 Other Function Telecom Interface ICs 41

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BM77SPPS3MC2-0007AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED	.1125 Mbps	R-XXMA-N30		1.86 mm	12 mm			NOT SPECIFIED	NOT SPECIFIED	15 mm
CYBLE-212006-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N30	3	2 mm	15 mm					23 mm
RN4870U-V/RM118	Microchip Technology	TELECOM CIRCUIT		NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N30		1.6 mm	12 mm					15 mm
DNT24C	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N30			24.9 mm			NOT SPECIFIED	NOT SPECIFIED	38.1 mm
DNT24CA	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	30		RECTANGULAR	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-T30			24.9 mm					38.1 mm
BM78SPP05MC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1				1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N30		1.86 mm	12 mm		e4	40	255	15 mm
RN4678U-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949				MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)			70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N30		1.8 mm	12 mm					15 mm
BM70BLE01FC2-0B05BA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3 V		MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N30		1.66 mm	12 mm		e4			15 mm
RC1180-MBUS3	Radiocrafts As	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD		R-XQMA-N30		3.3 mm	12.7 mm					25.4 mm
SPWF04SA	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N30		2.3 mm	15.24 mm			NOT SPECIFIED	NOT SPECIFIED	26.924 mm
LM3290TME/NOPB	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	30	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B30	1	.675 mm			e1	30	260
CYBLE-202007-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N30	3	2 mm	15 mm					23 mm
SE2593A20-R	Skyworks Solutions	TELECOM CIRCUIT	OTHER	BUTT	30	TFLGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.625 mm	85 Cel	0 Cel		BOTTOM		R-PBGA-B30		1.1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
BM70BLE01FC2-0B04AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3 V		MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-N30		.66 mm	12 mm					15 mm
LM3290TMX/NOPB	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	30	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B30	1	.675 mm			e1	30	260
RI-STU-MRD1	Texas Instruments	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	30		RECTANGULAR	UNSPECIFIED	NO	1				5 V		MICROELECTRONIC ASSEMBLY				50 Cel	-20 Cel		DUAL		R-XDMA-T30				Not Qualified
RI-TMS37126	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	30	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-G30				Not Qualified
RI-STU-MRD1-30	Texas Instruments	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	30		RECTANGULAR	UNSPECIFIED	NO	1				5 V		MICROELECTRONIC ASSEMBLY				50 Cel	-20 Cel		DUAL		R-XDMA-T30
HMC981	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	30	QCCN	SQUARE	UNSPECIFIED	YES	1				8 V		CHIP CARRIER				85 Cel	-55 Cel		UPPER		S-XUCC-N30						NOT SPECIFIED	NOT SPECIFIED
LC72720YVS-TLM-E	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	30	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL		R-PDSO-G30	4	1.5 mm	5.6 mm		e6	30	260	9.75 mm
LC72720YVS-MPB-E	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	30	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL		R-PDSO-G30	4	1.5 mm	5.6 mm		e6	30	260	9.75 mm
LC72720YV-TLM-E	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	30	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL		R-PDSO-G30	4	1.5 mm	5.6 mm		e6	30	260	9.75 mm
SPWF04SC	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N30		2.3 mm	15.24 mm			NOT SPECIFIED	NOT SPECIFIED	26.924 mm
CYBLE-202013-11	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N30	3	2 mm	15 mm					23 mm
PI3EQX1002B1ZLEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel		QUAD		R-XQCC-N30		.8 mm	2.5 mm			30	260	4.5 mm
PI3PCIE3242ZLEX	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N30		.8 mm	2.5 mm			30	260	4.5 mm
PI3PCIE3242AZLEX	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N30		.8 mm	2.5 mm					4.5 mm
DS2291	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	SIMM	RECTANGULAR	UNSPECIFIED	NO	1	HYBRID		.05 mA	5 V	5	MICROELECTRONIC ASSEMBLY	SIM30,.2	ATM/SONET/SDH ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	SINGLE		R-XSMA-N30				Not Qualified	e0
DS2249PH	Maxim Integrated	TELECOM CIRCUIT		NO LEAD	30	SIMM	RECTANGULAR	UNSPECIFIED	NO	1				5 V		MICROELECTRONIC ASSEMBLY						TIN LEAD	SINGLE		R-XSMA-N30				Not Qualified	e0
DS2249EU	Maxim Integrated	TELECOM CIRCUIT		NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1				5 V		MICROELECTRONIC ASSEMBLY						TIN LEAD	SINGLE		R-XSMA-N30				Not Qualified	e0
DS2290	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	SIMM	RECTANGULAR	UNSPECIFIED	NO	1	HYBRID		.08 mA	5 V	5	MICROELECTRONIC ASSEMBLY	SIM30,.2	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	SINGLE		R-XSMA-N30				Not Qualified	e0
DS2249	Maxim Integrated	TELECOM CIRCUIT		NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1				5 V		MICROELECTRONIC ASSEMBLY						TIN LEAD	SINGLE		R-XSMA-N30				Not Qualified	e0
DS2291/87-22291-000	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1				5 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel	TIN LEAD	SINGLE		R-XSMA-N30				Not Qualified	e0
TA31135F-TP1	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G30		2.7 mm	7.5 mm	Not Qualified				15.4 mm
TA31135F	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G30		2.7 mm	7.5 mm	Not Qualified				15.4 mm
TA31135F(EL)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G30		2.7 mm	7.5 mm	Not Qualified				15.4 mm
TA31135F(ER)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel	TIN LEAD	DUAL		R-PDSO-G30		2.7 mm	7.5 mm	Not Qualified	e0			15.4 mm
TA31135F-TP2	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G30		2.7 mm	7.5 mm	Not Qualified				15.4 mm
UPC8139GR-7JH	Renesas Electronics		COMMERCIAL EXTENDED	GULL WING	30	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		49 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP30,.25,20	Other Telecom ICs	.5 mm	80 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G30				Not Qualified	e0
HA12190NT	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	30	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5 V		IN-LINE, SHRINK PITCH			1.778 mm	70 Cel	-20 Cel		DUAL		R-PDIP-T30		5.06 mm	10.16 mm	Not Qualified				27.1 mm
AW-CU362	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-30 Cel		UNSPECIFIED	1000 Mbps	R-XXMA-N30		2.65 mm	15 mm					19.615 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.