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| Manufacturer | Diodes Incorporated |
|---|---|
| Manufacturer's Part Number | PI3EQX1002B1ZLEX |
| Description | TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 30; Package Code: HVQCCN; Package Shape: RECTANGULAR; |
| Datasheet | PI3EQX1002B1ZLEX Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
PI3EQX1002B1ZLEXDIDKR-ND PI3EQX1002B1ZLEXDIDKR PI3EQX1002B1ZLEXDICT-ND PI3EQX1002B1ZLEXDITR-ND 31-PI3EQX1002B1ZLEXCT 31-PI3EQX1002B1ZLEXTR PI3EQX1002B1ZLEXDICT PI3EQX1002B1ZLEXDITR 31-PI3EQX1002B1ZLEXDKR |
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .8 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 30 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Length: | 4.5 mm |
| JESD-30 Code: | R-XQCC-N30 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 70 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | HVQCCN |
| Width: | 2.5 mm |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | COMMERCIAL |
