324 Other Function Telecom Interface ICs 13

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BCM8727

Broadcom

TELECOM CIRCUIT

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

BOTTOM

S-PBGA-B324

Not Qualified

VSC8484YJP

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY

1 mm

105 Cel

-40 Cel

BOTTOM

S-PBGA-B324

2.74 mm

18.6 mm

18.6 mm

AD99988BBPZ-4D4AC

Analog Devices

TELECOM CIRCUIT

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, HEAT SINK/SLUG

.8 mm

120 Cel

-40 Cel

BOTTOM

S-PBGA-B324

1.72 mm

15 mm

15 mm

AD9082BBPZ-4D2AC

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, FINE PITCH

BGA324,18X18,32

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

3

1.72 mm

15 mm

IT CAN ALSO OPERATE WITH 1.8 AND 2 V

30

260

15 mm

AD9082BBPZRL-4D2AC

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, FINE PITCH

BGA324,18X18,32

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

3

1.72 mm

15 mm

IT CAN ALSO OPERATE WITH 1.8 AND 2 V

30

260

15 mm

AD9988BBPZRL-4D4AC

Analog Devices

TELECOM CIRCUIT

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, HEAT SINK/SLUG

.8 mm

120 Cel

-40 Cel

BOTTOM

S-PBGA-B324

1.72 mm

15 mm

15 mm

PEF22624E

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

PEF21624E

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

PEF24624E

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

PEF24624EV2.2-G

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

BCM5770

Broadcom

TELECOM CIRCUIT

BALL

324

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B324

1

Not Qualified

BCM5382M

Broadcom

TELECOM CIRCUIT

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY

BOTTOM

S-PBGA-B324

Not Qualified

BCM5770R

Broadcom

TELECOM CIRCUIT

BALL

324

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B324

1

Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.