52 Other Function Telecom Interface ICs 17

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ODIN-W260-05B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N52		3.2 mm	14.8 mm						22.3 mm
ANNA-B112-01B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52		SQUARE	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N52	3	1.25 mm	6.5 mm						6.5 mm
ANNA-B112-00B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52	XMA	SQUARE	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	S-XXMA-N52	3	1.25 mm	6.5 mm						6.5 mm
450-0064	Ls Research	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52		RECTANGULAR	UNSPECIFIED	YES	1			3.6 V		MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N52	4	1.9 mm	13 mm						18 mm
FC20-Q93	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	52	QCCN	RECTANGULAR		YES	1			3.3 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD	433 Mbps	R-XQCC-N52		2.05 mm	13 mm		SEATED HGT NOMINAL				16.6 mm
450-0064R	Ls Research	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52		RECTANGULAR	UNSPECIFIED	YES	1			3.6 V		MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N52	4	1.9 mm	13 mm						18 mm
FC20	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	52	QCCN	RECTANGULAR		YES	1			3.3 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD	433 Mbps	R-XQCC-N52		2.05 mm	13 mm		SEATED HGT NOMINAL				16.6 mm
FC20-Q73	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	52	QCCN	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER	LCC52(UNSPEC)			85 Cel	-40 Cel		QUAD	433 Mbps	R-XQCC-N52		2.1 mm	13 mm		SEATED HEIGHT NOM CONSIDERED				16.6 mm
FC20N-Q73B	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	433 Mbps	R-XXMA-N52		2.1 mm	13 mm		Seated Hgt-Nom				16.6 mm
WFM200SS22XNA2	Silicon Labs	TELECOM CIRCUIT		NO LEAD	52	LGA	SQUARE	UNSPECIFIED	YES	1			1.8 V		GRID ARRAY	LGA52(UNSPEC)		.5 mm	105 Cel	-40 Cel		BOTTOM	72.2 Mbps	S-XLGA-N52	3	1.4 mm	6.5 mm				40	260	6.5 mm
SX041HQ	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	52	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK				70 Cel	0 Cel		QUAD		R-PQFP-G52				Not Qualified
SX041Q	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	52	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK				70 Cel	0 Cel		QUAD		R-PQFP-G52				Not Qualified
AMIS49587C5872RG	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	52	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.08 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC52,.31SQ,20	Modems	.5 mm	80 Cel	-40 Cel		QUAD		S-XQCC-N52		1 mm	8 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	8 mm
AMIS49587C5872G	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	52	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.08 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC52,.31SQ,20	Modems	.5 mm	80 Cel	-40 Cel		QUAD		S-XQCC-N52		1 mm	8 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	8 mm
MK50H27Q33	STMicroelectronics		COMMERCIAL	J BEND	52	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		5 V	5	CHIP CARRIER	LDCC52,.8SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD		S-PQCC-J52				Not Qualified		e3
WN6612LH-L5	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	52		RECTANGULAR	UNSPECIFIED	NO	1	CMOS		3.3 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel		ZIG-ZAG		R-XZMA-N52			26.8 mm				NOT SPECIFIED	NOT SPECIFIED	30 mm
TC35675XBG-001	Toshiba	TELECOM CIRCUIT	OTHER	BALL	52	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B52		1.2 mm	4.5 mm				NOT SPECIFIED	NOT SPECIFIED	4.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.