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| Manufacturer | Silicon Labs |
|---|---|
| Manufacturer's Part Number | WFM200SS22XNA2 |
| Description | TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 52; Package Code: LGA; Package Shape: SQUARE; Package Body Material: UNSPECIFIED; |
| Datasheet | WFM200SS22XNA2 Datasheet |
| In Stock | 59 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: | 336-WFM200SS22XNA2 |
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 1.8 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 1.4 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 52 |
| Package Equivalence Code: | LGA52(UNSPEC) |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Data Rate: | 72.2 Mbps |
| Length: | 6.5 mm |
| JESD-30 Code: | S-XLGA-N52 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 105 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | LGA |
| Width: | 6.5 mm |
| Terminal Pitch: | .5 mm |
| Moisture Sensitivity Level (MSL): | 3 |
