Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Simcom Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
QMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
.0856 Mbps |
S-XQMA-N68 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Simcom Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
QMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.8 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
.375 Mbps |
S-XQMA-N68 |
||||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2 Mbps |
R-XXMA-N68 |
1.9 mm |
10.2 mm |
15 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Simcom Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
QMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
1.119 Mbps |
S-XQMA-N68 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Simcom Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
QMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.8 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
.375 Mbps |
S-XQMA-N68 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Quectel Wireless Solutions |
TELECOM CIRCUIT |
NO LEAD |
68 |
QMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
4 V |
MICROELECTRONIC ASSEMBLY |
75 Cel |
-35 Cel |
QUAD |
.0856 Mbps |
R-XQMA-N68 |
2.1 mm |
16 mm |
18.7 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Simcom Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
QMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
.0856 Mbps |
S-XQMA-N68 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-XQCC-N68 |
.8 mm |
8 mm |
8 mm |
|||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2 Mbps |
R-XXMA-N68 |
1.9 mm |
10.2 mm |
15 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SONET |
YES |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-XQCC-N68 |
.8 mm |
8 mm |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
||||||||||||||||||||||||||||||||||||||
Conexant Systems |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
.1 mA |
5 V |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J68 |
CEPT PCM-30/E-1 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N68 |
1 mm |
10 mm |
10 mm |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N68 |
1 mm |
10 mm |
10 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
FLAT |
68 |
GQFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
2.5 V |
FLATPACK, GUARD RING |
.64 mm |
QUAD |
S-CQFP-F68 |
2.68 mm |
13.97 mm |
NOT SPECIFIED |
NOT SPECIFIED |
13.97 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.85 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-25 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N68 |
3 |
.8 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
2.85 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-25 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-N68 |
3 |
.8 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
Simcom Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
QMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
7.2 Mbps |
S-XQMA-N68 |
Operates with 3.4V TO 4.4V supply |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Simcom Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
QMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.8 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
.066 Mbps |
S-XQMA-N68 |
||||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2 Mbps |
R-XXMA-N68 |
3 |
1.9 mm |
10.2 mm |
250 |
15 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-XQCC-N68 |
.8 mm |
8 mm |
e3 |
8 mm |
||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
68 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG |
75 Cel |
-10 Cel |
QUAD |
S-XQCC-N68 |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-N68 |
1 mm |
10 mm |
10 mm |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
220 mA |
5 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-J68 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
MILITARY |
FLAT |
68 |
DFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
2.6 V |
2.6 |
FLATPACK |
TPAK68,1.6SQ,25 |
Other Telecom ICs |
.65 mm |
125 Cel |
-55 Cel |
QUAD |
2500 Mbps |
S-CQFP-F68 |
2.68 mm |
13.97 mm |
Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
13.97 mm |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
4000 Mbps |
S-PQCC-N68 |
3 |
.9 mm |
10 mm |
1.995 V |
e3 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
MILITARY |
FLAT |
68 |
QFF |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
1 |
MIL-PRF-38535 Class Q |
5 V |
FLATPACK |
.635 mm |
125 Cel |
-55 Cel |
TIN LEAD |
QUAD |
S-GQFP-F68 |
3.912 mm |
12.51 mm |
Not Qualified |
e0 |
12.51 mm |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
MILITARY |
GULL WING |
68 |
QFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
3.3 V |
FLATPACK |
.635 mm |
125 Cel |
-55 Cel |
QUAD |
S-CQFP-G68 |
3.86 mm |
12.51 mm |
Not Qualified |
12.51 mm |
|||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
MILITARY |
FLAT |
68 |
DFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
2.6 V |
FLATPACK |
.65 mm |
125 Cel |
-55 Cel |
QUAD |
S-CQFP-F68 |
2.68 mm |
13.97 mm |
Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
13.97 mm |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.45 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
4000 Mbps |
S-XQCC-N68 |
3 |
1 mm |
10 mm |
1.995 V |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.45 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
4000 Mbps |
S-XQCC-N68 |
3 |
1 mm |
10 mm |
1.995 V |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
MILITARY |
FLAT |
68 |
QFF |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
1 |
MIL-PRF-38535 Class Q |
5 V |
FLATPACK |
.635 mm |
125 Cel |
-55 Cel |
QUAD |
S-GQFP-F68 |
3.912 mm |
12.51 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
12.51 mm |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FLAT |
68 |
GQFF |
SQUARE |
CERAMIC |
YES |
2.6 V |
2.6 |
FLATPACK, GUARD RING |
TPAK68,1.6SQ,25 |
Other Telecom ICs |
.635 mm |
QUAD |
S-XQFP-F68 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
FLAT |
68 |
QFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
MIL-STD-883 |
2.5 V |
FLATPACK |
.64 mm |
QUAD |
S-CQFP-F68 |
2.68 mm |
13.97 mm |
Not Qualified |
13.97 mm |
|||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
MILITARY |
J BEND |
68 |
QCCJ |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
-5.2 V |
.054 mA |
5 V |
5,-5.2 |
CHIP CARRIER |
LDCC68,1.0SQ |
Other Telecom ICs |
1.27 mm |
125 Cel |
-55 Cel |
TIN LEAD |
QUAD |
S-CQCC-J68 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
BIPOLAR |
-5.2 V |
.054 mA |
5 V |
5,-5.2 |
CHIP CARRIER |
LDCC68,1.0SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-CQCC-J68 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
.58 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.4SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N68 |
3 |
.9 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
.58 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.4SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N68 |
.9 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
.58 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.4SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N68 |
3 |
.9 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
.58 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.4SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N68 |
3 |
.9 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-XQCC-N68 |
.9 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.85 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-25 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N68 |
3 |
.8 mm |
10 mm |
e3 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
2.85 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-25 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-N68 |
3 |
.8 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J68 |
4.57 mm |
24.1808 mm |
Not Qualified |
24.1808 mm |
|||||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J68 |
4.57 mm |
24.1808 mm |
Not Qualified |
24.1808 mm |
|||||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J68 |
4.57 mm |
24.1808 mm |
Not Qualified |
24.1808 mm |
|||||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J68 |
4.57 mm |
24.1808 mm |
Not Qualified |
24.1808 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
68 |
VFLGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-XBGA-B68 |
.85 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
INDUSTRIAL |
NO LEAD |
68 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
BICMOS |
3.3 V |
3.3 |
CHIP CARRIER |
LCC68,.4SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N68 |
Not Qualified |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.