68 Other Function Telecom Interface ICs 82

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BGW200EG	NXP Semiconductors		OTHER	NO LEAD	68	QCCN	RECTANGULAR	PLASTIC/EPOXY		YES		CMOS		.12 mA		1.8,2.8	CHIP CARRIER	LCC68,.4X.6,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		QUAD		R-PQCC-N68				Not Qualified
BGW211	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	68	HQCCN	RECTANGULAR	UNSPECIFIED		YES	1	BICMOS					CHIP CARRIER, HEAT SINK/SLUG							QUAD		R-XQCC-N68
CS5519AJI3FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	80 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
AP3891FN-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	95 Cel	-40 Cel		QUAD		S-XQCC-N68		.8 mm	8 mm					8 mm
CS5519AJI1FN-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	95 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
AP3892FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	95 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
CS5519AJI3FN-G1	Diodes Incorporated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	80 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
CS5519AJI1FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	95 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
AP3891FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	95 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
AP3892FN-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	95 Cel	-40 Cel		QUAD		S-XQCC-N68		.8 mm	8 mm					8 mm
CS5519AJI2FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
CS5519AJI2FN-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
MAX3953UGK-T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1	BIPOLAR		.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.45SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N68		.9 mm	10 mm	Not Qualified	e0			10 mm
MAX3953UGK-D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N68	3	.9 mm	10 mm	Not Qualified	e0			10 mm
MAX3953UGK-TD	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel		QUAD		S-XQCC-N68	1	.9 mm	10 mm	Not Qualified				10 mm
MAX3983UGK-TD	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1	BIPOLAR		.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel		QUAD		S-XQCC-N68	1	.9 mm	10 mm	Not Qualified				10 mm
DS2281-120	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	68	SIMM	RECTANGULAR	UNSPECIFIED		NO	1				5 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel	TIN LEAD	SINGLE		R-XSMA-N68				Not Qualified	e0
MAX3953UGK	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1	BIPOLAR		.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.45SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N68	3	.9 mm	10 mm	Not Qualified	e0			10 mm
DS2281-075	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	68	SIMM	RECTANGULAR	UNSPECIFIED		NO	1				5 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel	TIN LEAD	SINGLE		R-XSMA-N68				Not Qualified	e0
MAX3983UGK-D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1	BIPOLAR		.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N68	1	.9 mm	10 mm	Not Qualified	e0			10 mm
MAX24288ETK+T	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	1000 Mbps	S-XQCC-N68		.8 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
MAX24188ETK+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
MAX24188ETK+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
MAX24288ETK+	Maxim Integrated	ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	SDH; SONET	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N68	3	.8 mm	8 mm		e3		260	8 mm
MAX2852ITK+T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1	BICMOS			2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	MATTE TIN	QUAD		S-XQCC-N68	3	.8 mm	10 mm		e3	30	260	10 mm
MAX2852ITK+	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1	BICMOS			2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	MATTE TIN	QUAD		S-PQCC-N68	3	.8 mm	10 mm	Not Qualified	e3	30	260	10 mm
IDT82V3202NLG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N68	3	1 mm	10 mm	Not Qualified	e3			10 mm
UPD72305L	Renesas Electronics			J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES		CMOS			5 V	5	CHIP CARRIER	LDCC68,1.0SQ	Other Telecom ICs	1.27 mm			Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J68				Not Qualified	e0
82V3202NLG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N68	3	1 mm	10 mm	Not Qualified	e3	30	260	10 mm
UPD72307L	Renesas Electronics			J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY		YES		CMOS					CHIP CARRIER	LDCC68,1.0SQ	Other Telecom ICs	1.27 mm			Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J68				Not Qualified	e0
HDMP-1002	Broadcom	TELECOM CIRCUIT	OTHER	FLAT	68	QFF	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1	BIPOLAR	-5 V				FLATPACK			1.27 mm	85 Cel	0 Cel		QUAD		S-CQFP-F68		3.683 mm	24.13 mm	Not Qualified				24.13 mm
HDMP-100K	Broadcom	TELECOM CIRCUIT	OTHER	FLAT	68	QFF	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1	BIPOLAR	-5 V				FLATPACK			1.27 mm	85 Cel	0 Cel		QUAD		S-CQFP-F68		3.683 mm	24.13 mm	Not Qualified				24.13 mm
HDMP-1000	Broadcom	TELECOM CIRCUIT	OTHER	FLAT	68	QFF	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1	BIPOLAR	-5 V				FLATPACK			1.27 mm	85 Cel	0 Cel		QUAD		S-CQFP-F68		3.683 mm	24.13 mm	Not Qualified				24.13 mm
HDMP-1004	Broadcom	TELECOM CIRCUIT	OTHER	FLAT	68	QFF	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1	BIPOLAR	-5 V				FLATPACK			1.27 mm	85 Cel	0 Cel		QUAD		S-CQFP-F68		3.683 mm	24.13 mm	Not Qualified				24.13 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.