9 Other Function Telecom Interface ICs 24

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BGS13S2N9E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

UNSPECIFIED

YES

1

MOS

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN

BOTTOM

S-XBGA-B9

1

.4 mm

1.1 mm

e3

1.1 mm

090-02789-012

Microchip Technology

TELECOM CIRCUIT

PIN/PEG

9

DMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

5.1 mm

80 Cel

-40 Cel

DUAL

R-XDMA-P9

11.68 mm

35.3 mm

40.64 mm

090-02789-001

Microchip Technology

TELECOM CIRCUIT

PIN/PEG

9

DMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

5.1 mm

65 Cel

-10 Cel

DUAL

R-XDMA-P9

11.68 mm

35.3 mm

40.64 mm

090-02789-002

Microchip Technology

TELECOM CIRCUIT

PIN/PEG

9

DMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

5.1 mm

80 Cel

-40 Cel

DUAL

R-XDMA-P9

11.68 mm

35.3 mm

40.64 mm

090-02789-011

Microchip Technology

TELECOM CIRCUIT

PIN/PEG

9

DMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

5.1 mm

65 Cel

-10 Cel

DUAL

R-XDMA-P9

11.68 mm

35.3 mm

40.64 mm

ADCA3990AMLZ

Analog Devices

TELECOM CIRCUIT

OTHER

THROUGH-HOLE

9

RECTANGULAR

UNSPECIFIED

NO

1

FLANGE MOUNT

100 Cel

-30 Cel

SINGLE

R-XSFM-T9

NOT SPECIFIED

NOT SPECIFIED

BGS13S2N9E6327

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

UNSPECIFIED

YES

1

MOS

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBGA-B9

.4 mm

1.1 mm

1.1 mm

BGS13S2N9

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

9

VFLGA

SQUARE

UNSPECIFIED

YES

1

MOS

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBGA-B9

1

.4 mm

1.1 mm

1.1 mm

BGS13SL9

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

9

BCC

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBCC-B9

.32 mm

1.15 mm

1.15 mm

BGS13SL9E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

9

BCC

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

S-XBCC-B9

.32 mm

1.15 mm

1.15 mm

MAX3271E/D

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

9

DIE

RECTANGULAR

UNSPECIFIED

YES

1

BIPOLAR

.035 mA

3.3 V

3.3

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

TIN LEAD

UPPER

R-XUUC-N9

1

Not Qualified

e0

MAX3277U/D

Maxim Integrated

TELECOM CIRCUIT

OTHER

NO LEAD

9

DIE

RECTANGULAR

UNSPECIFIED

YES

1

BIPOLAR

.041 mA

3.3 V

3.3

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

0 Cel

TIN LEAD

UPPER

R-XUUC-N9

Not Qualified

e0

MAX3271E/W

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

9

DIE

RECTANGULAR

UNSPECIFIED

YES

1

BIPOLAR

.035 mA

3.3 V

3.3

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

TIN LEAD

UPPER

R-XUUC-N9

Not Qualified

e0

MAX3275U/D

Maxim Integrated

TELECOM CIRCUIT

OTHER

NO LEAD

9

DIE

RECTANGULAR

UNSPECIFIED

YES

1

BIPOLAR

.041 mA

3.3 V

3.3

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

0 Cel

TIN LEAD

UPPER

R-XUUC-N9

Not Qualified

e0

MAX2240EBL+TW

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B9

1

.67 mm

e1

30

260

MAX2240EBL

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B9

.65 mm

e0

MAX2240EBL+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B9

1

.67 mm

e1

30

260

MAX2240EBL-T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B9

.65 mm

e0

TA7320P

Toshiba

OTHER

9

PLASTIC/EPOXY

NO

BIPOLAR

SIP9,.1

Other Telecom ICs

2.54 mm

70 Cel

-30 Cel

Tin/Lead (Sn/Pb)

SINGLE

Not Qualified

e0

QHX220ICT7

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

9

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B9

1 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

1 mm

QHX220ICSR

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

9

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B9

1 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

1 mm

ALM-1912-BLKG

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

9

QCCN

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

85 Cel

-40 Cel

QUAD

R-XQCC-N9

3

1.05 mm

2 mm

260

2.9 mm

ALM-1912-TR1G

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

9

QCCN

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

85 Cel

-40 Cel

QUAD

R-XQCC-N9

3

1.05 mm

2 mm

260

2.9 mm

HSDL-3310007

Broadcom

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

9

RECTANGULAR

UNSPECIFIED

NO

1

3 V

MICROELECTRONIC ASSEMBLY

70 Cel

-20 Cel

SINGLE

R-XSMA-N9

Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.