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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | BGS13S2N9E6327XTSA1 |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 9; Package Code: VFBGA; Package Shape: SQUARE; |
| Datasheet | BGS13S2N9E6327XTSA1 Datasheet |
| In Stock | 43,083 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 3 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .4 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 9 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Length: | 1.1 mm |
| Technology: | MOS |
| JESD-30 Code: | S-XBGA-B9 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFBGA |
| Width: | 1.1 mm |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 1 |
