FBGA Other Function Telecom Interface ICs 30

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD9172BBPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V		GRID ARRAY, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.71 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
PN5120A0ET/C2QL	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES			100 mA		3/3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64	1			Not Qualified				260
PN5120A0ET/C2J	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES			100 mA		3/3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64	1			Not Qualified				260
LMX5452SMX	Texas Instruments		INDUSTRIAL	BALL	60	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			3/3.3	GRID ARRAY, FINE PITCH	BGA60,6X10,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B60	3			Not Qualified			20	235
AFE8092IABJ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) : 600, RF frequency(Max)(MHz) : 5500	e1	30	260	17 mm
PAFE7700IABJ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B400		2.65 mm	17 mm						17 mm
AFE8092HIABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500	e1		260	17 mm
AFE8000IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Max)(MHz) : 7000	e1		260	17 mm
AFE7700IABJ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
AFE7952IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm			TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) : 0; RF frequency(Max)(MHz) : 12000	e1		260	17 mm
AFE7901IALK	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			.925 V		GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm			e0		220	17 mm
AFE7901IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			.925 V		GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm			e1		260	17 mm
AD9082BBPZ-4D2AC	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V		GRID ARRAY, FINE PITCH	BGA324,18X18,32		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B324	3	1.72 mm	15 mm		IT CAN ALSO OPERATE WITH 1.8 AND 2 V		30	260	15 mm
AD9082BBPZRL-4D2AC	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V		GRID ARRAY, FINE PITCH	BGA324,18X18,32		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B324	3	1.72 mm	15 mm		IT CAN ALSO OPERATE WITH 1.8 AND 2 V		30	260	15 mm
AD9172BBPZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V		GRID ARRAY, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.71 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
STA8058A	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS			2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B104				Not Qualified
STW3100	STMicroelectronics		COMMERCIAL	BALL	104	FBGA	SQUARE	PLASTIC/EPOXY	YES				2.7 V	2.7	GRID ARRAY, FINE PITCH	BGA104,12X12,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel		BOTTOM		S-PBGA-B104				Not Qualified
STA260TR	STMicroelectronics		INDUSTRIAL	BALL	289	FBGA	SQUARE	PLASTIC/EPOXY	YES		CMOS			1.2,2.5	GRID ARRAY, FINE PITCH	BGA289,17X17,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B289				Not Qualified
STA260-8X8	STMicroelectronics		INDUSTRIAL	BALL	244	FBGA	SQUARE	PLASTIC/EPOXY	YES		CMOS			1.2,2.5	GRID ARRAY, FINE PITCH	BGA244,18X18,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B241				Not Qualified
STA8058	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS			2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B104				Not Qualified
STA260	STMicroelectronics		INDUSTRIAL	BALL	289	FBGA	SQUARE	PLASTIC/EPOXY	YES		CMOS			1.2,2.5	GRID ARRAY, FINE PITCH	BGA289,17X17,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B289				Not Qualified
STA8058ATR	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS			2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B104				Not Qualified
STA264TR	STMicroelectronics		INDUSTRIAL	BALL	249	FBGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY, FINE PITCH	BGA249,17X17,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B249				Not Qualified
STA8058TR	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS			2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B104				Not Qualified
STW3101	STMicroelectronics		COMMERCIAL	BALL	104	FBGA	SQUARE	PLASTIC/EPOXY	YES				2.7 V	2.7	GRID ARRAY, FINE PITCH	BGA104,12X12,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel		BOTTOM		S-PBGA-B104				Not Qualified
STA264	STMicroelectronics		INDUSTRIAL	BALL	249	FBGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY, FINE PITCH	BGA249,17X17,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B249				Not Qualified
PN5120A0ET/C2EL	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES			100 mA		3/3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64	1			Not Qualified				260
PBM99080/22MG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	78	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, FINE PITCH			.75 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B78			8 mm	Not Qualified					8 mm
ZIC2410FG72R	Renesas Electronics		INDUSTRIAL	BALL	72	FBGA	SQUARE	PLASTIC/EPOXY	YES					1.5,3	GRID ARRAY, FINE PITCH	BGA72,9X9,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B72				Not Qualified
BCM94312KFBG	Broadcom	TELECOM CIRCUIT		BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY, FINE PITCH			.8 mm				BOTTOM		S-PBGA-B144			10 mm	Not Qualified					10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.