HLGA Other Function Telecom Interface ICs 15

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NRF52840-QIAA-R7	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	73	HLGA	SQUARE	PLASTIC/EPOXY	YES	1				3 V	GRID ARRAY, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-N73	2	.85 mm	7 mm				7 mm
ADAR1000ACCZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	88	HLGA	SQUARE	PLASTIC/EPOXY	YES	1			-5 V	3.3 V	GRID ARRAY, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B88	3	.8 mm	7 mm			260	7 mm
ADAR1000ACCZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	88	HLGA	SQUARE	PLASTIC/EPOXY	YES	1			-5 V	3.3 V	GRID ARRAY, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B88		.8 mm	7 mm		NOT SPECIFIED	NOT SPECIFIED	7 mm
ADRF5044BCCZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1			-3.3 V	3.3 V	GRID ARRAY, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-XBGA-B24	3	.96 mm	4 mm	e4	30	260	4 mm
ADRF5044BCCZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1			-3.3 V	3.3 V	GRID ARRAY, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-XBGA-B24	3	.96 mm	4 mm	e4	30	260	4 mm
BGSF18DM20E6327XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	HLGA	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			3.5 V	GRID ARRAY, HEAT SINK/SLUG		.4 mm	85 Cel	-30 Cel	GOLD NICKEL	BOTTOM	R-XBGA-B20	3	.98 mm	2.8 mm	e4			3.2 mm
ATSAMB11-XR2100A	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	49	HLGA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.6 V	GRID ARRAY, HEAT SINK/SLUG			85 Cel	-40 Cel		BOTTOM	R-XBGA-N49		1.4 mm	4.5 mm				5.5 mm
SE5516A-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	GRID ARRAY, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B24		1.15 mm	4 mm		NOT SPECIFIED	NOT SPECIFIED	4 mm
ADRF5045BCCZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1			-3.3 V	3.3 V	GRID ARRAY, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-XBGA-B24	3	.96 mm	4 mm	e4	30	260	4 mm
ADRF5045BCCZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1			-3.3 V	3.3 V	GRID ARRAY, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-XBGA-B24	3	.96 mm	4 mm	e4	30	260	4 mm
ADAR1000	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	88	HLGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	GRID ARRAY, HEAT SINK/SLUG	LGA88,13X13,20	.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B88		.8 mm	7 mm				7 mm
WLAN8101C	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	38	HLGA	RECTANGULAR	UNSPECIFIED	YES	1				3.85 V	GRID ARRAY, HEAT SINK/SLUG	LGA38(UNSPEC)	.35 mm	85 Cel	-40 Cel		BOTTOM	R-XLGA-N38		.685 mm	3 mm				4 mm
WLAN8101H	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	38	HLGA	RECTANGULAR	UNSPECIFIED	YES	1				3.85 V	GRID ARRAY, HEAT SINK/SLUG	LGA38(UNSPEC)	.35 mm	85 Cel	-40 Cel		BOTTOM	R-XLGA-N38		.685 mm	3 mm				4 mm
BGSF18DM20	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	HLGA	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			3.5 V	GRID ARRAY, HEAT SINK/SLUG		.4 mm	85 Cel	-30 Cel		BOTTOM	R-XBGA-B20	3	.98 mm	2.8 mm				3.2 mm
BGSF18DM20E6727XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	HLGA	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			3.5 V	GRID ARRAY, HEAT SINK/SLUG		.4 mm	85 Cel	-30 Cel		BOTTOM	R-XBGA-B20	3	.98 mm	2.8 mm				3.2 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.