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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | BGSF18DM20 |
| Description | TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 20; Package Code: HLGA; Package Shape: RECTANGULAR; |
| Datasheet | BGSF18DM20 Datasheet |
| In Stock | 672 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 3.5 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .98 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -30 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 20 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Length: | 3.2 mm |
| Technology: | CMOS |
| JESD-30 Code: | R-XBGA-B20 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BUTT |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HLGA |
| Width: | 2.8 mm |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | OTHER |
| Moisture Sensitivity Level (MSL): | 3 |
