HTSSOP Other Function Telecom Interface ICs 37

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SY88403BLEY

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

10

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G10

1.1 mm

3 mm

Not Qualified

e3

3 mm

HMC310MS8G

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

1

3 V

3

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

SSOP8,.19

Network Interfaces

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

235

3 mm

HMC310MS8GE

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

40

260

3 mm

STLC60133N

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

-6 V

6 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G28

1.2 mm

4.4 mm

Not Qualified

9.7 mm

STLC60133

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

-6 V

6 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G28

1.2 mm

4.4 mm

Not Qualified

e0

9.7 mm

MAX3269CUB-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.078 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

Tin/Lead (Sn85Pb15)

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

20

240

3 mm

MAX3765CUB

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.09 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

20

240

3 mm

MAX3265CUE+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.65 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

MAX3264CUE-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.062 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX3265CUB

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

20

240

3 mm

MAX3768CUB

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.062 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

20

240

3 mm

MAX3264CUE+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.062 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.65 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

MAX3269CUB

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.078 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

Tin/Lead (Sn85Pb15)

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

20

240

3 mm

MAX3265CUB-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

Tin/Lead (Sn85Pb15)

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

20

240

3 mm

MAX3268CUB+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.062 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3265EUE

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

20

240

5 mm

MAX3265CUB+T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3265CUE+T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.65 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

MAX3268CUB-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.062 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

20

240

3 mm

MAX3265EUE+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

MAX3269CUB+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.078 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3768CUB+T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.062 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3768CUB-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.062 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

20

240

3 mm

MAX3268CUB

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.062 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

20

240

3 mm

MAX3765CUB+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.09 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3265CUE-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX3264CUE+T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.062 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.65 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

MAX3265EUE+T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

MAX3269CUB+T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.078 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3265EUE-T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX3768CUB+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.062 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3265CUE

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX3765CUB+T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3265CUB+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3268CUB+T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.062 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3765CUB-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

20

240

3 mm

MAX3264CUE

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.062 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.