LBGA Other Function Telecom Interface ICs 23

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
GS2972-IBE3	Semtech	TELECOM CIRCUIT	OTHER	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B100	3	1.7 mm	11 mm			e1		260	11 mm
AD6624AABCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Other Telecom ICs	1 mm	70 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified		e1		260	15 mm
VSC8491YJU-17	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		1 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	110 Cel	-40 Cel		BOTTOM	10000 Mbps	S-PBGA-B196		1.4 mm	15 mm						15 mm
GS2962-IBE3	Semtech	TELECOM CIRCUIT		BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.2 V		GRID ARRAY, LOW PROFILE	BGA100,10X10,40		1 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	2970 Mbps	S-PBGA-B100	3	1.7 mm	11 mm			e1	30	260	11 mm
VSC8491YJU-13	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		1 V		GRID ARRAY, LOW PROFILE			1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm						15 mm
VSC8490YJU-17	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		1 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	110 Cel	-40 Cel		BOTTOM	10000 Mbps	S-PBGA-B196		1.4 mm	15 mm						15 mm
GS2971-IBE3	Semtech	TELECOM CIRCUIT	OTHER	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B100	1	1.7 mm	11 mm			e1		260	11 mm
AD6624ABC	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B196		1.5 mm	15 mm	Not Qualified		e0			15 mm
AD6623ABCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified		e1		260	15 mm
LTM9013IY-AA#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196		3.02 mm	15 mm		3.3v and 5v power supply also require to operate the device		NOT SPECIFIED	NOT SPECIFIED	15 mm
LTM9013CY-AA#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B196		3.02 mm	15 mm		3.3v and 5v power supply also require to operate the device		NOT SPECIFIED	NOT SPECIFIED	15 mm
AD6624AABC	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Other Telecom ICs	1 mm	70 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM		S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified		e0		240	15 mm
AD6623ABC	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM		S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified		e0		240	15 mm
ST20196	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	208	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA208,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	24 Mbps	S-PBGA-B208		1.7 mm	17 mm	Not Qualified		e1			17 mm
E-ST20196	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	208	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B208		1.7 mm	17 mm	Not Qualified					17 mm
PBA31301/3	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	34	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	2.775 V		GRID ARRAY, LOW PROFILE			1.27 mm	75 Cel	-10 Cel		BOTTOM		R-PBGA-B34		1.6 mm	10.2 mm	Not Qualified					14 mm
PBA31301/2	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	34	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	2.775 V		GRID ARRAY, LOW PROFILE			1.27 mm	75 Cel	-10 Cel		BOTTOM		R-PBGA-B34		1.6 mm	10.2 mm	Not Qualified					14 mm
PBA31301/3S	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	34	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	2.8 V		GRID ARRAY, LOW PROFILE			1.27 mm	75 Cel	-10 Cel		BOTTOM		R-PBGA-B34		1.6 mm	10.2 mm	Not Qualified					14 mm
ISL35822IK	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	BALL	192	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.5 V	1.2,1.5,2.5	GRID ARRAY, LOW PROFILE	BGA192,16X16,40	ATM/SONET/SDH ICs	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B192	3		17 mm	Not Qualified		e0			17 mm
ISL35822LPIK	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	BALL	192	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.355 V	1.2,1.5,2.5	GRID ARRAY, LOW PROFILE	BGA192,16X16,40	ATM/SONET/SDH ICs	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B192	3		17 mm	Not Qualified		e0			17 mm
BBT3821-JH	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	BALL	192	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.5 V	1.2,1.5,2.5	GRID ARRAY, LOW PROFILE	BGA192,16X16,40	ATM/SONET/SDH ICs	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B192	3		17 mm	Not Qualified		e0			17 mm
BBT3821LP-JH	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	BALL	192	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.355 V	1.2,1.5,2.5	GRID ARRAY, LOW PROFILE	BGA192,16X16,40	ATM/SONET/SDH ICs	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B192	3		17 mm	Not Qualified		e0			17 mm
HDMP-1685A	Broadcom	TELECOM CIRCUIT	OTHER	BALL	208	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA208,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B208		1.65 mm	23 mm	Not Qualified					23 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.