LFBGA Other Function Telecom Interface ICs 78

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

STLC2415

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

120

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA120,18X18,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B120

1.4 mm

10 mm

Not Qualified

10 mm

STA2500DCTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

48

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.75 V

2.75

GRID ARRAY

BGA48,7X7,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B48

1.25 mm

6 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

6 mm

STA2416

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

120

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA120,18X18,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B120

1.4 mm

10 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10 mm

MTC20455MB-I

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

160

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA160,14X14,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

S-PBGA-B160

1.7 mm

12 mm

Not Qualified

e1

12 mm

STLC2416

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

120

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA120,18X18,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B120

1.4 mm

10 mm

Not Qualified

e0

10 mm

STA2500DC

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

48

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.75 V

2.75

GRID ARRAY

BGA48,7X7,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B48

1.25 mm

6 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

6 mm

MTC20136MB-I1

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

160

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA160,14X14,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B160

1.7 mm

12 mm

Not Qualified

e1

12 mm

E-STLC2416

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

120

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA120,18X18,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B120

1.4 mm

10 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10 mm

STA9100MGATR

STMicroelectronics

TELECOM CIRCUIT

BALL

81

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA81,9X9,32

.8 mm

BOTTOM

S-PBGA-B81

1.7 mm

8 mm

NOT SPECIFIED

NOT SPECIFIED

8 mm

STA2500DTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

48

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.75 V

2.75

GRID ARRAY

BGA48,7X7,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B48

3

1.25 mm

6 mm

Not Qualified

e1

30

260

6 mm

STA2500D

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

48

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.75 V

2.75

GRID ARRAY

BGA48,7X7,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B48

3

1.25 mm

6 mm

Not Qualified

e1

30

260

6 mm

STA9100MGA

STMicroelectronics

TELECOM CIRCUIT

BALL

81

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA81,9X9,32

.8 mm

BOTTOM

S-PBGA-B81

1.7 mm

8 mm

NOT SPECIFIED

NOT SPECIFIED

8 mm

MC72000

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BALL

100

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.7 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B100

1.6 mm

7 mm

7 mm

SJA1105EL,518

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BALL

159

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

105 Cel

-40 Cel

BOTTOM

S-PBGA-B159

1.5 mm

12 mm

12 mm

SJA1105TEL,518

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BALL

159

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

105 Cel

-40 Cel

BOTTOM

S-PBGA-B159

1.5 mm

12 mm

12 mm

MC71000

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BALL

100

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B100

1.35 mm

7 mm

7 mm

PCF87852E

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BALL

73

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA73,12X12,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B73

1.3 mm

7 mm

Not Qualified

40

260

7 mm

PEF22817

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B225

1.5 mm

13 mm

Not Qualified

13 mm

PEF22827

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B225

1.5 mm

13 mm

Not Qualified

e1

13 mm

BCM4318KFBG

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

75 Cel

0 Cel

BOTTOM

S-PBGA-B196

1.4 mm

12 mm

12 mm

BCM4318SKFBG

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

75 Cel

0 Cel

BOTTOM

S-PBGA-B144

1.4 mm

10 mm

10 mm

PI2EQX4402DNBEX

Diodes Incorporated

TELECOM CIRCUIT

COMMERCIAL

BALL

84

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B84

3

1.46 mm

9 mm

Not Qualified

e1

9 mm

DS1852B-000

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

100 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e0

5 mm

DS1852B-000+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

100 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e3

5 mm

DS1852B-000/T&R

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

100 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e0

5 mm

DS1852B-000+T&R

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

100 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e3

5 mm

TC35661IDBG-203

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1.4 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TC35661DBG-203

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1.4 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TC35661IDBG-008

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1.4 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

UPD77533S1-YHC

Renesas Electronics

TELECOM CIRCUIT

OTHER

BALL

108

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

MOS

1.5 V

1.5,3/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA108,12X12,32

Other Telecom ICs

.8 mm

85 Cel

-20 Cel

BOTTOM

S-PBGA-B108

1.66 mm

11 mm

Not Qualified

11 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.