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| Manufacturer | Renesas Electronics |
|---|---|
| Manufacturer's Part Number | UPD77533S1-YHC |
| Description | TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 108; Package Code: LFBGA; Package Shape: SQUARE; |
| Datasheet | UPD77533S1-YHC Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.5 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 1.66 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -20 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 108 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA108,12X12,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Length: | 11 mm |
| Technology: | MOS |
| JESD-30 Code: | S-PBGA-B108 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFBGA |
| Width: | 11 mm |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 1.5,3/3.3 |
