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Manufacturer | Renesas Electronics |
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Manufacturer's Part Number | UPD77533S1-YHC |
Description | TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 108; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | UPD77533S1-YHC Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.5 V |
Telecom IC Type: | TELECOM CIRCUIT |
Maximum Seated Height: | 1.66 mm |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Minimum Operating Temperature: | -20 Cel |
No. of Functions: | 1 |
No. of Terminals: | 108 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA108,12X12,32 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Length: | 11 mm |
Technology: | MOS |
JESD-30 Code: | S-PBGA-B108 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | LFBGA |
Width: | 11 mm |
Terminal Pitch: | .8 mm |
Temperature Grade: | OTHER |
Power Supplies (V): | 1.5,3/3.3 |