LFQFP Other Function Telecom Interface ICs 175

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	ISDN Access Rate	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Output High Voltage	Maximum Output Low Voltage	Standard	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Reference Point	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Maximum Output Low Current	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PEB8091F	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK, LOW PROFILE, FINE PITCH			.5 mm							QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PSB2113F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.019 mA	5 V	5		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel				0 Cel	TIN LEAD	QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified		e0			10 mm
PSF21150F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel		QUAD	.144 Mbps	S-PQFP-G64	S/T		1.6 mm	10 mm	Not Qualified	4.5 Amp				10 mm
PEF8191F	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	85 Cel	2.4 V	.45 V	ANSI T1.601	-40 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T TO U (NT-1)		1.6 mm	10 mm	Not Qualified	7 Amp	e0			10 mm
PEB55504	Infineon Technologies	TELECOM CIRCUIT		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK, LOW PROFILE, FINE PITCH			.5 mm							QUAD		S-PQFP-G144			1.6 mm	20 mm	Not Qualified					20 mm
PEB80900F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PEB8191F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	2.4 V	.45 V	ANSI T1.601	0 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T TO U (NT-1)		1.6 mm	10 mm	Not Qualified	7 Amp	e0			10 mm
PSF2115F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PEB8090F	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK, LOW PROFILE, FINE PITCH			.5 mm							QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
MB86977PFV-G-BND	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	208	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-20 Cel		QUAD		S-PQFP-G208			1.7 mm	28 mm						28 mm
MAX2980CCB	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Modems	.5 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified		e0			10 mm
TC90207FG	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
TB6865AFG	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel		QUAD		S-PQFP-G100			1.7 mm	14 mm				NOT SPECIFIED	NOT SPECIFIED	14 mm
82V3255DK	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	TIN LEAD	QUAD		S-PQFP-G64		3	1.6 mm	10 mm	Not Qualified		e0			10 mm
IDT82V3255TF8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	TIN LEAD	QUAD		S-PQFP-G64		3	1.6 mm	10 mm	Not Qualified		e0	30	240	10 mm
82V3380DQ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	TIN LEAD	QUAD		S-PQFP-G100		3	1.4 mm	14 mm	Not Qualified		e0	20	240	14 mm
82V3358TF	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.464 mA	3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel				-40 Cel	TIN LEAD	QUAD		S-PQFP-G64		3	1.6 mm	10 mm	Not Qualified		e0			10 mm
82V3280PFG8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	MATTE TIN	QUAD		S-PQFP-G100		3	1.6 mm	14 mm			e3	30	260	14 mm
82V3358TFG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.464 mA	3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel				-40 Cel	MATTE TIN	QUAD		S-PQFP-G64		3	1.6 mm	10 mm	Not Qualified		e3	30	260	10 mm
IDT82V3255TFG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQFP-G64		3	1.6 mm	10 mm	Not Qualified		e3	30	260	10 mm
82V3280DQ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	TIN LEAD	QUAD		S-PQFP-G100		3	1.6 mm	14 mm	Not Qualified		e0	20	240	14 mm
82V3285DQ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	TIN LEAD	QUAD		S-PQFP-G100		3	1.4 mm	14 mm	Not Qualified		e0	20	240	14 mm
M64886FP	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	60 Cel				-10 Cel		QUAD		S-PQFP-G80			1.7 mm	12 mm	Not Qualified					12 mm
82V3285PFG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.528 mA	3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel				-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQFP-G100		3	1.6 mm	14 mm	Not Qualified		e3	30	260	14 mm
82V3255TFG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	MATTE TIN	QUAD		S-PQFP-G64		3	1.6 mm	10 mm	Not Qualified		e3	30	260	10 mm
IDT82V3280PF8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	Tin/Lead (Sn85Pb15)	QUAD		S-PQFP-G100		3	1.6 mm	14 mm	Not Qualified		e0	20	240	14 mm
82V3255TFG8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	MATTE TIN	QUAD		S-PQFP-G64		3	1.6 mm	10 mm			e3	30	260	10 mm
IDT82V3280PFG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQFP-G100		3	1.6 mm	14 mm	Not Qualified		e3	30	260	14 mm
82V3285PF	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.528 mA	3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel				-40 Cel	Tin/Lead (Sn85Pb15)	QUAD		S-PQFP-G100		3	1.6 mm	14 mm	Not Qualified		e0	20	240	14 mm
T8301	Broadcom	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel	TIN LEAD	QUAD		S-PQFP-G100			1.6 mm	14 mm	Not Qualified		e0	30	240	14 mm
CSP1027-S	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel		QUAD		S-PQFP-G48			1.6 mm	7 mm	Not Qualified					7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.