LFQFP Other Function Telecom Interface ICs 175

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	ISDN Access Rate	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Output High Voltage	Maximum Output Low Voltage	Standard	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Reference Point	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Maximum Output Low Current	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SA9024BE-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.75 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel		QUAD		S-PQFP-G48			1.6 mm	7 mm	Not Qualified					7 mm
SA9024BE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.75 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel		QUAD		S-PQFP-G48			1.6 mm	7 mm	Not Qualified					7 mm
UAA1570HL	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel		QUAD		S-PQFP-G48			1.6 mm	7 mm	Not Qualified					7 mm
MWCT1013VLHSTR	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V			FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	105 Cel				-40 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm						10 mm
MWCT1013VLH	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V			FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	105 Cel				-40 Cel	Tin (Sn)	QUAD		S-PQFP-G64		3	1.6 mm	10 mm			e3	40	260	10 mm
TZA3040HL-T	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, LOW PROFILE, FINE PITCH			.5 mm							QUAD		S-PQFP-G32			1.6 mm	5 mm	Not Qualified					5 mm
SAA1575	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm							QUAD		S-PQFP-G100			1.6 mm	14 mm	Not Qualified					14 mm
SA9024	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.75 V	3.75		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel				-40 Cel	TIN	QUAD		S-PQFP-G48			1.6 mm	7 mm	Not Qualified		e3			7 mm
SAA1575-T	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm							QUAD		S-PQFP-G100			1.6 mm	14 mm	Not Qualified					14 mm
MRFIC1505AR2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	TIN LEAD	QUAD		S-PQFP-G48			1.6 mm	7 mm	Not Qualified		e0			7 mm
SA58646BD,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	TIN	QUAD		S-PQFP-G64		1	1.6 mm	10 mm	Not Qualified		e3			10 mm
SA1630BE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	TIN	QUAD		S-PQFP-G48			1.6 mm	7 mm	Not Qualified		e3			7 mm
TZA3040HL	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, LOW PROFILE, FINE PITCH			.5 mm							QUAD		S-PQFP-G32			1.6 mm	5 mm	Not Qualified					5 mm
MWCT1001AVLHR	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		3.3 V			FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	105 Cel				-40 Cel	TIN	QUAD		S-PQFP-G64		3	1.6 mm	10 mm			e3	40	260	10 mm
SA1620BE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			90 mA	3 V	3		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel				-40 Cel		QUAD		S-PQFP-G48			1.6 mm	7 mm	Not Qualified					7 mm
PR601HL/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				-25 Cel		QUAD		S-PQFP-G100			1.6 mm	14 mm						14 mm
SA58646BD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	Tin (Sn)	QUAD		S-PQFP-G64		1	1.6 mm	10 mm	Not Qualified		e3	30	260	10 mm
MWCT1013VLHST	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V			FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	105 Cel				-40 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm						10 mm
SA1620BE-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			90 mA	3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel		QUAD		S-PQFP-G48			1.6 mm	7 mm	Not Qualified					7 mm
SA1630BE-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel		QUAD		S-PQFP-G48			1.6 mm	7 mm	Not Qualified					7 mm
MRFIC1505R2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel		QUAD		S-PQFP-G48			1.6 mm	7 mm	Not Qualified					7 mm
PRH601HL/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				-25 Cel		QUAD		S-PQFP-G100			1.6 mm	14 mm						14 mm
SAA1575HL	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	TIN	QUAD		S-PQFP-G100			1.6 mm	14 mm	Not Qualified		e3			14 mm
SA9025BE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.75 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel		QUAD		S-PQFP-G48			1.6 mm	7 mm	Not Qualified					7 mm
MC33596FJE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	TIN	QUAD		S-PQFP-G32		3	1.6 mm	5 mm			e3	40	260	5 mm
MC33696FJER2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel		QUAD		S-PQFP-G32			1.6 mm	5 mm				40	260	5 mm
MC33596FJAER2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-20 Cel		QUAD		S-PQFP-G32			1.6 mm	5 mm				40	260	5 mm
MC33696FJE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	TIN	QUAD		S-PQFP-G32		3	1.6 mm	5 mm			e3	40	260	5 mm
MC33696FJAER2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-20 Cel		QUAD		S-PQFP-G32			1.6 mm	5 mm				40	260	5 mm
MC33596FJER2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	TIN	QUAD		S-PQFP-G32		3	1.6 mm	5 mm			e3	40	260	5 mm
MC33596FJAE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-20 Cel	TIN	QUAD		S-PQFP-G32		3	1.6 mm	5 mm			e3	40	260	5 mm
935311368528	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		3.3 V			FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	105 Cel				-40 Cel	TIN	QUAD		S-PQFP-G64		3	1.6 mm	10 mm			e3	40	260	10 mm
MC33696FJAE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-20 Cel	TIN	QUAD		S-PQFP-G32		3	1.6 mm	5 mm			e3	40	260	5 mm
PSB7110FV1.0	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V	3.6,5		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G100			1.6 mm	14 mm	Not Qualified		e0			14 mm
PSB21150FV14XQMA1	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel	MATTE TIN	QUAD		S-PQFP-G64			1.6 mm	10 mm			e3	40	260	10 mm
PSB21150F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel		QUAD	.144 Mbps	S-PQFP-G64	S/T		1.6 mm	10 mm	Not Qualified	4.5 Amp				10 mm
PSB2115F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T		1.6 mm	10 mm	Not Qualified	7 Amp	e0			10 mm
PEB8191	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PEB20571	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.275 mA	3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G100			1.6 mm	14 mm	Not Qualified					14 mm
PEF20954	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	Other Telecom ICs	.5 mm	85 Cel				-40 Cel	TIN LEAD	QUAD		S-PQFP-G144			1.6 mm	20 mm	Not Qualified		e0			20 mm
PEF8191	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PSB2115F-V12	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PMB2707-F	Infineon Technologies	TELECOM CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm							QUAD		S-PQFP-G100			1.6 mm	14 mm	Not Qualified					14 mm
PEB22521F	Infineon Technologies	TELECOM CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm							QUAD		S-PQFP-G100			1.6 mm	14 mm	Not Qualified					14 mm
PSB21150FV14XQSA1	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel	MATTE TIN	QUAD		S-PQFP-G64			1.6 mm	10 mm			e3			10 mm
PSF2115	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PEB20570	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.275 mA	3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G100			1.6 mm	14 mm	Not Qualified					14 mm
PSB7115FV2.1	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G144			1.6 mm	20 mm	Not Qualified					20 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.