RF AND BASEBAND CIRCUIT Other Function Telecom Interface ICs 22

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SX1262IMLTRT

Semtech

RF AND BASEBAND CIRCUIT

MATTE TIN

1

e3

260

LEA-M8S-0

U-blox Ag

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

28

DMA

RECTANGULAR

UNSPECIFIED

YES

1

AEC-Q100

3 V

MICROELECTRONIC ASSEMBLY

1.1 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N28

4

2.7 mm

17 mm

22.4 mm

SX1261IMLTRT

Semtech

RF AND BASEBAND CIRCUIT

MATTE TIN

1

e3

260

SPIRIT1QTR

STMicroelectronics

RF AND BASEBAND CIRCUIT

MATTE TIN

3

e3

40

260

AT86RF215-ZUR

Microchip Technology

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, VERY THIN PROFILE

LCC48,.28SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N48

.9 mm

7 mm

e3

7 mm

AT86RF215M-ZUR

Microchip Technology

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, VERY THIN PROFILE

LCC48,.28SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N48

.9 mm

7 mm

e3

7 mm

AT86RF215-ZU

Microchip Technology

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, VERY THIN PROFILE

LCC48,.28SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N48

.9 mm

7 mm

e3

7 mm

AT86RF215M-ZU

Microchip Technology

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, VERY THIN PROFILE

LCC48,.28SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N48

.9 mm

7 mm

e3

7 mm

CL4490-1000-232-SP

Laird Technologies

RF AND BASEBAND CIRCUIT

CL4490-1000-PRO

Laird Technologies

RF AND BASEBAND CIRCUIT

CL4490-1000-485

Laird Technologies

RF AND BASEBAND CIRCUIT

CL4490-1000-232

Laird Technologies

RF AND BASEBAND CIRCUIT

AT86RF215IQ-ZU

Microchip Technology

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, VERY THIN PROFILE

LCC48,.28SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N48

.9 mm

7 mm

e3

7 mm

AT86RF215IQ-ZUR

Microchip Technology

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, VERY THIN PROFILE

LCC48,.28SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N48

.9 mm

7 mm

e3

7 mm

CL4490-1000-PRO-SP

Laird Technologies

RF AND BASEBAND CIRCUIT

CL4490-1000-485-SP

Laird Technologies

RF AND BASEBAND CIRCUIT

SKY85717-11

Skyworks Solutions

RF AND BASEBAND CIRCUIT

NO LEAD

16

QCCN

SQUARE

YES

1

CHIP CARRIER

QUAD16(UNSPEC)

QUAD

S-XQCC-N16

NOT SPECIFIED

NOT SPECIFIED

TFF1024HN/N1,135

NXP Semiconductors

RF AND BASEBAND CIRCUIT

NO LEAD

16

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1X.14,20

.5 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N16

1

1 mm

2.5 mm

260

3.5 mm

TFF1024HN/N1,115

NXP Semiconductors

RF AND BASEBAND CIRCUIT

NO LEAD

16

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1X.14,20

.5 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N16

1

1 mm

2.5 mm

260

3.5 mm

TFF1024HN

NXP Semiconductors

RF AND BASEBAND CIRCUIT

NO LEAD

16

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1X.14,20

.5 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N16

1 mm

2.5 mm

3.5 mm

935297767115

NXP Semiconductors

RF AND BASEBAND CIRCUIT

NO LEAD

16

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1X.14,20

.5 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N16

1 mm

2.5 mm

3.5 mm

935297767135

NXP Semiconductors

RF AND BASEBAND CIRCUIT

NO LEAD

16

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1X.14,20

.5 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N16

1 mm

2.5 mm

3.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.