TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Maximum Output Voltage	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Maximum Output Low Current	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TPS9111Y	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	DIE	UNSPECIFIED	UNSPECIFIED	YES	1					4 V		UNCASED CHIP				85 Cel	-40 Cel			UPPER		X-XUUC-N28				Not Qualified
LM96551SQ	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	80	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel			QUAD		S-XQCC-N80		.8 mm	12 mm							12 mm
XCC2564MODNCMOER	Texas Instruments	TELECOM CIRCUIT	OTHER	BUTT	33	BCC	SQUARE	UNSPECIFIED	YES	1					3.6 V		CHIP CARRIER				70 Cel	-20 Cel			BOTTOM		S-XBCC-B33		1.4 mm	7 mm							7 mm
ONET4291TAYS	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	DIE	RECTANGULAR	UNSPECIFIED	YES	1				.025 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel			UPPER		R-XUUC-N10				Not Qualified				NOT SPECIFIED	NOT SPECIFIED
TPS65720YFFT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	UNSPECIFIED	YES	1					3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		S-XBGA-B25	1	.625 mm	2.3 mm	Not Qualified			e1	NOT SPECIFIED	260	2.3 mm
GC4116-PB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			2.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD		BOTTOM		S-PBGA-B160	3	2.05 mm	15 mm	Not Qualified			e0	20	220	15 mm
TSB21LV03MHV	Texas Instruments	TELECOM CIRCUIT	MILITARY	GULL WING	68	QFP	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1					3.3 V		FLATPACK			.635 mm	125 Cel	-55 Cel			QUAD		S-CQFP-G68		3.86 mm	12.51 mm	Not Qualified						12.51 mm
PCM3793RHB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified			e4			5 mm
PLMX8410A0RGZT	Texas Instruments	TELECOM CIRCUIT
TRF2432RTQ	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel			QUAD		S-PQCC-N56		1 mm	8 mm	Not Qualified						8 mm
TRF2432IRTQT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.125 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN		QUAD		S-PQCC-N56	3	1 mm	8 mm	Not Qualified			e3	30	260	8 mm
CC2430F32RTCRG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-XQCC-N48	3	.9 mm	7 mm	Not Qualified			e4	30	260	7 mm
LMV243BLX	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	8	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.8 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			BOTTOM		S-PBGA-B8		1.095 mm	1.514 mm							1.514 mm
HPA02221RHLR	Texas Instruments	TELECOM CIRCUIT		NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm					QUAD		R-PQCC-N20		1 mm	3.5 mm							4.5 mm
TRF5001GQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	80	VFLGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	65 Cel	0 Cel			BOTTOM		S-PBGA-B80		1 mm	5 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	5 mm
RF430CL330HTB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3.3 V		SMALL OUTLINE				70 Cel	0 Cel			DUAL		R-PDSO-G14
SN74AVC6T622RGYR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				.015 mA	1.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	3.6 V	QUAD	50 Mbps	R-PQCC-N20	2	1 mm	3.5 mm	Not Qualified	16 Amp		e4	30	260	4.5 mm
TPS9103PWLE	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel			DUAL		R-PDSO-G20		1.2 mm	4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	6.5 mm
RF430CL331HRGT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-PQCC-N16		1 mm	3 mm							3 mm
CC2430F32RTCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.25 Mbps	S-XQCC-N48	3	.9 mm	7 mm	Not Qualified			e4	30	260	7 mm
PCM3793RRHB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified			e4			5 mm
TPS657202YFFT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		S-PBGA-B25	1	.625 mm	2.086 mm				e1	30	260	2.086 mm
RI-TRP-WR2B-20	Texas Instruments	TELECOM CIRCUIT	OTHER							1											70 Cel	-25 Cel						1			Not Qualified
CC2480A1RTCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.25 Mbps	S-PQCC-N48	3	.9 mm	7 mm	Not Qualified			e4	30	260	7 mm
CLC016MTC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	-5.2 V		5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G28		1.1 mm	4.4 mm							9.7 mm
TPS9103	Texas Instruments	TELECOM CIRCUIT		NO LEAD	20	DIE	UNSPECIFIED	UNSPECIFIED	YES	1					3.3 V		UNCASED CHIP								UPPER		X-XUUC-N20				Not Qualified
UCC5342MTR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel			DUAL		R-PDSO-G16		1.42 mm	3.9 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	4.9 mm
RI-TRP-W9QL-20	Texas Instruments	TELECOM CIRCUIT	OTHER							1											70 Cel	-25 Cel						1			Not Qualified
GC4116-PB-ASY	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			2.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel			BOTTOM		S-PBGA-B160			15 mm	Not Qualified						15 mm
TLK4211EARGTTG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.038 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N16	2	1 mm	3 mm	Not Qualified			e4	30	260	3 mm
TRPGP40ATGC	Texas Instruments	TELECOM CIRCUIT	OTHER	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED		1											70 Cel	-25 Cel															12.8 mm
TRPGP40TGC	Texas Instruments	TELECOM CIRCUIT
TLV5591BVFR	Texas Instruments	TELECOM CIRCUIT		GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, LOW PROFILE			.8 mm					QUAD		S-PQFP-G32	4	1.6 mm	7 mm	Not Qualified						7 mm
AFE8092IABJ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1							GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm			RF frequency(Min)(MHz) : 600, RF frequency(Max)(MHz) : 5500	e1	30	260	17 mm
PCM3794RRHB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified			e4			5 mm
GC3021-PQ	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			5 V		FLATPACK			.65 mm	70 Cel	0 Cel			QUAD		S-PQFP-G160		4.07 mm	28 mm	Not Qualified						28 mm
TRF2432IRTQTG3	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.125 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel	MATTE TIN		QUAD		S-PQCC-N56	3	1 mm	8 mm	Not Qualified			e3	30	260	8 mm
TLC320AD545CPT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel			QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified						7 mm
RI-TRP-W9TD-13	Texas Instruments	TELECOM CIRCUIT	OTHER				UNSPECIFIED	UNSPECIFIED		1											70 Cel	-25 Cel
LM3291TME/NOPB	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel	TIN SILVER COPPER		BOTTOM		R-XBGA-B12	1	.675 mm					e1	30	260
PAFE7700IABJ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1							GRID ARRAY, FINE PITCH			.8 mm	85 Cel	-40 Cel			BOTTOM		S-PBGA-B400		2.65 mm	17 mm							17 mm
RI-TRP-RFOB-30	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED			UNSPECIFIED	PLASTIC/EPOXY	NO	1							SPECIAL SHAPE				85 Cel	-40 Cel	TIN SILVER COPPER		UNSPECIFIED		X-PXSS-X							e1
CLC016ACQ	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	-5.2 V		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	TIN LEAD		QUAD		S-PQCC-J28	2A	4.57 mm	11.43 mm				e0		245	11.43 mm
DS100BR111SQ/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	2				2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN		QUAD	10300 Mbps	S-XQCC-N24	3	.8 mm	4 mm				e3	30	260	4 mm
TRF1020PFB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			QUAD		S-PQFP-G48		1.2 mm	7 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7 mm
UCC5343M	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			3.3 V		SMALL OUTLINE			.635 mm	70 Cel	0 Cel			DUAL		R-PDSO-G16		1.42 mm	3.9 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	4.9 mm
TPS9110IPWR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					4 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G28		1.2 mm	4.4 mm					NOT SPECIFIED	NOT SPECIFIED	9.7 mm
TPS9104IPTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1 mA	4 V	4	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.