Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
64 |
HTQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
.25 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE |
TQFP64,.63SQ,32 |
Other Telecom ICs |
.8 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G64 |
1.2 mm |
14 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
BALL |
130 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.7 V |
GRID ARRAY |
70 Cel |
-20 Cel |
BOTTOM |
R-PBGA-B130 |
2 mm |
13.3 mm |
13.4 mm |
|||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
FLATPACK, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
1.2 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.24SQ,20 |
.5 mm |
125 Cel |
-55 Cel |
QUAD |
S-PQCC-N36 |
1 mm |
6 mm |
6 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
1 |
85 Cel |
-40 Cel |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TWOS COMPLEMENT |
1 |
3.3 V |
TWOS COMPLEMENT |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Codecs |
.5 mm |
70 Cel |
16 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G48 |
1 |
1.6 mm |
7 mm |
Not Qualified |
DIFFERENTIAL |
3 V |
e4 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
.003 mA |
12 V |
12 |
SMALL OUTLINE |
SOP16,.25 |
Telephone Circuits |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
9.9 mm |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
85 Cel |
-25 Cel |
TIN SILVER COPPER |
Not Qualified |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
e4 |
30 |
260 |
9 mm |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
LSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
.003 mA |
12 V |
12 |
SMALL OUTLINE, LOW PROFILE |
SOP16,.25 |
Telephone Circuits |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
1.65 mm |
3.8989 mm |
Not Qualified |
e0 |
9.9 mm |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
UNSPECIFIED |
SQUARE |
UNSPECIFIED |
NO |
1 |
SPECIAL SHAPE |
70 Cel |
-25 Cel |
UNSPECIFIED |
S-XXSS-X |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
S-PQCC-N32 |
2 |
.8 mm |
5 mm |
RF frequency(Min)(MHz) is 400; RF frequency(Max)(MHz) is 1700 |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
25 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B25 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G14 |
1.2 mm |
4.4 mm |
5 mm |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
12 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
2 |
BICMOS |
5 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T12 |
5.33 mm |
7.62 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
29.905 mm |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
25 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B25 |
.675 mm |
2.644 mm |
Not Qualified |
2.771 mm |
|||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-20 Cel |
QUAD |
S-PQCC-N40 |
.9 mm |
6 mm |
Not Qualified |
6 mm |
|||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
.003 mA |
12 V |
12 |
IN-LINE |
DIP16,.3 |
Telephone Circuits |
2.54 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
e0 |
19.31 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.25 Mbps |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
3.3 V |
SMALL OUTLINE |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-XDSO-G14 |
2 |
e4 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
MILITARY |
FLAT |
68 |
DFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
MIL-PRF-38535 Class V |
2.6 V |
FLATPACK |
.65 mm |
125 Cel |
-55 Cel |
QUAD |
S-CQFP-F68 |
2.68 mm |
13.97 mm |
Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
13.97 mm |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
BUTT |
100 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.7 V |
2.9/4.8 |
GRID ARRAY |
LGA100(UNSPEC) |
Other Telecom ICs |
.7 mm |
70 Cel |
-20 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
100 Mbps |
R-PBGA-B100 |
3 |
2 mm |
13.3 mm |
Not Qualified |
e4 |
30 |
260 |
13.4 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.038 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
1 mm |
3 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
107 mA |
5 V |
5 |
IN-LINE |
SOP20,.4 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
12 V |
12 |
SMALL OUTLINE |
SOP16,.25 |
Telephone Circuits |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
9.9 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
5000 Mbps |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
2 V |
e4 |
30 |
260 |
9 mm |
||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.6 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
-10 Cel |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
7 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.45 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
4000 Mbps |
S-XQCC-N68 |
3 |
1 mm |
10 mm |
1.995 V |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
CMOS |
.158 mA |
1.8 V |
1.8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Other Telecom ICs |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1300 Mbps |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
UNCASED CHIP |
85 Cel |
-40 Cel |
UPPER |
X-XUUC-N |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
S-PQCC-N32 |
2 |
.8 mm |
5 mm |
RF frequency(Min)(MHz) is 400; RF frequency(Max)(MHz) is 1700 |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.015 mA |
1.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
3.6 V |
BOTTOM |
50 Mbps |
R-PBGA-B20 |
1 |
.61 mm |
2.5 mm |
Not Qualified |
e1 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
100 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
11300 Mbps |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
3 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
e4 |
30 |
260 |
6 mm |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
7.2 mm |
|||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N32 |
1 mm |
5 mm |
Not Qualified |
e4 |
5 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
48 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B48 |
3 |
1.2 mm |
5 mm |
e1 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
BALL |
130 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.7 V |
GRID ARRAY |
70 Cel |
-20 Cel |
BOTTOM |
R-PBGA-B130 |
2 mm |
13.3 mm |
13.4 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N24 |
2 |
1 mm |
4 mm |
e4 |
NOT SPECIFIED |
260 |
4 mm |
||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
12.8 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.5 V |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
70 Cel |
-25 Cel |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.505 mm |
Not Qualified |
11.505 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
70 Cel |
-25 Cel |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
16 |
VFBGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-XBGA-B16 |
1 |
.625 mm |
2.3 mm |
Not Qualified |
e1 |
30 |
260 |
2.3 mm |
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Texas Instruments |
TELECOM CIRCUIT |
OTHER |
BALL |
130 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.7 V |
GRID ARRAY |
70 Cel |
-20 Cel |
BOTTOM |
R-PBGA-B130 |
2 mm |
13.3 mm |
13.4 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
e4 |
30 |
260 |
9 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.