MILITARY Other Function Telecom Interface ICs 28

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

TM266DVA1

Pulse Electronics

TELECOM CIRCUIT

MILITARY

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

HYBRID

5 V

5

SMALL OUTLINE, SHRINK PITCH

SOP28,.5

ATM/SONET/SDH ICs

.65 mm

125 Cel

-55 Cel

DUAL

R-PDSO-G28

1

5.588 mm

Not Qualified

TM1062DVA1

Pulse Electronics

TELECOM CIRCUIT

MILITARY

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

HYBRID

5 V

5

SMALL OUTLINE, SHRINK PITCH

SOP28,.5

ATM/SONET/SDH ICs

.65 mm

125 Cel

-55 Cel

DUAL

R-PDSO-G28

1

5.588 mm

Not Qualified

TM1062TXHUA

Pulse Electronics

TELECOM CIRCUIT

MILITARY

GULL WING

16

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

125 Cel

-55 Cel

DUAL

R-PDMA-G16

3

Not Qualified

TM1062TX3DUA

Pulse Electronics

TELECOM CIRCUIT

MILITARY

GULL WING

28

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

125 Cel

-55 Cel

DUAL

R-PDMA-G28

Not Qualified

30

225

5962-0522101VXC

Texas Instruments

TELECOM CIRCUIT

MILITARY

FLAT

68

DFP

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

MIL-PRF-38535 Class V

2.6 V

2.6

FLATPACK

TPAK68,1.6SQ,25

Other Telecom ICs

.65 mm

125 Cel

-55 Cel

QUAD

2500 Mbps

S-CQFP-F68

2.68 mm

13.97 mm

Qualified

NOT SPECIFIED

NOT SPECIFIED

13.97 mm

SN56514L

Texas Instruments

MILITARY

WIRE

10

ROUND

METAL

BIPOLAR

12,-8

CYLINDRICAL

CAN10,.23

Other Telecom ICs

125 Cel

-55 Cel

BOTTOM

O-MBCY-W10

Not Qualified

5962-9677201QXX

Texas Instruments

TELECOM CIRCUIT

MILITARY

FLAT

68

QFF

SQUARE

CERAMIC, GLASS-SEALED

YES

1

MIL-PRF-38535 Class Q

5 V

FLATPACK

.635 mm

125 Cel

-55 Cel

TIN LEAD

QUAD

S-GQFP-F68

3.912 mm

12.51 mm

Not Qualified

e0

12.51 mm

TSB21LV03MHV

Texas Instruments

TELECOM CIRCUIT

MILITARY

GULL WING

68

QFP

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

3.3 V

FLATPACK

.635 mm

125 Cel

-55 Cel

QUAD

S-CQFP-G68

3.86 mm

12.51 mm

Not Qualified

12.51 mm

5962-0522101VXX

Texas Instruments

TELECOM CIRCUIT

MILITARY

FLAT

68

DFP

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

CMOS

MIL-PRF-38535 Class V

2.6 V

FLATPACK

.65 mm

125 Cel

-55 Cel

QUAD

S-CQFP-F68

2.68 mm

13.97 mm

Qualified

NOT SPECIFIED

NOT SPECIFIED

13.97 mm

SN56514J

Texas Instruments

MILITARY

THROUGH-HOLE

14

DIP

RECTANGULAR

CERAMIC

NO

BIPOLAR

12,-8

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

125 Cel

-55 Cel

DUAL

R-XDIP-T14

Not Qualified

5962-9677201QXA

Texas Instruments

TELECOM CIRCUIT

MILITARY

FLAT

68

QFF

SQUARE

CERAMIC, GLASS-SEALED

YES

1

MIL-PRF-38535 Class Q

5 V

FLATPACK

.635 mm

125 Cel

-55 Cel

QUAD

S-GQFP-F68

3.912 mm

12.51 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

12.51 mm

AD9950TJ

Analog Devices

TELECOM CIRCUIT

MILITARY

J BEND

68

QCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

BIPOLAR

-5.2 V

.054 mA

5 V

5,-5.2

CHIP CARRIER

LDCC68,1.0SQ

Other Telecom ICs

1.27 mm

125 Cel

-55 Cel

TIN LEAD

QUAD

S-CQCC-J68

Not Qualified

e0

ADL5904

Analog Devices

TELECOM CIRCUIT

MILITARY

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-55 Cel

QUAD

S-XQCC-N16

.8 mm

3 mm

3 mm

IMSC004-G20M

STMicroelectronics

MILITARY

PIN/PEG

84

PGA

SQUARE

CERAMIC

NO

CMOS

5 V

5

GRID ARRAY

PGA84,10X10

Other Telecom ICs

2.54 mm

125 Cel

-55 Cel

TIN LEAD

PERPENDICULAR

S-XPGA-P84

Not Qualified

e0

5212A/BPA

NXP Semiconductors

TELECOM CIRCUIT

MILITARY

THROUGH-HOLE

8

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

5 V

IN-LINE

2.54 mm

125 Cel

-55 Cel

DUAL

R-GDIP-T8

5.08 mm

15.24 mm

Not Qualified

602A/BPA

NXP Semiconductors

TELECOM CIRCUIT

MILITARY

DIP

1

BIPOLAR

6 V

125 Cel

-55 Cel

CYW20732YB3ISLGH

Infineon Technologies

TELECOM CIRCUIT

MILITARY

BUTT

27

RECTANGULAR

UNSPECIFIED

YES

1

1.2 V

MICROELECTRONIC ASSEMBLY

125 Cel

-55 Cel

UNSPECIFIED

R-XXMA-B27

.96 mm

3.2 mm

3.5 mm

CYW20732YB3ISLGHT

Infineon Technologies

TELECOM CIRCUIT

MILITARY

BUTT

27

RECTANGULAR

UNSPECIFIED

YES

1

1.2 V

MICROELECTRONIC ASSEMBLY

125 Cel

-55 Cel

UNSPECIFIED

R-XXMA-B27

.96 mm

3.2 mm

3.5 mm

CD22414D

Renesas Electronics

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC

NO

CMOS

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T16

T-1(DS1)

Not Qualified

e0

ISL72027SEHX/SAMPLE

Renesas Electronics

TELECOM CIRCUIT

MILITARY

NO LEAD

26

DIE

RECTANGULAR

75k Rad(Si)

UNSPECIFIED

YES

1

3.3 V

UNCASED CHIP

125 Cel

-55 Cel

GOLD

UPPER

R-XUUC-N26

e4

HC4-55564-8

Renesas Electronics

MILITARY

NO LEAD

20

QCCN

SQUARE

CERAMIC

YES

CMOS

38535Q/M;38534H;883B

5 V

5

CHIP CARRIER

LCC20,.35SQ

Other Telecom ICs

1.27 mm

125 Cel

-55 Cel

QUAD

S-XQCC-N20

Not Qualified

CD22413F

Renesas Electronics

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC

NO

CMOS

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T16

T-1(DS1)

Not Qualified

e0

ICL3221EMVZ-T

Renesas Electronics

TELECOM CIRCUIT

MILITARY

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-55 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.2 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

CD22414F

Renesas Electronics

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC

NO

CMOS

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T16

T-1(DS1)

Not Qualified

e0

ICL3221EMVZ

Renesas Electronics

TELECOM CIRCUIT

MILITARY

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-55 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.2 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

CD22413D

Renesas Electronics

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC

NO

CMOS

IN-LINE

DIP16,.3

Other Telecom ICs

2.54 mm

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T16

T-1(DS1)

Not Qualified

e0

HDMP-2003

Broadcom

TELECOM CIRCUIT

MILITARY

GULL WING

12

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

-5.2 V

FLATPACK

2.54 mm

125 Cel

-55 Cel

QUAD

S-PQFP-G12

3.6 mm

12.7 mm

Not Qualified

12.7 mm

HDMP-2004

Broadcom

TELECOM CIRCUIT

MILITARY

GULL WING

12

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

-5.2 V

FLATPACK

2.54 mm

125 Cel

-55 Cel

QUAD

S-PQFP-G12

3.6 mm

12.7 mm

Not Qualified

12.7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.