GULL WING Other Function Telecom Interface ICs 2,043

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BCM3125	Broadcom	TELECOM CIRCUIT		GULL WING	160	QFP	UNSPECIFIED	PLASTIC/EPOXY	YES	1						FLATPACK							QUAD	X-PQFP-G160	1			Not Qualified
HDMP-2630B	Broadcom	TELECOM CIRCUIT	OTHER	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			3.3 V		FLATPACK			.8 mm	85 Cel	0 Cel		QUAD	S-PQFP-G64		2.35 mm	13.8 mm	Not Qualified				13.8 mm
HDMP-1024	Broadcom	TELECOM CIRCUIT	OTHER	GULL WING	80	HQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, HEAT SINK/SLUG			.8 mm	85 Cel	0 Cel		QUAD	R-PQFP-G80		3.4 mm	13.79 mm	Not Qualified				19.79 mm
ATTL7583BAJ-D	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified	e0	30	225	17.9 mm
LUCL7582BAE	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	110 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e0	30	225	10.3 mm
LG1602AXB	Broadcom	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LQFP	SQUARE	METAL	YES	1		-5.2 V				FLATPACK, LOW PROFILE			.762 mm	75 Cel	0 Cel	TIN LEAD	QUAD	S-MQFP-G16		1.6256 mm	5.842 mm	Not Qualified	e0	30	240	5.842 mm
S5N8950	Samsung	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	176	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V	1.8,1.8/3.3	FLATPACK, FINE PITCH	QFP160,1.0SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G176		3 mm	24 mm	Not Qualified				24 mm
KS3361BD	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G16		1.95 mm	3.95 mm	Not Qualified				9.9 mm
KB8528Q	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		FLATPACK			.75 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G48		2.3 mm	10 mm	Not Qualified				10 mm
KS8664BQ	Samsung		INDUSTRIAL	GULL WING	176	QFP		PLASTIC/EPOXY	YES						2.5/3	FLATPACK	QFP176(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD					Not Qualified	e0
KB8527AQ	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		FLATPACK			.75 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G48		2.3 mm	10 mm	Not Qualified				10 mm
KA8514	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.4 V		SMALL OUTLINE			.65 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G20		1.85 mm	4.4 mm	Not Qualified				6.5 mm
KA8513B	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.4 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G20		1.85 mm	4.4 mm	Not Qualified				6.5 mm
KB8527A	Samsung	TELECOM CIRCUIT		GULL WING	48	LQFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK, LOW PROFILE			.75 mm				QUAD	S-PQFP-G48		1.55 mm	10 mm	Not Qualified				10 mm
KA8513BD	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.4 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDSO-G20		1.85 mm	4.4 mm	Not Qualified	e0			6.5 mm
KB8527BQ	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V	3.6	FLATPACK	QFP48,.5SQ,32	Other Telecom ICs	.75 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G48		2.3 mm	10 mm	Not Qualified				10 mm
KS16121	Samsung	TELECOM CIRCUIT		GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1						FLATPACK			.8 mm				QUAD	R-PQFP-G80		2.45 mm	14 mm	Not Qualified				20 mm
KS8510	Samsung	TELECOM CIRCUIT		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1						FLATPACK			1 mm				QUAD	R-PQFP-G64		2.45 mm	14 mm	Not Qualified				20 mm
S5T8610X01-Q0R0	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	FLATPACK	QFP64,.66SQ,32	Modems	.8 mm	70 Cel	-10 Cel		QUAD	S-PQFP-G64		2.8 mm	14 mm	Not Qualified				14 mm
KA8507D	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.4 V		SMALL OUTLINE			1.27 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G20		2.5 mm	7.5 mm	Not Qualified				12.74 mm
KA3361BD	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.8 mm	3.95 mm	Not Qualified	e0			9.9 mm
KA8514D	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.4 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G20		1.85 mm	4.4 mm	Not Qualified				6.5 mm
S1T8531X01-S0B0	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		.007 mA	3.6 V	3.6	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	70 Cel	-10 Cel		DUAL	R-PDSO-G16		1.95 mm	3.95 mm	Not Qualified				9.9 mm
KA8512D	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDSO-G14		1.8 mm	3.95 mm	Not Qualified	e0			8.56 mm
KA3361D	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G16		1.95 mm	3.95 mm	Not Qualified				9.8 mm
KS8511	Samsung	TELECOM CIRCUIT		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1						FLATPACK			1 mm				QUAD	R-PQFP-G64		2.45 mm	14 mm	Not Qualified				20 mm
KA8513C	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.4 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G20		1.85 mm	4.4 mm	Not Qualified				6.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.