GULL WING Other Function Telecom Interface ICs 2,043

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TA8104F-TP1	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		1 mA	1.4 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified				8.2 mm
TB31301F(EL)	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		20 mA	5 V		FLATPACK			.65 mm	75 Cel	-20 Cel		QUAD		S-PQFP-G64		3.15 mm	12 mm	Not Qualified				12 mm
TA31133FN	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.6 mA	3.5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL		R-PDSO-G16		1.6 mm	4.4 mm	Not Qualified	e0			5 mm
TA31080F-TP1	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			6 V		SMALL OUTLINE, SHRINK PITCH			1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL		R-PDSO-G24		2.2 mm	6 mm	Not Qualified	e0			13 mm
TA1243BFN	Toshiba		COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR	83.5 mA		5,33	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Telecom ICs	.635 mm	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G24				Not Qualified	e0
TA31135F-TP1	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G30		2.7 mm	7.5 mm	Not Qualified				15.4 mm
TA31081F-TP2	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6.2 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified				8.2 mm
TB31301F-TP2	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		20 mA	5 V		FLATPACK			.65 mm	75 Cel	-20 Cel		QUAD		S-PQFP-G64		3.15 mm	12 mm	Not Qualified				12 mm
TA31081F	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6.2 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel	TIN LEAD	DUAL		R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
TC35191F	Toshiba	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					FLATPACK							QUAD		R-PQFP-G100				Not Qualified		NOT SPECIFIED	240
TA31081F(EL)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		6.2 mA	5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified				8.2 mm
TA31080F	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			6 V		SMALL OUTLINE, SHRINK PITCH			1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL		R-PDSO-G24		2.2 mm	6 mm	Not Qualified	e0			13 mm
TC90207FG	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
TA31056F-TP1	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		8.5 mA	3 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL		R-PDSO-G8		1.9 mm	4.4 mm	Not Qualified		NOT SPECIFIED	240	5 mm
TB6865AFG	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G100		1.7 mm	14 mm			NOT SPECIFIED	NOT SPECIFIED	14 mm
TA31135F	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G30		2.7 mm	7.5 mm	Not Qualified				15.4 mm
TB31301F	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		20 mA	5 V		FLATPACK			.65 mm	75 Cel	-20 Cel		QUAD		S-PQFP-G64		3.15 mm	12 mm	Not Qualified				12 mm
TA31135F(EL)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G30		2.7 mm	7.5 mm	Not Qualified				15.4 mm
TB31301F-TP1	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		20 mA	5 V		FLATPACK			.65 mm	75 Cel	-20 Cel		QUAD		S-PQFP-G64		3.15 mm	12 mm	Not Qualified				12 mm
TA8104F-TP2	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		1 mA	1.4 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL		R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified				8.2 mm
TA31135F(ER)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel	TIN LEAD	DUAL		R-PDSO-G30		2.7 mm	7.5 mm	Not Qualified	e0			15.4 mm
TA31135F-TP2	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G30		2.7 mm	7.5 mm	Not Qualified				15.4 mm
TA32032F	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL		R-PDSO-G16		1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm
82V3285DQ8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK				85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G100	3				e0	20	240
IDT82V3001APVG8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G56	1	2.794 mm	7.5 mm	Not Qualified	e3	30	260	18.415 mm
ISL32175EIBZ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		SMALL OUTLINE	sop16,.24		1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	80 Mbps	R-PDSO-G16		1.75 mm	3.9 mm		e3			9.9 mm
82V3255DK	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e0			10 mm
IDT82V3255TF8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e0	30	240	10 mm
82V3380DQ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G100	3	1.4 mm	14 mm	Not Qualified	e0	20	240	14 mm
IDT82V3280DQ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	e0	20	240	14 mm
HKT100XXXU	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING		SOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE	SOP(UNSPEC)	Other Telecom ICs		40 Cel	0 Cel		DUAL						Not Qualified
IDT82V3002PV8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G56	1	2.794 mm	7.5 mm	Not Qualified	e0			18.415 mm
UPC8139GR-7JH	Renesas Electronics		COMMERCIAL EXTENDED	GULL WING	30	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR	49 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP30,.25,20	Other Telecom ICs	.5 mm	80 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G30				Not Qualified	e0
IDT82V3012PVG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G56	1	2.794 mm	7.5 mm	Not Qualified	e3	30	260	18.415 mm
UPC8220T5A-E1	Renesas Electronics	TELECOM CIRCUIT	OTHER	GULL WING	16	HVSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE			.4 mm	70 Cel	-30 Cel	TIN LEAD	DUAL		R-PDSO-G16		.6 mm	2.3 mm	Not Qualified	e0			3.3 mm
82V3380EQG8	Renesas Electronics		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES			528 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G100	3			Not Qualified	e3	30	260
82V3285AEQG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.528 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	e3	30	260	14 mm
82V3385PF	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1		.528 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD		S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	e0	20	240	14 mm
82V3385PFGI8	Renesas Electronics		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES			528 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G100	3			Not Qualified	e3	30	260
X9522V20I-AT1	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G20	1	1.2 mm	4.4 mm	Not Qualified	e0			6.5 mm
ICS9536-01	Renesas Electronics	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK			.8 mm			TIN LEAD	QUAD		S-PQFP-G64		2.45 mm	14 mm	Not Qualified	e0			14 mm
IDT82V3002PV	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL		R-PDSO-G56	1	2.794 mm	7.5 mm	Not Qualified	e0	20	225	18.415 mm
82V3002APVG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G56	1	2.794 mm	7.5 mm	Not Qualified	e3	30	260	18.415 mm
82V3358TF	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.464 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e0			10 mm
IDT82V3010PVG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G56	1	2.794 mm	7.493 mm	Not Qualified	e3	30	260	18.415 mm
82V3280PFG8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G100	3	1.6 mm	14 mm		e3	30	260	14 mm
HKT100Y01U	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING		SOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE	SOP(UNSPEC)	Other Telecom ICs		40 Cel	0 Cel		DUAL						Not Qualified
82V3358EDG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.464 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e3	30	260	10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.