GULL WING Other Function Telecom Interface ICs 2,043

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3772CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3765CUB+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.09 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3751CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e3			4.89 mm
DS2172T+T&R	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX3752CCM	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e0			7 mm
DS1360SN	Maxim Integrated	TELECOM CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL	R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e0			12.8 mm
MAX3265CUE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
MAX3772CEE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX3264CUE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
MAX3773CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
DS21372	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, THIN PROFILE			.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
MAX3120CSA+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e3			4.9 mm
DS2172T/T&R	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
DS21372N	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
MAX3267ESA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3532EAX	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		90 mA	5 V		SMALL OUTLINE, SHRINK PITCH			.8 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G36	1	2.64 mm	7.495 mm	Not Qualified	e0			15.415 mm
MAX3265EUE+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
MAX3751CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.078 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3775CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.164 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX3269CUB+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.078 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3265EUE-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
MAX3775CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.164 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3768CUB+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3773CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3965CEP+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	1.73 mm	3.9 mm	Not Qualified	e3			8.65 mm
MAX3265CUE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
MAX3963CSA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.02 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3267CSA+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
DS2172TN+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX3266CSA-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3765CUB+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3532EAX-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		90 mA	5 V		SMALL OUTLINE, SHRINK PITCH			.8 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G36	1	2.64 mm	7.495 mm	Not Qualified	e0			15.415 mm
MAX3267CSA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.05 mA	3.3 V	3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3775CEE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel		DUAL	R-PDSO-G16		1.65 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4.89 mm
DS21372T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, THIN PROFILE			.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
MAX3265CUB+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
DS2172TN/T&R	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
MAX3268CUB+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3772CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3267CSA+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3			4.9 mm
MAX3752CCM-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e0			7 mm
MAX3765CUB-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e0	20	240	3 mm
MAX3965CEP	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.04 mA	3.3 V	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.25	ATM/SONET/SDH ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.73 mm	3.9 mm	Not Qualified	e0			8.65 mm
MAX3120CSA-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3264CUE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
MAX5935EAX+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G36	1	2.65 mm	7.5 mm		e3	30	260	15.375 mm
MAX1470EUI	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified	e0		245	9.7 mm
MAX2740ECM	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.0843 mA	3 V	3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G48		1.2 mm	7 mm	Not Qualified	e0	20	240	7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.