Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.0095 mA |
3 V |
3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-25 Cel |
TIN |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
38 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G38 |
1.2 mm |
4.4 mm |
9.7 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
38 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G38 |
3 |
1.2 mm |
4.4 mm |
9.7 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
70 Cel |
-20 Cel |
DUAL |
S-PDSO-G10 |
1.1 mm |
3 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
105 Cel |
-40 Cel |
DUAL |
R-PDSO-G28 |
1.2 mm |
4.4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9.7 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
105 Cel |
-40 Cel |
DUAL |
R-PDSO-G28 |
3 |
1.2 mm |
4.4 mm |
9.7 mm |
||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
3 V |
3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G16 |
1.2 mm |
4.4 mm |
Not Qualified |
5 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
105 Cel |
-40 Cel |
DUAL |
R-PDSO-G28 |
1.2 mm |
4.4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9.7 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G16 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
5 mm |
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Infineon Technologies |
COMMERCIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BIPOLAR |
40 mA |
11 V |
11 |
SMALL OUTLINE |
SOP20,.4 |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G20 |
Not Qualified |
e0 |
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|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.015 mA |
3.3 V |
3.3,5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Other Telecom ICs |
.65 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G28 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
260 |
9.7 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.021 mA |
3 V |
3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Other Telecom ICs |
.5 mm |
125 Cel |
-40 Cel |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
-20 Cel |
DUAL |
R-PDSO-G28 |
1.2 mm |
4.4 mm |
Not Qualified |
9.7 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G28 |
1.2 mm |
4.4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9.7 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G28 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
9.7 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
38 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
2.5/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP38,.25,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G38 |
1.2 mm |
4.4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
9.7 mm |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
105 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G28 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
e3 |
9.7 mm |
|||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.0079 mA |
5 V |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Other Telecom ICs |
.65 mm |
105 Cel |
-40 Cel |
DUAL |
R-PDSO-G28 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
260 |
9.7 mm |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.0075 mA |
5 V |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Other Telecom ICs |
.65 mm |
105 Cel |
-40 Cel |
DUAL |
R-PDSO-G28 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
260 |
9.7 mm |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.0046 mA |
3 V |
3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Other Telecom ICs |
.5 mm |
70 Cel |
-20 Cel |
MATTE TIN |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.0095 mA |
3 V |
2.1/4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G16 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
38 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G38 |
3 |
1.2 mm |
4.4 mm |
260 |
9.7 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
38 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G38 |
3 |
1.2 mm |
4.4 mm |
9.7 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
.155 mA |
5 V |
5 |
SMALL OUTLINE |
SOP28,.4 |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
400 Mbps |
R-PDSO-G28 |
3 |
2.67 mm |
7.505 mm |
Not Qualified |
e4 |
30 |
260 |
17.905 mm |
|||||||||||||||||||||||||||||||
Diodes Incorporated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
18 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.3 V |
3.3 |
SMALL OUTLINE |
SO18(UNSPEC) |
Other Telecom ICs |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G18 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
Diodes Incorporated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
5 |
SMALL OUTLINE |
SOP20(UNSPEC) |
Other Telecom ICs |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G20 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
Diodes Incorporated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
3 V |
3 |
SMALL OUTLINE |
SOP16(UNSPEC) |
Other Telecom ICs |
55 Cel |
-10 Cel |
DUAL |
R-PDSO-G16 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||
Diodes Incorporated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
5 |
SMALL OUTLINE |
SOP24(UNSPEC) |
Other Telecom ICs |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1.1 mm |
2.95 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1.1 mm |
2.95 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
TELECOM CIRCUIT |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1.1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
HLSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH |
.635 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1.65 mm |
3.9 mm |
Not Qualified |
e0 |
4.89 mm |
|||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.04 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.25 |
ATM/SONET/SDH ICs |
.635 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
8.65 mm |
||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
10 |
HTSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.078 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
ATM/SONET/SDH ICs |
.5 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn85Pb15) |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
20 |
240 |
3 mm |
|||||||||||||||||||||||||||||||||
|
Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, THIN PROFILE |
.8 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
|||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, THIN PROFILE |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
HLSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.195 mA |
3.3 V |
3.3 |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH |
SSOP16,.25 |
Other Telecom ICs |
.635 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
1.65 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.89 mm |
|||||||||||||||||||||||||||||||||
|
Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK, THIN PROFILE |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
1 |
1.2 mm |
7 mm |
Not Qualified |
e3 |
7 mm |
|||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
1.73 mm |
3.9 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
4.89 mm |
|||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
10 |
HTSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.09 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
ATM/SONET/SDH ICs |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
20 |
240 |
3 mm |
|||||||||||||||||||||||||||||||||
|
Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.076 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
ATM/SONET/SDH ICs |
.65 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
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Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
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Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.062 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
ATM/SONET/SDH ICs |
.65 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e0 |
5 mm |
|||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
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Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.04 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.25 |
ATM/SONET/SDH ICs |
.635 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
8.65 mm |
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Maxim Integrated |
TELECOM CIRCUIT |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e0 |
12.8 mm |
||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
10 |
HTSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.076 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
ATM/SONET/SDH ICs |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
20 |
240 |
3 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.