GULL WING Other Function Telecom Interface ICs 2,043

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	ISDN Access Rate	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Output High Voltage	Maximum Output Low Voltage	Standard	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Reference Point	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Maximum Output Low Current	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SA607D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V			SMALL OUTLINE			1.27 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G20			2.65 mm	7.5 mm	Not Qualified					12.8 mm
SA602AD/N,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			6 V			SMALL OUTLINE			1.27 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G8			1.75 mm	3.9 mm						4.9 mm
SA616DK,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G20		1	1.5 mm	4.4 mm	Not Qualified					6.5 mm
SA607DK/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G20			1.5 mm	4.4 mm						6.5 mm
SA607DK/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		1	1.5 mm	4.4 mm	Not Qualified		e4			6.5 mm
SA606DK-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel	Tin/Lead (Sn85Pb15)	DUAL		R-PDSO-G20			1.5 mm	4.4 mm	Not Qualified		e0			6.5 mm
SA616DK-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel	Tin/Lead (Sn85Pb15)	DUAL		R-PDSO-G20			1.5 mm	4.4 mm	Not Qualified		e0			6.5 mm
SA616DK,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G20			1.5 mm	4.4 mm	Not Qualified			40	260	6.5 mm
SA607DK,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G20			1.5 mm	4.4 mm	Not Qualified			40	260	6.5 mm
SA607D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V			SMALL OUTLINE			1.27 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G20			2.65 mm	7.5 mm	Not Qualified					12.8 mm
SA606D/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		1	1.5 mm	4.4 mm	Not Qualified		e4			6.5 mm
MFRC531	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V			SMALL OUTLINE										DUAL		R-PDSO-G32					Not Qualified
HTRC12002B	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V	3/5		FLATPACK	QFP32,.35SQ,32	Telecom Encryption Circuits	.8 mm							QUAD		S-PQFP-G32					Not Qualified
SA602AD/N,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			6 V			SMALL OUTLINE			1.27 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G8			1.75 mm	3.9 mm						4.9 mm
SA616DKY	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G20			1.5 mm	4.4 mm						6.5 mm
SA606DK/02	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G20			1.5 mm	4.4 mm						6.5 mm
SA607DK/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		1	1.5 mm	4.4 mm	Not Qualified		e4			6.5 mm
PMB2401-S	Infineon Technologies		OTHER	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR	.03 mA	5 V	5		SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.635 mm	85 Cel				-25 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G28					Not Qualified		e0
PMB2240-F	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V			FLATPACK				85 Cel				-30 Cel		QUAD		S-PQFP-G48					Not Qualified
PSB2168	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			FLATPACK			.65 mm	70 Cel				0 Cel	TIN LEAD	QUAD		S-PQFP-G80			2.45 mm	14 mm	Not Qualified		e0			14 mm
PMB2905-F	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V			FLATPACK										QUAD		S-PQFP-G64					Not Qualified
PTGA090304MD	Infineon Technologies	TELECOM CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE										DUAL		R-PDSO-G14			2.62 mm	9.02 mm						14.94 mm
PSB7110FV1.0	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.6 V	3.6,5		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G100			1.6 mm	14 mm	Not Qualified		e0			14 mm
PMB2408V1.1	Infineon Technologies		INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR	51.3 mA		2.7/4.5		FLATPACK	TQFP48,.35SQ	Other Telecom ICs	.5 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G48					Not Qualified		e0
PEF8091H	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK										QUAD		S-PQFP-G64					Not Qualified
PMB2727-H	Infineon Technologies	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V			FLATPACK			.65 mm							QUAD		R-PQFP-G100			3.4 mm	14 mm	Not Qualified					20 mm
PSB21150FV14XQMA1	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel	MATTE TIN	QUAD		S-PQFP-G64			1.6 mm	10 mm			e3	40	260	10 mm
PSB21150F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel		QUAD	.144 Mbps	S-PQFP-G64	S/T		1.6 mm	10 mm	Not Qualified	4.5 Amp				10 mm
PEB31664V1.3	Infineon Technologies		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		BICMOS	125 mA	3.3 V	3.3		FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G64					Not Qualified		e0
PSB7110FV1.1	Infineon Technologies		COMMERCIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			3.6,5		FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G100					Not Qualified		e0
PSB4596	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Modems	.65 mm	70 Cel				0 Cel	TIN LEAD	DUAL		R-PDSO-G28			1.2 mm	4.4 mm	Not Qualified		e0			9.7 mm
PSB4851	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3,5		SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel				0 Cel	TIN LEAD	DUAL		R-PDSO-G28			2.65 mm	7.6 mm	Not Qualified		e0			18.1 mm
PMB2245-F	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V			FLATPACK				85 Cel				-30 Cel		QUAD		S-PQFP-G48					Not Qualified
PEB31666	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			FLATPACK				85 Cel				-40 Cel		QUAD		S-PQFP-G64					Not Qualified
PEB2023T	Infineon Technologies	TELECOM CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE										DUAL		R-PDSO-G14					Not Qualified
PMB2200T-16	Infineon Technologies		OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			48 mA	5 V	5		SMALL OUTLINE	SOP16,.4	Other Telecom ICs	1.27 mm	70 Cel				-25 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G16					Not Qualified		e0
PEB2026T-P	Infineon Technologies	TELECOM CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm							DUAL		R-PDSO-G20			3.5 mm	11 mm	Not Qualified					15.9 mm
PEB22713	Infineon Technologies	TELECOM CIRCUIT		GULL WING	44	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1						FLATPACK										QUAD		R-PQFP-G44					Not Qualified
PEB22711	Infineon Technologies	TELECOM CIRCUIT		GULL WING	44	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1						FLATPACK										QUAD		R-PQFP-G44					Not Qualified
PMB2708-F	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V			FLATPACK										QUAD		S-PQFP-G64					Not Qualified
PSB2115F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T		1.6 mm	10 mm	Not Qualified	7 Amp	e0			10 mm
PMB27201	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	128		SQUARE	PLASTIC/EPOXY	YES	1			5 V			FLATPACK				85 Cel				-30 Cel		QUAD		S-PQFP-G128					Not Qualified
PSB4400T	Infineon Technologies		COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR	1.45 mA		1.6/7.5		SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G20					Not Qualified		e0
PEB8191	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PEB20571	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.275 mA	3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G100			1.6 mm	14 mm	Not Qualified					14 mm
PEF8191H	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	BASIC	FLATPACK	QFP64,.66SQ,32	Digital Transmission Interfaces	.8 mm	85 Cel	2.4 V	.45 V	ANSI T1.601	-40 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T TO U (NT-1)				Not Qualified	7 Amp	e0
PEB2026T-S	Infineon Technologies	TELECOM CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm							DUAL		R-PDSO-G20			2.65 mm	7.6 mm	Not Qualified					12.8 mm
PSB7110FV1.2	Infineon Technologies		COMMERCIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			3.6,5		FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G100					Not Qualified		e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.