GULL WING Other Function Telecom Interface ICs 2,043

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TDA8040TD-T	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V		SMALL OUTLINE			1.27 mm				DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
UJA1023T/2R04/C	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
NE5751D-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
NE5214D	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE				70 Cel	0 Cel		DUAL	R-PDSO-G20				Not Qualified
UAA2072M	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		4.8 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
SA5222D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
SL3S1202FTT	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				SMALL OUTLINE			.65 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified				3 mm
SA5214D/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified	e4			12.8 mm
TEA1094TD	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		4.4 mA	5 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
SA5753DK-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
PCF5075	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
TZA3023T/C3	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
SA5225D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
NE5900DK	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				10.3 mm
SA5753D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified				12.8 mm
PCF50732H	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.5 V	2.7	FLATPACK	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin (Sn)	QUAD	S-PQFP-G48				Not Qualified	e3
PCD3316TD-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				10.3 mm
SA5751D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
NE571D-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		4.8 mA	6 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				10.3 mm
TEA1094T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	4.4 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Telephone Circuits	1.27 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified	e4			17.9 mm
TEA1094TD-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		4.4 mA	5 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
935166750112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6.5 mm
UAA2072MDK	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			4.8 V		SMALL OUTLINE				70 Cel	-20 Cel		DUAL	R-PDSO-G20				Not Qualified
935263881112	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2 mm	5.3 mm	Not Qualified				10.2 mm
935263530112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.1 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
SA575K	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
935262696112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	9.9 mm
935266812112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
TDA8003TSDB-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24		2 mm	5.3 mm	Not Qualified		40	260	8.2 mm
TZA3023T-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
SA5211D,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified		40	260	8.65 mm
SA3600DH	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified				7.8 mm
TDA8010M	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	80 Cel	-20 Cel	TIN LEAD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e0			6.5 mm
TDA8012AM/C1	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	80 Cel	-10 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
935263971112	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
TZA3043BT	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	ECL	.047 mA	5 V	3.3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8				Not Qualified	e4
TDA8040TD	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V		SMALL OUTLINE			1.27 mm				DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
935262696118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	9.9 mm
TEA1081TD	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			4 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
SA3600	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified	e4			7.8 mm
SA571D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		4.8 mA	6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				10.3 mm
935260091112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1		4 mm	Not Qualified	e4			8.75 mm
SA5217D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		13.5 mA	5 V	5	SMALL OUTLINE	SOP20,.4	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified	e4			12.8 mm
PCD3316T/2D	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e0			10.3 mm
SA5211D/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
PCA5075	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE				70 Cel	-40 Cel		DUAL	R-PDSO-G20				Not Qualified
SA575ADK-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL	R-PDSO-G20				Not Qualified
PCF5078T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.1 mm	3 mm	Not Qualified				3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.