GULL WING Other Function Telecom Interface ICs 2,043

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PCD5071-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					5 V		FLATPACK				70 Cel	-25 Cel		QUAD		S-PQFP-G44				Not Qualified
TEA1081T/C2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						4 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
935263011118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL		R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	10.3 mm
TEA1083AT	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		0 V		.004 mA	3.6 V	3.6	SMALL OUTLINE	SOP16,.4	Telecom Signaling Circuits	1.27 mm	75 Cel	-25 Cel		DUAL		R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				10.3 mm
SA5753K	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
935241000118	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	80 Cel	-10 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
SA575AD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-G20				Not Qualified
935263881118	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS					3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL		R-PDSO-G28		2 mm	5.3 mm	Not Qualified				10.2 mm
SA9025BE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS					3.75 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
MC33596FJE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G32	3	1.6 mm	5 mm		e3	40	260	5 mm
MC33696FJER2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32		1.6 mm	5 mm			40	260	5 mm
MC3356DW	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		2.65 mm	7.5 mm					12.8 mm
MC33742PEG/R2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V	5.5/18	SMALL OUTLINE		Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified	e3	40	260	17.925 mm
MC33742PEG	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES					1	.045 mA		5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G28	3			Not Qualified	e3	40	260
MC33596FJAER2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel		QUAD		S-PQFP-G32		1.6 mm	5 mm			40	260	5 mm
MC33660EFR2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm		e3			4.9 mm
MC33742SPEG/R2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V	5.5/18	SMALL OUTLINE		Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified	e3	40	260	17.925 mm
MC33696FJE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G32	3	1.6 mm	5 mm		e3	40	260	5 mm
MC33742SPEG	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES					1	.045 mA		5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G28	3			Not Qualified	e3	40	260
MC13055D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm					9.9 mm
MC33696FJAER2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel		QUAD		S-PQFP-G32		1.6 mm	5 mm			40	260	5 mm
MC33596FJER2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G32	3	1.6 mm	5 mm		e3	40	260	5 mm
MC13155D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								SMALL OUTLINE	sop16,.24		1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		1.75 mm	4.9 mm					9.9 mm
MC33596FJAE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel	TIN	QUAD		S-PQFP-G32	3	1.6 mm	5 mm		e3	40	260	5 mm
MC33111D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm					9.9 mm
935311368528	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	105 Cel	-40 Cel	TIN	QUAD		S-PQFP-G64	3	1.6 mm	10 mm		e3	40	260	10 mm
MC145446AFW	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm	70 Cel	-20 Cel		DUAL		R-PDSO-G28		2.65 mm	7.51 mm					17.9 mm
MC33696FJAE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel	TIN	QUAD		S-PQFP-G32	3	1.6 mm	5 mm		e3	40	260	5 mm
SA606D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		40	260	12.8 mm
SA606DK/03,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
SA607DK-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e0			6.5 mm
SA636DK,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
SA636DK	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		40	260	6.5 mm
SA606D,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified				12.8 mm
SA606D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified				12.8 mm
SA639DH-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified				7.8 mm
HTRC12002B/03D	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		FLATPACK, LOW PROFILE			.8 mm	70 Cel	-25 Cel		QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified				7 mm
SA607DK	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		40	260	6.5 mm
SA606DK/03	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
SA636DK/02	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25		.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
SA636DK,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		40	260	6.5 mm
SA639	NXP Semiconductors		INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR						3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24				Not Qualified
SA606DK/02,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
SA606D,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		40	260	12.8 mm
SA607DK,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
SA636DK-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
MFRC53001T/0FE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified				20.5 mm
SA606D/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		2.65 mm	7.5 mm					12.8 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.