GULL WING Other Function Telecom Interface ICs 2,043

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TEA1083AT-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		0 V		3.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				10.3 mm
MWCT1001AVLHR	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQFP-G64	3	1.6 mm	10 mm		e3	40	260	10 mm
935262794557	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	20 mm
TDA8012AM	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	80 Cel	-10 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
TEA1094AT	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			4.4 mA	5 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified	e4			15.4 mm
TEA1094AM-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			4.4 mA	5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G24		2 mm	5.3 mm	Not Qualified				8.2 mm
SA1620BE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				90 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
SL3S1002FTT,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		30	260	3 mm
TEA1081TD-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					4 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
SA5212AD/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
PR601HL/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD	S-PQFP-G100		1.6 mm	14 mm					14 mm
PCF5075T/F2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
UAA2072MDK-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					4.8 V		SMALL OUTLINE				70 Cel	-20 Cel		DUAL	R-PDSO-G20				Not Qualified
NE575ADK	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE				70 Cel	0 Cel		DUAL	R-PDSO-G20				Not Qualified
935263971118	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				3.3 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
TDA8051T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR				5 V	5	SMALL OUTLINE	SOP32,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified				20.5 mm
935030750602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
935051630602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified	e4			12.8 mm
TZA3023TD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
935166750118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6.5 mm
TZA3043T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			.062 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8				Not Qualified	e4
UAA3202M	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.7 mA	3.5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified	e4			7.2 mm
SA58646BD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin (Sn)	QUAD	S-PQFP-G64	1	1.6 mm	10 mm	Not Qualified	e3	30	260	10 mm
PCD3316T/2,112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e0	NOT SPECIFIED	NOT SPECIFIED	10.3 mm
935201030112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
UAA3201T/V1,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES							3.5/6	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16				Not Qualified
CD8404BE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				4.8 V	4.8	FLATPACK	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48				Not Qualified
NE575D	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified				12.8 mm
SA5217D/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e4			12.8 mm
935260674518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL	R-PDSO-G24				Not Qualified
SA5214D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				41.2 mA	5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e4			12.8 mm
935054340112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6.5 mm
PCA1070T-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	60 Cel	-10 Cel		DUAL	R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified				15.4 mm
PCA5010H/XXX	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.2 V		FLATPACK				55 Cel	-10 Cel		QUAD	S-PQFP-G48				Not Qualified
PCD3316T/2D-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e0			10.3 mm
TEA1093T-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				140 mA	3.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
MWCT1013VLHST	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G64		1.6 mm	10 mm					10 mm
TDA8044AHBA	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
SA5212AD,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.033 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		40	260	4.9 mm
UAA3220TS/V1S,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24	1	2 mm	5.3 mm				260	8.2 mm
TZA3044T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	ECL			.049 mA	3.3 V	3.3	SMALL OUTLINE	SOP16,.25	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16				Not Qualified	e4
PCD5093H	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm				QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
SA575K-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
NE575AD-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE				70 Cel	0 Cel		DUAL	R-PDSO-G20				Not Qualified
NE575K-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
TZA3033TD-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
NE5225D-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE				70 Cel	0 Cel		DUAL	R-PDSO-G16				Not Qualified
NE5750D-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified				15.4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.