GULL WING Other Function Telecom Interface ICs 2,043

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Hybrid	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Battery Feed	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
STM7E1AR	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		-3.3 V		3.3 V		+-3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified		e4	30	260	10 mm
ST20GP6X33S	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V			FLATPACK			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQFP-G100		3.4 mm	14 mm	Not Qualified		e4			20 mm
FC106/14	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		3.3	FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-PQFP-G64		2.35 mm	14 mm	Not Qualified		e0			14 mm
L3845-20	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE	SOP20,.4	Analog Transmission Interfaces	1.27 mm	70 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		e4			12.8 mm
ST20GP1X33S	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V			FLATPACK			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-PQFP-G100		3.4 mm	14 mm	Not Qualified		e4			20 mm
LS656D1	STMicroelectronics		OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		2 mA	2.5 V		2.5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	70 Cel		-45 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G20				Not Qualified		e0
ST952	STMicroelectronics		INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES		HYBRID						FLATPACK	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G32				Not Qualified		e0
ST75C530	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			150 mA	5 V			FLATPACK, LOW PROFILE			.65 mm	70 Cel		0 Cel		QUAD	S-PQFP-G80		1.6 mm	14 mm	Not Qualified					14 mm
STLC5466	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G176		1.6 mm	24 mm	Not Qualified		e4			24 mm
STLC1512	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e4			7 mm
STV0360	STMicroelectronics	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, LOW PROFILE, FINE PITCH			.5 mm					QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified					10 mm
STV0297E	STMicroelectronics	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified		e4	30	260	10 mm
L3000NSOT	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		-5 V		5 V			SMALL OUTLINE, HEAT SINK/SLUG			1.27 mm	70 Cel		0 Cel		DUAL	R-PDSO-G20		3.6 mm	11 mm	Not Qualified					15.9 mm
CRX14-MQ/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V			SMALL OUTLINE			1.27 mm	85 Cel		-20 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified					9.9 mm
STV0196	STMicroelectronics		OTHER	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES				480 mA	3.3 V		3.3	FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	85 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G64				Not Qualified		e0
STV0288	STMicroelectronics	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE, FINE PITCH			.5 mm					QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified					10 mm
STLC5465B	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		5	FLATPACK	QFP160,1.2SQ	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G160		4.07 mm	28 mm	Not Qualified		e4			28 mm
ST70134	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Modems	.5 mm	80 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified		e4			10 mm
L3845D	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				20 V		20	SMALL OUTLINE	SOP8,.25	Analog Transmission Interfaces	1.27 mm	70 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		e4			4.9 mm
L3000NSO	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	-5 V		5 V	2-4 CONVERSION	+-5	SMALL OUTLINE, HEAT SINK/SLUG	SOP20,.56	Analog Transmission Interfaces	1.27 mm	70 Cel	-48 AND +72	0 Cel	TIN LEAD	DUAL	R-PDSO-G20		3.6 mm	11 mm	Not Qualified	RESISTIVE	e0			15.9 mm
STC1041-F10S	STMicroelectronics		OTHER	GULL WING	208	QFP	SQUARE	CERAMIC	YES		CMOS			5 V		5	FLATPACK	QFP208,1.2SQ,20	Other Telecom ICs	.5 mm	100 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-XQFP-G208				Not Qualified		e0
FC106/10	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		3.3	FLATPACK, FINE PITCH	QFP64,.51SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-PQFP-G64		2.45 mm	10 mm	Not Qualified		e0			10 mm
CR14-MQ/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V			SMALL OUTLINE			1.27 mm	85 Cel		-20 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified					9.9 mm
ST7590T	STMicroelectronics		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS		30 mA	18 V		18	FLATPACK	TQFP100,.63SQ	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	QUAD	S-PQFP-G100	3			Not Qualified		e1	30	260
MTC20455PQ-I	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		1.8,3.3	FLATPACK	QFP160,1.2SQ	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQFP-G160		4.07 mm	28 mm	Not Qualified		e4			28 mm
MTC20454-TQ-I	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQFP-G100		1.6 mm	14 mm	Not Qualified		e4			14 mm
STC104	STMicroelectronics		OTHER	GULL WING	208	QFP	SQUARE	CERAMIC	YES		CMOS			5 V		5	FLATPACK	QFP208,1.2SQ,20	Other Telecom ICs	.5 mm	100 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-XQFP-G208				Not Qualified		e0
TEA7530FP	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.03 mA	3 V		3	SMALL OUTLINE	DIP8,.3	Telephone Circuits	1.27 mm	70 Cel		-20 Cel	TIN LEAD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		e0			4.9 mm
LS025M	STMicroelectronics		OTHER	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		2.5 mA			-12/-30	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel		-25 Cel		DUAL	R-PDSO-G14				Not Qualified
STLC60133	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		-6 V		6 V			SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified		e0			9.7 mm
STLC1502	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V			FLATPACK, FINE PITCH			.5 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified		e4			28 mm
TDA7541W	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			8.5 V			FLATPACK				85 Cel		-40 Cel		QUAD	S-PQFP-G64				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
TDA7541	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			8.5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	10 mm
TDA7541WTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			8.5 V			FLATPACK				85 Cel		-40 Cel		QUAD	S-PQFP-G64				Not Qualified
TDA7541B	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			8.5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified		e4	30	260	10 mm
TDA7541BWTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			8.5 V			FLATPACK				85 Cel		-40 Cel	TIN SILVER COPPER	QUAD	S-PQFP-G64	3			Not Qualified		e1	30	260
TDA7541BW	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			8.5 V			FLATPACK				85 Cel		-40 Cel	TIN SILVER COPPER	QUAD	S-PQFP-G64	3			Not Qualified		e1	30	260
TDA7541TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			8.5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified					10 mm
TDA7541BTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			8.5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified		e4	30	260	10 mm
UAA3202M-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			4.7 mA	3.5 V			SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified		e4			7.2 mm
SA9025BE-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.75 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified					7 mm
TZA3044T/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V			SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified					9.9 mm
TDA8010AM-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	80 Cel		-20 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified					6.5 mm
UAA3220TS/V1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V			SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G24		2 mm	5.3 mm						8.2 mm
TEA1081T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V			SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified					4.9 mm
SA9024BE-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.75 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified					7 mm
933897020112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V			SMALL OUTLINE			1.27 mm	70 Cel		-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		e4			4.9 mm
TZA3044BTT/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		1.1 mm	4.4 mm	Not Qualified					5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.