Cypress Semiconductor Other Function Telecom Interface ICs 18

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CYRF7936-40LFXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.4 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-XQCC-N40	3	1 mm	6 mm	Not Qualified		e3	20	260	6 mm
CY7B933-JI	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	160 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified		e0			11.5316 mm
CY7B933-JIT	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	160 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-J28		4.572 mm	11.5316 mm	Not Qualified		e0			11.5316 mm
CY7B923-SC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	85 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G28	1	2.67 mm	7.5 mm	Not Qualified		e0	30	225	17.905 mm
CYBLE-212019-00	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2 mm	14.52 mm				NOT SPECIFIED	NOT SPECIFIED	19.2 mm
CYBLE-212023-10	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2 mm	14.52 mm				NOT SPECIFIED	NOT SPECIFIED	19.2 mm
CY7B9234-270JXCT	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified		e3	20	260	11.5316 mm
CY7B923-JI	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	95 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified		e0			11.5316 mm
CYRF6936-40LTXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N40	3	1 mm	6 mm	Not Qualified		e4	20	260	6 mm
CY7B9334-270JXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J28		4.572 mm	11.5316 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	11.5316 mm
CY7B923-JC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	85 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J28	3	4.57 mm	11.53 mm	Not Qualified		e0			11.53 mm
BCM20733A3KML1G	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel		QUAD		S-XQCC-N56		1 mm	7 mm						7 mm
BCM20736A1KML2G	Cypress Semiconductor	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-XQCC-N32		1 mm	5 mm						5 mm
BCM20736E	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	BUTT	48	TFLGA	SQUARE	UNSPECIFIED	YES	1					GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B48		1.18 mm	6.5 mm						6.5 mm
BCM43438KUBGT	Cypress Semiconductor	TELECOM CIRCUIT	OTHER	BALL	63	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B63		.55 mm	2.87 mm						4.87 mm
BCM43570KFFBG	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	BALL	242	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA242,23X23,16		.4 mm	60 Cel	0 Cel		BOTTOM	867 Mbps	S-PBGA-B242		1.05 mm	10 mm		Also has 1.2 V core supply				10 mm
CYBLE-214009-00	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		SQUARE	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			.66 mm	85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N32		1.8 mm	11 mm				NOT SPECIFIED	NOT SPECIFIED	11 mm
CYBLE-222005-00	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	22		SQUARE	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N22		1.6 mm	10 mm						10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.