Toshiba Other Function Telecom Interface ICs 118

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

TC35678FSG-002

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N40

.9 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

TC9560XBG

Toshiba

TELECOM CIRCUIT

TC35681FSG-002

Toshiba

TELECOM CIRCUIT

TODX280A

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

10

RECTANGULAR

UNSPECIFIED

NO

1

5 V

FIBER OPTIC

85 Cel

-40 Cel

UNSPECIFIED

R-XXFO-X10

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

TA31056F-TP2

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

8.5 mA

3 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G8

1.9 mm

4.4 mm

Not Qualified

NOT SPECIFIED

240

5 mm

TC35661IDBG-203

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1.4 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TA8513P

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

2.54 mm

85 Cel

-40 Cel

DUAL

R-PDIP-T8

5 mm

7.62 mm

Not Qualified

TB6860WBG

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BALL

39

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B39

.66 mm

2.65 mm

4.25 mm

TC35661DBG-203

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1.4 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TA31133FN-TP1

Toshiba

TELECOM CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.6 mA

3.5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

5 mm

TC7765WBG

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BUTT

28

VFLGA

SQUARE

UNSPECIFIED

YES

1

7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-XBGA-B28

.5 mm

2.4 mm

NOT SPECIFIED

NOT SPECIFIED

3.67 mm

TC35675XBG-001

Toshiba

TELECOM CIRCUIT

OTHER

BALL

52

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B52

1.2 mm

4.5 mm

NOT SPECIFIED

NOT SPECIFIED

4.5 mm

TA1243BF

Toshiba

COMMERCIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

83.5 mA

5,33

SMALL OUTLINE, SHRINK PITCH

SOP24,.3,40

Other Telecom ICs

1 mm

70 Cel

-20 Cel

DUAL

R-PDSO-G24

Not Qualified

TA31133FN-TP2

Toshiba

TELECOM CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.6 mA

3.5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

5 mm

TODX295

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

10

RECTANGULAR

UNSPECIFIED

NO

1

5 V

FIBER OPTIC

85 Cel

-40 Cel

UNSPECIFIED

R-XXFO-X10

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

TA31081F(ER)

Toshiba

TELECOM CIRCUIT

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6.2 mA

5 V

SMALL OUTLINE, SHRINK PITCH

1 mm

85 Cel

-35 Cel

TIN LEAD

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

e0

8.2 mm

TA1372FNG

Toshiba

COMMERCIAL

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

51 mA

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP16,.25

Other Telecom ICs

.635 mm

70 Cel

-20 Cel

DUAL

R-PDSO-G16

Not Qualified

TC35167F

Toshiba

TELECOM CIRCUIT

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

1

FLATPACK, FINE PITCH

.5 mm

QUAD

S-PQFP-G208

4.45 mm

28 mm

Not Qualified

NOT SPECIFIED

240

28 mm

TMP3120FE3M

Toshiba

TC3567CFSG-002

Toshiba

TELECOM CIRCUIT

TC7761WBG

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BUTT

28

VFLGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CDMOS

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B28

.5 mm

2.4 mm

3.67 mm

JBT6N81SPI

Toshiba

TELECOM CIRCUIT

OTHER

CMOS

DIE OR CHIP

Other Telecom ICs

85 Cel

-20 Cel

Not Qualified

TC35679FSG-002

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.1 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N40

.9 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

TC35679FSG001

Toshiba

TELECOM CIRCUIT

TA31133FN(EL)

Toshiba

TELECOM CIRCUIT

OTHER

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.6 mA

3.5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G16

1.6 mm

4.4 mm

Not Qualified

5 mm

TC35670FTG-006

Toshiba

TELECOM CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

.9 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

TA31056F-(EL)

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

8.5 mA

3 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G8

1.9 mm

4.4 mm

Not Qualified

NOT SPECIFIED

240

5 mm

JBT6N81SZR

Toshiba

TELECOM CIRCUIT

OTHER

CMOS

DIE OR CHIP

Other Telecom ICs

85 Cel

-20 Cel

Not Qualified

TODX270A

Toshiba

TELECOM CIRCUIT

OTHER

UNSPECIFIED

10

RECTANGULAR

UNSPECIFIED

NO

1

5 V

FIBER OPTIC

70 Cel

-40 Cel

UNSPECIFIED

R-XXFO-X10

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

TOTX170A

Toshiba

TELECOM CIRCUIT

OTHER

UNSPECIFIED

6

RECTANGULAR

UNSPECIFIED

NO

1

5 V

FIBER OPTIC

70 Cel

-40 Cel

UNSPECIFIED

R-XXFO-X6

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

TC35681FSG-002(E1C

Toshiba

TC35676FTG-001

Toshiba

TELECOM CIRCUIT

TOLD387S-EADW

Toshiba

TC35661IDBG-503

Toshiba

TELECOM CIRCUIT

TOAD347-RXC

Toshiba

TC35661SBG-009

Toshiba

TELECOM CIRCUIT

TC35681IFTG-002

Toshiba

TELECOM CIRCUIT

TC7763WBG

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BUTT

28

VFLGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CDMOS

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B28

.5 mm

2.4 mm

3.67 mm

TA31081F-TP1

Toshiba

TELECOM CIRCUIT

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6.2 mA

5 V

SMALL OUTLINE, SHRINK PITCH

1 mm

85 Cel

-35 Cel

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

8.2 mm

TMP68661P

Toshiba

TODX294

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

10

RECTANGULAR

UNSPECIFIED

NO

1

5 V

FIBER OPTIC

85 Cel

-40 Cel

TIN LEAD

UNSPECIFIED

R-XXFO-X10

Not Qualified

e0

TC3567CFSG

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N40

.9 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

TA31080F-TP2

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6 V

SMALL OUTLINE, SHRINK PITCH

1 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G24

2.2 mm

6 mm

Not Qualified

e0

13 mm

TC35661IDBG-008

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1.4 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TA8104F

Toshiba

TELECOM CIRCUIT

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1 mA

1.4 V

SMALL OUTLINE, SHRINK PITCH

1 mm

85 Cel

-35 Cel

DUAL

R-PDSO-G16

1.9 mm

4.6 mm

Not Qualified

8.2 mm

TB32301AFL

Toshiba

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

36

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

.042 mA

3 V

3

CHIP CARRIER, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

70 Cel

-20 Cel

TIN LEAD

QUAD

S-PQCC-N36

.9 mm

6.21 mm

Not Qualified

e0

6.21 mm

TMP3120FE3U

Toshiba

TODX2700C(FANU2,F)

Toshiba

TELECOM CIRCUIT

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.