Toshiba Other Function Telecom Interface ICs 118

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TB31301F	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		20 mA	5 V	FLATPACK			.65 mm	75 Cel	-20 Cel		QUAD	S-PQFP-G64	3.15 mm	12 mm	Not Qualified				12 mm
TOAD347-RXB	Toshiba
TC35680FSG-002(E1C	Toshiba	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE		YES	1			3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N40	.9 mm	5 mm					5 mm
TA31135F(EL)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V	SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G30	2.7 mm	7.5 mm	Not Qualified				15.4 mm
TB31301F-TP1	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		20 mA	5 V	FLATPACK			.65 mm	75 Cel	-20 Cel		QUAD	S-PQFP-G64	3.15 mm	12 mm	Not Qualified				12 mm
TA8104F-TP2	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		1 mA	1.4 V	SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-35 Cel		DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified				8.2 mm
TC35661SBG-551(EL)	Toshiba	TELECOM CIRCUIT
TA31135F(ER)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V	SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G30	2.7 mm	7.5 mm	Not Qualified	e0			15.4 mm
TA7320P	Toshiba		OTHER		9			PLASTIC/EPOXY	NO		BIPOLAR				SIP9,.1	Other Telecom ICs	2.54 mm	70 Cel	-30 Cel	Tin/Lead (Sn/Pb)	SINGLE				Not Qualified	e0
TOPD347-RXB	Toshiba
TOTR370M-IRV1A	Toshiba
TC35667FTG-006	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40	.9 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
TODX297	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	10		RECTANGULAR	UNSPECIFIED	NO	1			5 V	FIBER OPTIC				85 Cel	-40 Cel		UNSPECIFIED	R-XXFO-X10			Not Qualified		NOT SPECIFIED	NOT SPECIFIED
TA31135F-TP2	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	30	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V	SMALL OUTLINE, SHRINK PITCH			1 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G30	2.7 mm	7.5 mm	Not Qualified				15.4 mm
TC35679IFTG-002	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1.1 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40	1 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
TOTR370M-IRV1B	Toshiba
TODX280	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	10		RECTANGULAR	UNSPECIFIED	NO	1			5 V	FIBER OPTIC				85 Cel	-40 Cel	TIN LEAD	UNSPECIFIED	R-XXFO-X10			Not Qualified	e0
TODX270	Toshiba	TELECOM CIRCUIT	OTHER	UNSPECIFIED	10		RECTANGULAR	UNSPECIFIED	NO	1			5 V	FIBER OPTIC				70 Cel	-40 Cel	TIN LEAD	UNSPECIFIED	R-XXFO-X10			Not Qualified	e0
TC3567DFSG-002	Toshiba	TELECOM CIRCUIT
TA31080N	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	24	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		18 mA	5 V	IN-LINE, SHRINK PITCH			1.778 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T24	4.5 mm	7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	22 mm
TMP68652P2	Toshiba
TA32032F	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V	SMALL OUTLINE, SHRINK PITCH			1 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16	1.9 mm	4.6 mm	Not Qualified	e0			8.2 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.