18 Telecom - Signaling ICs 21

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MT8870DSR1	Microchip Technology	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	9 mA	5 V	5	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G18		2.65 mm	7.5 mm	Not Qualified	e3			11.55 mm
MT8870DS-1	Gec Plessey Semiconductors	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G18		2.65 mm	7.493 mm	Not Qualified				11.55 mm
MT8870DS1	Microchip Technology	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	9 mA	5 V	5	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G18				Not Qualified
MT8870DSR1-1	Microsemi	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	9 mA	5 V	5	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G18		2.65 mm	7.5 mm	Not Qualified	e3			11.55 mm
MT8870DS1-1	Microsemi	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	9 mA	5 V	5	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G18		2.65 mm	7.5 mm	Not Qualified	e3			11.55 mm
HT9170D(18SOP)	Holtek Semiconductor	DTMF SIGNALING CIRCUIT	COMMERCIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			7 mA		3/5	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G18				Not Qualified
MT88L70ASR1	Microchip Technology	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5.5 mA	3 V	3	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G18		2.65 mm	7.5 mm	Not Qualified	e3			11.55 mm
HT9170D	Holtek Semiconductor	DTMF SIGNALING CIRCUIT	COMMERCIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	7 mA		3/5	SMALL OUTLINE	SO18(UNSPEC)	Telecom Signaling Circuits		70 Cel	-20 Cel		DUAL	R-PDSO-G18				Not Qualified
MT8870DS	Microchip Technology	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	9 mA	5 V	5	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G18		2.65 mm	7.5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	11.55 mm
MT88L70AS1	Microchip Technology	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5.5 mA	3 V	3	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G18		2.65 mm	7.5 mm	Not Qualified	e3			11.55 mm
MT88L70AE1	Microsemi	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	5.5 mA	3 V	3	IN-LINE	DIP18,.3	Telecom Signaling Circuits	2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDIP-T18		5.33 mm	7.62 mm	Not Qualified	e3			22.86 mm
MT88L70AS	Microsemi	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	5.5 mA	3 V	3	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G18				Not Qualified
M-8870-01SM	IXYS Corporation	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	7 mA	5 V	5	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G18				Not Qualified
75T203-IP	Texas Instruments	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T18		5.08 mm	7.62 mm	Not Qualified				22.987 mm
TC35302P	Toshiba	DTMF SIGNALING CIRCUIT		THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS				IN-LINE						TIN LEAD	DUAL	R-PDIP-T18				Not Qualified	e0
TC35300BP	Toshiba	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS	.007 mA	5 V	5	IN-LINE	DIP18,.3	Telecom Signaling Circuits	2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDIP-T18				Not Qualified	e0
TC35301BP	Toshiba	DTMF SIGNALING CIRCUIT		THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS				IN-LINE						TIN LEAD	DUAL	R-PDIP-T18				Not Qualified	e0
KT3170	Samsung	DTMF SIGNALING CIRCUIT		THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm				DUAL	R-PDIP-T18		5.08 mm	7.62 mm	Not Qualified				22.95 mm
KT3170N	Samsung	DTMF SIGNALING CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.009 mA	5 V	5	IN-LINE	DIP18,.3	Telecom Signaling Circuits	2.54 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDIP-T18		5.08 mm	7.62 mm	Not Qualified	e0			22.95 mm
S5T3170X01-D0B0	Samsung	DTMF SIGNALING CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.009 mA	5 V	5	IN-LINE	DIP18,.3	Telecom Signaling Circuits	2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T18	1	5.08 mm	7.62 mm	Not Qualified				22.95 mm
KT3170J	Samsung	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	CERAMIC	NO		CMOS	9 mA	5 V	5	IN-LINE	DIP18,.3	Telecom Signaling Circuits	2.54 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T18				Not Qualified	e0

Telecom - Signaling ICs

Telecom Signaling ICs are electronic components used in telecommunications systems to encode and decode signaling messages used to control and manage the network. These ICs are designed to provide reliable and efficient signaling capabilities, allowing for the efficient operation and management of telecommunication systems.

Telecom Signaling ICs are responsible for generating and interpreting signaling messages, which are used to control call setup, routing, and network management functions. They use various signaling protocols, such as Signaling System 7 (SS7), to encode and decode these messages.

Some common features of Telecom Signaling ICs include:

1. Signaling protocol support: Signaling ICs support various signaling protocols, allowing them to be used in a wide range of telecommunication systems.

2. Signal processing: Signaling ICs are designed to process signals quickly and efficiently, ensuring fast and reliable communication.

3. Error detection and correction: Signaling ICs use error detection and correction techniques to ensure that signaling messages are transmitted and received correctly.

4. Compatibility: Signaling ICs are designed to be compatible with various telecommunication systems, allowing them to be easily integrated into existing networks.

Telecom Signaling ICs are used in a variety of telecommunications systems, including voice and data networks, cellular networks, and IP-based networks. They are also used in network management systems, allowing for the efficient control and management of network resources.