DTMF SIGNALING CIRCUIT Telecom - Signaling ICs 41

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MT8870DSR1	Microchip Technology	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	9 mA	5 V	5	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G18		2.65 mm	7.5 mm	Not Qualified	e3			11.55 mm
MT8870DS-1	Gec Plessey Semiconductors	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G18		2.65 mm	7.493 mm	Not Qualified				11.55 mm
MT8870DS1	Microchip Technology	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	9 mA	5 V	5	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G18				Not Qualified
MT8870DSR1-1	Microsemi	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	9 mA	5 V	5	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G18		2.65 mm	7.5 mm	Not Qualified	e3			11.55 mm
MT8870DS1-1	Microsemi	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	9 mA	5 V	5	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G18		2.65 mm	7.5 mm	Not Qualified	e3			11.55 mm
HT9170D(18SOP)	Holtek Semiconductor	DTMF SIGNALING CIRCUIT	COMMERCIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			7 mA		3/5	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G18				Not Qualified
MT8888CS-1	Mitel Semiconductor	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	11 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G20				Not Qualified	e0
MT8888CS1	Microchip Technology	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	10 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified	e3			12.8 mm
MT88L70ASR1	Microchip Technology	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5.5 mA	3 V	3	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G18		2.65 mm	7.5 mm	Not Qualified	e3			11.55 mm
HT9170D	Holtek Semiconductor	DTMF SIGNALING CIRCUIT	COMMERCIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	7 mA		3/5	SMALL OUTLINE	SO18(UNSPEC)	Telecom Signaling Circuits		70 Cel	-20 Cel		DUAL	R-PDSO-G18				Not Qualified
MT8870DS	Microchip Technology	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	9 mA	5 V	5	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G18		2.65 mm	7.5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	11.55 mm
MT88L70AS1	Microchip Technology	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5.5 mA	3 V	3	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G18		2.65 mm	7.5 mm	Not Qualified	e3			11.55 mm
CM88L70TS	California Micro Devices	DTMF SIGNALING CIRCUIT	COMMERCIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	5 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	Telecom Signaling Circuits	.65 mm	70 Cel	0 Cel		DUAL	R-PDSO-G20		1.2 mm	4.4 mm	Not Qualified				6.5 mm
MT88L70AE1	Microsemi	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	5.5 mA	3 V	3	IN-LINE	DIP18,.3	Telecom Signaling Circuits	2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDIP-T18		5.33 mm	7.62 mm	Not Qualified	e3			22.86 mm
MT88L70AN	Microsemi	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	5.5 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Telecom Signaling Circuits	.635 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20				Not Qualified
MT88L70AN1	Microchip Technology	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	5.5 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Telecom Signaling Circuits	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified	e3			7.2 mm
MT88L70ANR1	Microchip Technology	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	5.5 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Telecom Signaling Circuits	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified	e3			7.2 mm
MT88L70AS	Microsemi	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	5.5 mA	3 V	3	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G18				Not Qualified
MC145436AP	Motorola	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	8 mA	5 V	5	IN-LINE	DIP14,.3	Telecom Signaling Circuits	2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDIP-T14		4.69 mm	7.62 mm	Not Qualified	e0			18.86 mm
M-8870-01SM	IXYS Corporation	DTMF SIGNALING CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	7 mA	5 V	5	SMALL OUTLINE	SOP18,.4	Telecom Signaling Circuits	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G18				Not Qualified
TC35305F	Toshiba	DTMF SIGNALING CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS				SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL	R-PDSO-G14		1.9 mm	5.3 mm	Not Qualified	e0			10.3 mm
75T201-IP	Texas Instruments	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	22	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			12 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T22		5.08 mm	10.16 mm	Not Qualified				27.686 mm
75T203-IP	Texas Instruments	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T18		5.08 mm	7.62 mm	Not Qualified				22.987 mm
75T2091-IP	Texas Instruments	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T28		5.588 mm	15.24 mm	Not Qualified				35.941 mm
MC145740F	NXP Semiconductors	DTMF SIGNALING CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	SMALL OUTLINE	SOP20,.3	Telecom Signaling Circuits	1.27 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDSO-G20		2 mm	5.25 mm	Not Qualified	e0			12.675 mm
TC35302P	Toshiba	DTMF SIGNALING CIRCUIT		THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS				IN-LINE						TIN LEAD	DUAL	R-PDIP-T18				Not Qualified	e0
TC35300BP	Toshiba	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS	.007 mA	5 V	5	IN-LINE	DIP18,.3	Telecom Signaling Circuits	2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDIP-T18				Not Qualified	e0
TC35301BP	Toshiba	DTMF SIGNALING CIRCUIT		THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS				IN-LINE						TIN LEAD	DUAL	R-PDIP-T18				Not Qualified	e0
TC35305P	Toshiba	DTMF SIGNALING CIRCUIT		THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	MOS				IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T14			7.62 mm	Not Qualified	e0			19.25 mm
TC35311F	Toshiba	DTMF SIGNALING CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS				SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL	R-PDSO-G20		1.8 mm	5.3 mm	Not Qualified	e0			12.8 mm
TC35310F	Toshiba	DTMF SIGNALING CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS				SMALL OUTLINE			1.27 mm			Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G20		1.8 mm	5.3 mm	Not Qualified	e0			12.8 mm
TC35302F	Toshiba	DTMF SIGNALING CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	MOS				SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL	R-PDSO-G20		1.8 mm	5.3 mm	Not Qualified	e0			12.8 mm
HD81806RP	Renesas Electronics	DTMF SIGNALING CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	75 Cel	-20 Cel		DUAL	R-PDIP-T40		5.06 mm	15.24 mm	Not Qualified				52.8 mm
HD81806RCP	Renesas Electronics	DTMF SIGNALING CIRCUIT	COMMERCIAL EXTENDED	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER			1.27 mm	75 Cel	-20 Cel		QUAD	S-PQCC-J44		4.6 mm	16.58 mm	Not Qualified				16.58 mm
HD81806RPW	Renesas Electronics	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T40		5.06 mm	15.24 mm	Not Qualified				52.8 mm
HD81806RCPW	Renesas Electronics	DTMF SIGNALING CIRCUIT	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel		QUAD	S-PQCC-J44		4.6 mm	16.58 mm	Not Qualified				16.58 mm
KT3170	Samsung	DTMF SIGNALING CIRCUIT		THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm				DUAL	R-PDIP-T18		5.08 mm	7.62 mm	Not Qualified				22.95 mm
KT3170N	Samsung	DTMF SIGNALING CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.009 mA	5 V	5	IN-LINE	DIP18,.3	Telecom Signaling Circuits	2.54 mm	75 Cel	-25 Cel	TIN LEAD	DUAL	R-PDIP-T18		5.08 mm	7.62 mm	Not Qualified	e0			22.95 mm
S5T3170X01-S0B0	Samsung	DTMF SIGNALING CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.009 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Telecom Signaling Circuits	1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified				12.8 mm
S5T3170X01-D0B0	Samsung	DTMF SIGNALING CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.009 mA	5 V	5	IN-LINE	DIP18,.3	Telecom Signaling Circuits	2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T18	1	5.08 mm	7.62 mm	Not Qualified				22.95 mm
KT3170J	Samsung	DTMF SIGNALING CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	CERAMIC	NO		CMOS	9 mA	5 V	5	IN-LINE	DIP18,.3	Telecom Signaling Circuits	2.54 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T18				Not Qualified	e0

Telecom - Signaling ICs

Telecom Signaling ICs are electronic components used in telecommunications systems to encode and decode signaling messages used to control and manage the network. These ICs are designed to provide reliable and efficient signaling capabilities, allowing for the efficient operation and management of telecommunication systems.

Telecom Signaling ICs are responsible for generating and interpreting signaling messages, which are used to control call setup, routing, and network management functions. They use various signaling protocols, such as Signaling System 7 (SS7), to encode and decode these messages.

Some common features of Telecom Signaling ICs include:

1. Signaling protocol support: Signaling ICs support various signaling protocols, allowing them to be used in a wide range of telecommunication systems.

2. Signal processing: Signaling ICs are designed to process signals quickly and efficiently, ensuring fast and reliable communication.

3. Error detection and correction: Signaling ICs use error detection and correction techniques to ensure that signaling messages are transmitted and received correctly.

4. Compatibility: Signaling ICs are designed to be compatible with various telecommunication systems, allowing them to be easily integrated into existing networks.

Telecom Signaling ICs are used in a variety of telecommunications systems, including voice and data networks, cellular networks, and IP-based networks. They are also used in network management systems, allowing for the efficient control and management of network resources.