LFQFP Telecom - Switching ICs 85

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

KSZ8863RLLI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

e3

7 mm

KSZ8863RLLI-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

e3

7 mm

KSZ8795CLXIC

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.47SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G80

3

1.6 mm

10 mm

e3

30

260

10 mm

KSZ8863RLL

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

e3

7 mm

KSZ8873RLLI

Microchip Technology

LAN SWITCHING CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e3

30

260

10 mm

KSZ8863MLLI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

e3

260

7 mm

KSZ8873RLLI-TR

Microchip Technology

LAN SWITCHING CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

12 mm

e3

30

260

12 mm

KSZ8863MLL

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

e3

7 mm

KSZ8863MLLI-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

1.6 mm

7 mm

e3

7 mm

KSZ8873MLLI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

Internal 1.8V LDO

e3

30

260

10 mm

KSZ8463MLI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

e3

10 mm

KSZ8795CLXCC

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.47SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G80

3

1.6 mm

10 mm

e3

30

260

10 mm

KSZ8863RLL-TR

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G48

1.6 mm

7 mm

e3

7 mm

KSZ8863FLLI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

1.6 mm

7 mm

e3

7 mm

KSZ8463RLI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

e3

10 mm

KSZ8863FLLI-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

1.6 mm

7 mm

e3

7 mm

KSZ8873MLLI-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

Internal 1.8V LDO

e3

30

260

10 mm

KSZ8462HLI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

e3

10 mm

KSZ8873MLL

Microchip Technology

LAN SWITCHING CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

1.8 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

e3

30

260

10 mm

KSZ8895MLXI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

1.2 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.6 mm

14 mm

e3

14 mm

KSZ8873RLL

Microchip Technology

LAN SWITCHING CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

e3

30

260

10 mm

KSZ8463FRLI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

e3

10 mm

KSZ8863FLL

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G48

1.6 mm

7 mm

e3

7 mm

KSZ8873MMLI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e3

10 mm

KSZ8873FLLI

Microchip Technology

LAN SWITCHING CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

e3

30

260

10 mm

KSZ8895MLXI-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.6 mm

14 mm

e3

14 mm

KSZ8463MLI-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

e3

10 mm

KSZ8863FLL-TR

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G48

1.6 mm

7 mm

e3

7 mm

KSZ8895MLUB

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

1.2 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.6 mm

14 mm

e3

14 mm

KSZ8873MML

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e3

10 mm

KSZ8895MLUB-TR

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

1.2 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.6 mm

14 mm

e3

14 mm

KSZ8873MLLAM-TR

Microchip Technology

LAN SWITCHING CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

12 mm

30

260

12 mm

KSZ8463FMLI

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

e3

10 mm

KSZ8873MLLAM

Microchip Technology

LAN SWITCHING CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

1.8 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

30

260

10 mm

KSZ8765CLXCC

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.47SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G80

1.6 mm

10 mm

e3

10 mm

KSZ8873RLLU

Microchip Technology

LAN SWITCHING CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

30

260

10 mm

KSZ8873FLL

Microchip Technology

LAN SWITCHING CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

e3

30

260

10 mm

KSZ8765CLXIC

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.47SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G80

1.6 mm

10 mm

e3

10 mm

KSZ8775CLXIC

Microchip Technology

ETHERNET SWITCH

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

1.2 V

FLATPACK, LOW PROFILE, FINE PITCH

SPQFP80,.48SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G80

1.6 mm

10 mm

e3

10 mm

IDT72V70210DAG

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G144

3

1.6 mm

20 mm

Not Qualified

e3

20 mm

ZL50011/QCC

Microchip Technology

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

160

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

250 mA

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP160,1.0SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G160

1.6 mm

24 mm

Not Qualified

e0

24 mm

ZL50020QCG1

Microchip Technology

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

256

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

120 mA

1.8 V

1.8,3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP256,1.2SQ,16

Other Telecom ICs

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G256

1.6 mm

28 mm

Not Qualified

e3

28 mm

ZL50022QCG1

Microchip Technology

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

256

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

175 mA

1.8 V

1.8,3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP256,1.2SQ,16

Other Telecom ICs

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G256

1.6 mm

28 mm

Not Qualified

e3

28 mm

ZL50023QCG1

Microchip Technology

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

256

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

130 mA

1.8 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP256,1.2SQ,16

.4 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G256

1.6 mm

28 mm

28 mm

72V70200PFG8

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.01 mA

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQFP-G100

3

1.6 mm

14 mm

Not Qualified

e3

30

260

14 mm

IDT72V70200PFG8

Renesas Electronics

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

1.6 mm

14 mm

Not Qualified

e3

14 mm

KSZ8775CLXCC

Microchip Technology

ETHERNET SWITCH

COMMERCIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

1.2 V

FLATPACK, LOW PROFILE, FINE PITCH

SPQFP80,.48SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G80

1.6 mm

10 mm

e3

10 mm

ZL50012QCG1

Microchip Technology

DIGITAL TIME SWITCH

INDUSTRIAL

GULL WING

160

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

250 mA

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP160,1.0SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G160

1.6 mm

24 mm

Not Qualified

e3

24 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.