ETHERNET SWITCH Telecom - Switching ICs 179

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
1085255	Phoenix Contact	ETHERNET SWITCH
KSZ8864CNXCA-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm			e3	30	260	8 mm
KSZ8993ML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ8995FQ	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		230 mA	1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3			20 mm
KSZ8873MML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified		e3			10 mm
KSZ8895MLUB-TR	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.6 mm	14 mm			e3			14 mm
KSZ8563RNXV-VAO	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N64		.9 mm	8 mm						8 mm
LAN9354TI/ML	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	1 mm	8 mm		integrated 1.2V regulator	e3	30	260	8 mm
KSZ8995X	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		375 mA	1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ8864RMNUB-TR	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100; TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm		SEATED HT-CALCULATED	e3			8 mm
KSZ8852HLEWA	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm			e3			10 mm
KSZ8993MLI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	R-PQFP-G128	3	3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ8463FMLI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm			e3			10 mm
KSZ8864RMNUB	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100; TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	.9 mm	8 mm		SEATED HT-CALCULATED	e3	40	260	8 mm
LAN9303M-AKZE-CAG	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20		.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N72		1 mm	10 mm						10 mm
LAN9354/ML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	1 mm	8 mm		integrated 1.2V regulator	e3	30	260	8 mm
KSZ8765CLXCC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.47SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G80		1.6 mm	10 mm			e3			10 mm
KSZ8864RMNI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm		SEATED HT-CALCULATED	e3	30	260	8 mm
LAN9354T/ML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	1 mm	8 mm		integrated 1.2V regulator	e3	30	260	8 mm
KSZ8864RMNUB-VAO	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm		SEATED HT-CALCULATED	e3	30	260	8 mm
KSZ8864CNXC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm		SEATED HT-CALCULATED	e3	30	260	8 mm
VSC7420XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7428XJG-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2100 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
KSZ8765CLXIC	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.47SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G80		1.6 mm	10 mm			e3			10 mm
KSZ8864CNXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm		SEATED HT-CALCULATED	e3		260	8 mm
KSZ8775CLXIC	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	TS 16949		1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	SPQFP80,.48SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G80		1.6 mm	10 mm			e3			10 mm
KS8995MAI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		230 mA	1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	85 Cel	-40 Cel		QUAD	R-PQFP-G128		3.4 mm	14 mm				NOT SPECIFIED	NOT SPECIFIED	20 mm
KSZ8565RTXV-VAO	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G128		1.2 mm	14 mm				30	260	14 mm
VSC7422XJQ-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	GULL WING	302	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.6 mA	1 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP302,.1SQ		.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G302		1.2 mm	24 mm						24 mm
GSW125-AQM-T	Maxlinear	ETHERNET SWITCH
LAN9312-NZW	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	295 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	HQFP128,.63SQ,16	Network Interfaces	.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.2 mm	14 mm	Not Qualified		e3			14 mm
LAN9355I/ML	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.5SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N88		1 mm	12 mm				NOT SPECIFIED	NOT SPECIFIED	12 mm
KSZ8565RTXV-TRVAO	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G128		1.2 mm	14 mm				30	260	14 mm
VSC7425XJG-02	Microchip Technology	ETHERNET SWITCH	OTHER	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2700 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	0 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7423XJG-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2000 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.36 mm	27 mm						27 mm
VSC7514XKS	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1800 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.8 mm	17 mm						17 mm
LAN9355/ML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.5SQ,20		.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N88		1 mm	12 mm				NOT SPECIFIED	NOT SPECIFIED	12 mm
LAN9355/PT	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm				NOT SPECIFIED	NOT SPECIFIED	12 mm
KSZ8893FQL	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ8893FQL-FX	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified		e3			20 mm
VSC7440XMT	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3300 mA	1 V		GRID ARRAY	BGA324,18X18,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B324		1.8 mm	19 mm						19 mm
KSZ8775CLXCC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	TS 16949		1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	SPQFP80,.48SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G80		1.6 mm	10 mm			e3			10 mm
VSC7422XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.6 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
ARWSC-XRS7003E	Tttech Flexibilis Oy	ETHERNET SWITCH		NO LEAD	144	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20		.5 mm	100 Cel	-40 Cel		QUAD	S-PQFP-G144		1.65 mm	20 mm						20 mm
SJA1105REL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159		1.5 mm	12 mm						12 mm
SJA1105SEL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159		1.5 mm	12 mm						12 mm
VSC7424XJG-02	Microchip Technology	ETHERNET SWITCH		BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2000 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.36 mm	27 mm						27 mm
VSC7428XJG-12	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2100 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.