ETHERNET SWITCH Telecom - Switching ICs 179

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
VSC7448YIH-02	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			7600 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.71 mm	27 mm						27 mm
C9300L-24P-4X-A	Cisco Systems	ETHERNET SWITCH								1
GSW141A3MC	Maxlinear	ETHERNET SWITCH
KSZ8993	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			330 mA	2.5 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified		e3			20 mm
LAN9311I-NZW	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949	295 mA	3.3 V	3.3/3.6	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	Network Interfaces	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.2 mm	14 mm	Not Qualified		e3			14 mm
KSZ8895FQXC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	R-PQFP-G128		3.4 mm	14 mm				NOT SPECIFIED	NOT SPECIFIED	20 mm
VSC7421XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.6 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7546TSN-V/5CC-VAO	Microchip Technology	ETHERNET SWITCH		BALL	888	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		.9 V		GRID ARRAY, FINE PITCH	BGA888,30X30,32		.8 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B888		2.806 mm	24.6 mm						24.6 mm
VSC7513XKS	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1800 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.8 mm	17 mm						17 mm
BCM53125B0MKMMLG	Broadcom	ETHERNET SWITCH		UNSPECIFIED	186		SQUARE	UNSPECIFIED		1													UNSPECIFIED	S-XXSS-X	3							260
BCM88690CB1KFSBG	Broadcom	ETHERNET SWITCH		BALL	4344	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY	BGA4344,66X66,40		1 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	S-PBGA-B4344		5.64 mm	67.5 mm			e1			67.5 mm
GSW120A3MC	Maxlinear	ETHERNET SWITCH
KSZ8462FHLI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm			e3			10 mm
KSZ8852HLEYA	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	115 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm			e3			10 mm
KSZ8895MLXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.6 mm	14 mm			e3			14 mm
VSC7420XJG-02	Microchip Technology	ETHERNET SWITCH	OTHER	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	0 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7427XJG-02	Microchip Technology	ETHERNET SWITCH	OTHER	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2700 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	0 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
VSC7436XMT	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3300 mA	1 V		GRID ARRAY	BGA324,18X18,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B324		1.8 mm	19 mm						19 mm
VSC7449YIH-02	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			8100 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.71 mm	27 mm						27 mm
VSC7468YIH-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			8600 mA	1 V		GRID ARRAY			1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.71 mm	27 mm						27 mm
SJA1105PEL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159		1.5 mm	12 mm						12 mm
SJA1105QEL	NXP Semiconductors	ETHERNET SWITCH	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159		1.5 mm	12 mm						12 mm
SJA1110BEL/0Y	NXP Semiconductors	ETHERNET SWITCH		BALL	256	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		ISO 26262; AEC-Q100		1.8 V		GRID ARRAY							BOTTOM	R-PBGA-B256	3				ALSO OPERATES WITH NOMINAL 2.5V AND 3.3V SUPPLY			260
SJA1110CEL/0Y	NXP Semiconductors	ETHERNET SWITCH		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262		1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32		.8 mm				BOTTOM	S-PBGA-B256	3	1.5 mm	14 mm		ALSO OPERATES WITH 2.5V AND 3.3V NOMINAL SUPPLY			260	14 mm
BCM56784A0KFSBG	Broadcom	ETHERNET SWITCH		BALL	3315	BGA	SQUARE	PLASTIC/EPOXY	YES	1			236470 mA	.75 V		GRID ARRAY	BGA3315,62X107,40		1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B3315		4.181 mm	55 mm						55 mm
BCM56072A0KFSBG	Broadcom	ETHERNET SWITCH		BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		23846.4 mA	.88 V		GRID ARRAY, FINE PITCH	BGA896,30X30,32		.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B896		2.768 mm	25 mm			e1			25 mm
BCM88850	Broadcom	ETHERNET SWITCH																				Nickel/Palladium/Gold (Ni/Pd/Au)								e4
BCM88790	Broadcom	ETHERNET SWITCH	COMMERCIAL
BCM56990	Broadcom	ETHERNET SWITCH		NO LEAD	8371	LGA	RECTANGULAR	UNSPECIFIED	YES	1				.75 V		GRID ARRAY	BGA8371,98X170,35		.9 mm	70 Cel	0 Cel		BOTTOM	R-XBGA-N8371		5.138 mm	77.5 mm						77.8 mm
BCM56780A0KFSBG	Broadcom	ETHERNET SWITCH		BALL	3315	BGA	SQUARE	PLASTIC/EPOXY	YES	1			246610 mA	.75 V		GRID ARRAY	BGA3315,62X107,40		1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B3315		4.181 mm	55 mm						55 mm
BCM56071NA0KFSBG	Broadcom	ETHERNET SWITCH		BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		23846.4 mA	.88 V		GRID ARRAY, FINE PITCH	BGA896,30X30,32		.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B896		2.768 mm	25 mm			e1			25 mm
BCM5395MKFBG	Broadcom	ETHERNET SWITCH								1	CMOS
BCM56636B0KFSBG	Broadcom	ETHERNET SWITCH
BCM88375CB0IFSBG	Broadcom	ETHERNET SWITCH
BCM89200	Broadcom	ETHERNET SWITCH		GULL WING	176	QFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949				FLATPACK							QUAD	S-PQFP-G176

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.