SDIP Telephone Line ICs 20

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	Crystal Frequency (MHz)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Make-break Ratio	Length
MC33215B	NXP Semiconductors	TELEPHONE SPEECH CIRCUIT	COMMERCIAL	THROUGH-HOLE	42	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE, SHRINK PITCH			1.778 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDIP-T42	1	5.08 mm	15.24 mm	Not Qualified			e0				36.83 mm
TEA1069N	NXP Semiconductors	TELEPHONE MULTIFUNCTION CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	42	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	.0018 mA	2.7 V	3	IN-LINE, SHRINK PITCH	SDIP42,.6	Telephone Circuits	1.778 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T42	1	5.08 mm	15.24 mm	Not Qualified	3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT					2:1	38.65 mm
TA31037N	Toshiba	TELEPHONE SPEECH CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	24	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		14.3 mA	5 V		IN-LINE, SHRINK PITCH			1.778 mm	75 Cel	-20 Cel		DUAL	R-PDIP-T24		4.5 mm	7.62 mm	Not Qualified							22 mm
TA31063N	Toshiba	TELEPHONE SPEECH CIRCUIT	COMMERCIAL	THROUGH-HOLE	30	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE, SHRINK PITCH			1.778 mm	60 Cel	-20 Cel		DUAL	R-PDIP-T30		4.45 mm	10.16 mm	Not Qualified							27.4 mm
TA31066N	Toshiba	TELEPHONE SPEECH CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE, SHRINK PITCH			1.778 mm	70 Cel	-20 Cel		DUAL	R-PDIP-T24		4.5 mm	7.62 mm	Not Qualified							22 mm
TA31065N	Toshiba	TELEPHONE SPEECH CIRCUIT	OTHER	THROUGH-HOLE	20	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE, SHRINK PITCH			1.778 mm	70 Cel	-30 Cel		DUAL	R-PDIP-T20		4.5 mm	7.62 mm	Not Qualified							18.6 mm
TA31062N	Toshiba	TELEPHONE SPEECH CIRCUIT	COMMERCIAL	THROUGH-HOLE	36	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE, SHRINK PITCH			1.778 mm	60 Cel	-20 Cel		DUAL	R-PDIP-T36		4.5 mm	12.7 mm	Not Qualified				NOT SPECIFIED	240		32.8 mm
TA31050N	Toshiba	SPEAKER PHONE CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	42	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		25 mA	5 V		IN-LINE, SHRINK PITCH			1.778 mm	75 Cel	-30 Cel	TIN LEAD	DUAL	R-PDIP-T42		4.5 mm	15.24 mm	Not Qualified			e0				38 mm
TA31025N	Toshiba	TELEPHONE SPEECH CIRCUIT	OTHER	THROUGH-HOLE	24	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE, SHRINK PITCH			1.778 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDIP-T24		4.5 mm	7.62 mm	Not Qualified			e0				22 mm
TA31024N	Toshiba	TELEPHONE SPEECH CIRCUIT	OTHER	THROUGH-HOLE	24	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE, SHRINK PITCH			1.778 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDIP-T24		4.5 mm	7.62 mm	Not Qualified			e0				22 mm
KA8601	Samsung	TELEPHONE SPEECH CIRCUIT		THROUGH-HOLE	48	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE, SHRINK PITCH			1.778 mm				DUAL	R-PDIP-T48		5.08 mm	15.24 mm	Not Qualified							42.47 mm
KS58C21P	Samsung		COMMERCIAL	THROUGH-HOLE	22	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	.001 mA	3.5 V	3.5	IN-LINE, SHRINK PITCH	SDIP22,.3	Telephone Circuits	1.78 mm	70 Cel	-20 Cel		DUAL	R-PDIP-T22				Not Qualified		3.58
KS58A21P	Samsung		COMMERCIAL	THROUGH-HOLE	22	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	.001 mA	3.5 V	3.5	IN-LINE, SHRINK PITCH	SDIP22,.3	Telephone Circuits	1.78 mm	70 Cel	-20 Cel		DUAL	R-PDIP-T22				Not Qualified		3.58
KS58B19P	Samsung		COMMERCIAL	THROUGH-HOLE	22	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	.001 mA	3.5 V	3.5	IN-LINE, SHRINK PITCH	SDIP22,.3	Telephone Circuits	1.78 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDIP-T22	3			Not Qualified		3.58	e0
KS58D19P	Samsung		COMMERCIAL	THROUGH-HOLE	22	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	.001 mA	3.5 V	3.5	IN-LINE, SHRINK PITCH	SDIP22,.3	Telephone Circuits	1.78 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDIP-T22	3			Not Qualified		3.58	e0
KA8601C	Samsung	TELEPHONE SPEECH CIRCUIT	OTHER	THROUGH-HOLE	48	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.008 mA	5 V	5	IN-LINE, SHRINK PITCH	SDIP48,.6	Other Telecom ICs	1.778 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T48		5.08 mm	15.24 mm	Not Qualified							42.47 mm
KS58D21P	Samsung		COMMERCIAL	THROUGH-HOLE	22	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	.001 mA	3.5 V	3.5	IN-LINE, SHRINK PITCH	SDIP22,.3	Telephone Circuits	1.78 mm	70 Cel	-20 Cel		DUAL	R-PDIP-T22				Not Qualified		3.58
KS58C19P	Samsung		COMMERCIAL	THROUGH-HOLE	22	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	.001 mA	3.5 V	3.5	IN-LINE, SHRINK PITCH	SDIP22,.3	Telephone Circuits	1.78 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDIP-T22	3			Not Qualified		3.58	e0
KS58A19P	Samsung		COMMERCIAL	THROUGH-HOLE	22	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	.001 mA	3.5 V	3.5	IN-LINE, SHRINK PITCH	SDIP22,.3	Telephone Circuits	1.78 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDIP-T22	3			Not Qualified		3.58	e0
KS58B21P	Samsung		COMMERCIAL	THROUGH-HOLE	22	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	.001 mA	3.5 V	3.5	IN-LINE, SHRINK PITCH	SDIP22,.3	Telephone Circuits	1.78 mm	70 Cel	-20 Cel		DUAL	R-PDIP-T22				Not Qualified		3.58

Telephone Line ICs

Telephone Line ICs are electronic components used in telephone systems to interface with the telephone line and provide necessary functionality for telephone communication. These ICs are designed to provide reliable and efficient operation of the telephone line, allowing for clear and uninterrupted communication between two devices.

Telephone Line ICs use various techniques to interface with the telephone line, including pulse dialing, dual-tone multi-frequency (DTMF) signaling, and loop current sensing. Pulse dialing is used to send a series of electrical pulses over the telephone line to dial a phone number. DTMF signaling is used to send a sequence of tones to control various telephone functions, such as call forwarding and call waiting. Loop current sensing is used to detect the presence of a telephone off-hook condition, allowing the telephone system to provide appropriate signaling and call management.

Some common features of Telephone Line ICs include:

1. Telephone line interface: Telephone Line ICs provide the necessary interface with the telephone line to enable telephone communication.

2. Signal processing: Telephone Line ICs are designed to process signals quickly and efficiently, ensuring clear and uninterrupted communication.

3. Tone generation and detection: Telephone Line ICs can generate and detect various tones used for telephone communication, such as dial tones and busy signals.

4. Call management: Telephone Line ICs can provide call management functions, such as call waiting and call forwarding.

Telephone Line ICs are used in a variety of telephone systems, including traditional landline phones, cordless phones, and PBX (Private Branch Exchange) systems. They are also used in other communication systems that require telephone line interface, such as alarm systems and security systems.