NXP Semiconductors - TEA1069N

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TEA1069N by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TEA1069N
Description TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 42; Package Code: SDIP; Package Shape: RECTANGULAR;
Datasheet TEA1069N Datasheet
In Stock2,725
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.7 V
Maximum Seated Height: 5.08 mm
Sub-Category: Telephone Circuits
Surface Mount: NO
Maximum Supply Current: .0018 mA
No. of Terminals: 42
Terminal Position: DUAL
Package Style (Meter): IN-LINE, SHRINK PITCH
Technology: BIPOLAR
JESD-30 Code: R-PDIP-T42
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 75 Cel
Package Code: SDIP
Width: 15.24 mm
Moisture Sensitivity Level (MSL): 1
Telecom IC Type: TELEPHONE MULTIFUNCTION CIRCUIT
Minimum Operating Temperature: -25 Cel
Make-break Ratio: 2:1
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: SDIP42,.6
Length: 38.65 mm
Additional Features: 3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT
Terminal Pitch: 1.778 mm
Temperature Grade: COMMERCIAL EXTENDED
Power Supplies (V): 3
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