Part | RoHS | Manufacturer | Thermal Device Type | Profile | Body Material | Device Used On | Construction | Fin Orientation | Thermal Resistance | Approvals (V) | Height | Width | Finish | Diameter | Color | Additional Features | Packing Method | Weight | Length | Power (Rated) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Wakefield Thermal Solutions |
Heat Sink |
U |
Aluminium |
0.339 in (8.6 mm) |
0.252 in (6.4 mm) |
Anodized |
Black |
820 mg |
0.5 in (12.7 mm) |
||||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Transistor |
Extruded |
0.4 in (10.16 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
Tape and Reel, 13 in |
3.8 g |
1.02 in (25.91 mm) |
||||||||
|
Boyd |
Heat Sink |
U |
Aluminium |
Transistor |
Clip |
27.3 Ω |
0.75 in (19.05 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
0.57 in (14.48 mm) |
||||||||
|
Boyd |
Heat Sink |
Screw |
Aluminium |
Transistor |
Fin |
Transverse |
24 Ω |
0.38 in (9.65 mm) |
0.75 in (19.05 mm) |
Anodized |
Black |
Low Profile |
0.75 in (19.05 mm) |
||||||
|
Boyd |
Heat Sink |
U |
Aluminium |
Clip |
Transverse |
27.3 Ω |
0.75 in (19.05 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
0.57 in (14.48 mm) |
||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Aluminium |
Transistor |
18 Ω |
0.327 in (8.3 mm) |
0.984 in (25 mm) |
1.157 in (29.4 mm) |
||||||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Aluminium |
Transistor |
0.5 in (12.7 mm) |
0.571 in (14.5 mm) |
Anodized |
Black |
0.75 in (19.05 mm) |
|||||||||||
|
Boyd |
Heat Sink |
Aluminium |
IC |
Extruded |
Longitudinal |
17.4 Ω |
1 in (25.4 mm) |
0.64 in (16.26 mm) |
Anodized |
Black |
0.64 in (16.26 mm) |
||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Aluminium |
Transistor |
Fin |
0.5 in (12.7 mm) |
0.571 in (14.5 mm) |
Anodized |
Black |
0.75 in (19.05 mm) |
||||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
2 in (50.8 mm) |
0.984 in (25 mm) |
Anodized |
Black |
51 g |
1.654 in (42 mm) |
||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Clip |
27.3 Ω |
0.5 in (12.7 mm) |
0.57 in (14.48 mm) |
Anodized |
Black |
0.75 in (19.05 mm) |
||||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1 in (25.4 mm) |
0.984 in (25 mm) |
Anodized |
Black |
25 g |
1.654 in (42 mm) |
||||||||||
|
Wakefield-vette |
Heat Sink |
Aluminium |
Omnidirectional |
0.5 in (12.7 mm) |
1.811 in (46 mm) |
Anodized |
Black |
31.75 g |
1.811 in (46 mm) |
||||||||||
|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Transverse |
16.7 Ω |
1.18 in (29.97 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1 in (25.4 mm) |
||||||||
Ohmite Manufacturing |
Heat Sink |
Aluminium |
0.374 in (9.5 mm) |
0.52 in (13.2 mm) |
Anodized |
Black |
0.752 in (19.1 mm) |
|||||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
13.4 Ω |
1 in (25.4 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1.374 in (34.9 mm) |
|||||||||
|
Boyd |
Heat Sink |
Aluminium |
Slide On |
Folded Back |
21.2 Ω |
0.75 in (19.05 mm) |
0.39 in (9.9 mm) |
Anodized |
Black |
0.81 in (20.57 mm) |
|||||||||
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Flared |
Radial |
1.5 in (38.1 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
15.88 g |
1.374 in (34.9 mm) |
||||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1.5 in (38.1 mm) |
0.984 in (25 mm) |
Anodized |
Black |
38 g |
1.654 in (42 mm) |
||||||||||
|
Boyd |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.394 in (10 mm) |
1.063 in (27 mm) |
Anodized |
Black |
1.063 in (27 mm) |
|||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1.5 in (38.1 mm) |
0.984 in (25 mm) |
Anodized |
Black |
27 g |
1.638 in (41.6 mm) |
||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Fin |
Transverse |
0.75 in (19.05 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
0.52 in (13.21 mm) |
||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
3.7 Ω |
1.5 in (38.1 mm) |
1 in (25.4 mm) |
Anodized |
Black |
1.65 in (41.91 mm) |
|||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Longitudinal |
27.2 Ω |
0.19 in (4.83 mm) |
0.53 in (13.46 mm) |
Anodized |
Black |
2 in (50.8 mm) |
|||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Aluminium |
0.374 in (9.5 mm) |
0.531 in (13.5 mm) |
0.748 in (19 mm) |
||||||||||||||
|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.252 in (6.4 mm) |
0.827 in (21 mm) |
Anodized |
Black |
4.09 g |
0.827 in (21 mm) |
||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Adhesive |
Aluminium |
Pin Fin |
4.2 Ω |
0.394 in (10 mm) |
0.551 in (14 mm) |
0.551 in (14 mm) |
|||||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1 in (25.4 mm) |
0.984 in (25 mm) |
Anodized |
Black |
17.5 g |
1.638 in (41.6 mm) |
||||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Transistor |
Extruded |
Fin Pin |
0.4 in (10.16 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
Bulk |
3.8 g |
1.02 in (25.91 mm) |
|||||||
|
Boyd |
Heat Sink |
Aluminium |
Fin |
Folded Back |
4.4 Ω |
1.75 in (44.45 mm) |
0.95 in (24.13 mm) |
Anodized |
Black |
1.9 in (48.26 mm) |
|||||||||
|
Boyd |
Heat Sink |
Aluminium |
Transistor |
Extruded |
Radial |
3.3 Ω |
2 in (50.8 mm) |
1 in (25.4 mm) |
Anodized |
Black |
1.65 in (41.91 mm) |
||||||||
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Extruded |
0.949 in (24.1 mm) |
2.28 in (57.9 mm) |
Anodized |
Black |
2.402 in (61 mm) |
||||||||||||
|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Longitudinal |
32 Ω |
0.75 in (19.05 mm) |
0.25 in (6.35 mm) |
Anodized |
Black |
0.52 in (13.21 mm) |
||||||||
|
TE Connectivity |
Heat Sink |
Clip |
Aluminium |
IC |
Radial |
UL |
15 W |
||||||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
2.5 in (63.5 mm) |
0.984 in (25 mm) |
Anodized |
Black |
46 g |
1.638 in (41.6 mm) |
||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
13 Ω |
0.984 in (25 mm) |
0.492 in (12.5 mm) |
Anodized |
Black |
1.358 in (34.5 mm) |
|||||||||
|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Longitudinal |
15.6 Ω |
0.7 in (17.78 mm) |
0.375 in (9.52 mm) |
Anodized |
Black |
1.75 in (44.45 mm) |
||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
13.1 Ω |
1.1 in (27.94 mm) |
0.106 in (2.7 mm) |
Anodized |
Black |
0.787 in (20 mm) |
||||||||||
|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Transverse |
24.4 Ω |
0.75 in (19.05 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
0.52 in (13.21 mm) |
||||||||
|
Fischer Elektronik & Kg |
Heat Sink |
Adhesive |
Aluminium |
Omnidirectional |
3.2 Ω |
0.787 in (20 mm) |
1.433 in (36.4 mm) |
Thermal Resistance Min: 0.95 |
24 g |
1.433 in (36.4 mm) |
|||||||||
|
Boyd |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.709 in (18 mm) |
1.063 in (27 mm) |
Anodized |
Black |
1.063 in (27 mm) |
|||||||||
|
Boyd |
Heat Sink |
U |
Aluminium |
Fin |
Transverse |
25.9 Ω |
0.75 in (19.05 mm) |
0.375 in (9.52 mm) |
Anodized |
Black |
0.52 in (13.21 mm) |
||||||||
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
9.5 Ω |
1.5 in (38.1 mm) |
0.5 in (12.7 mm) |
Black Anodized |
Black |
Bulk |
18 g |
1.378 in (35 mm) |
|||||||||
Boyd |
Heat Sink |
Aluminium |
8.9 Ω |
0.748 in (19 mm) |
Anodized |
Black |
||||||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Clip |
11.5 Ω |
1.22 in (30.99 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
1 in (25.4 mm) |
||||||||||
|
TE Connectivity |
Heat Sink |
Clip |
Aluminium |
IC |
Radial |
UL |
15 W |
||||||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Longitudinal |
32 Ω |
0.19 in (4.83 mm) |
0.53 in (13.46 mm) |
Anodized |
Black |
1.45 in (36.83 mm) |
|||||||||
|
Boyd |
Heat Sink |
Aluminium |
Extruded |
Radial |
4.8 Ω |
2 in (50.8 mm) |
1 in (25.4 mm) |
Anodized |
Black |
1.65 in (41.91 mm) |
Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.
Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.
Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.
Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.
However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.